JP2006128360A - プリント配線板およびその製造方法 - Google Patents

プリント配線板およびその製造方法 Download PDF

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Publication number
JP2006128360A
JP2006128360A JP2004313814A JP2004313814A JP2006128360A JP 2006128360 A JP2006128360 A JP 2006128360A JP 2004313814 A JP2004313814 A JP 2004313814A JP 2004313814 A JP2004313814 A JP 2004313814A JP 2006128360 A JP2006128360 A JP 2006128360A
Authority
JP
Japan
Prior art keywords
layer
multilayer
base substrate
laminated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004313814A
Other languages
English (en)
Japanese (ja)
Inventor
Katsuhiko Takahashi
克彦 高橋
Koji Tsurusaki
幸司 鶴崎
Kazuyuki Dojo
数之 道場
Hirotoshi Yano
浩敏 谷野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2004313814A priority Critical patent/JP2006128360A/ja
Priority to TW094134841A priority patent/TW200631483A/zh
Priority to KR1020050101764A priority patent/KR100742679B1/ko
Priority to CNA200510118461XA priority patent/CN1767720A/zh
Publication of JP2006128360A publication Critical patent/JP2006128360A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2004313814A 2004-10-28 2004-10-28 プリント配線板およびその製造方法 Pending JP2006128360A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004313814A JP2006128360A (ja) 2004-10-28 2004-10-28 プリント配線板およびその製造方法
TW094134841A TW200631483A (en) 2004-10-28 2005-10-05 Printed wiring board and manufacturing method thereof
KR1020050101764A KR100742679B1 (ko) 2004-10-28 2005-10-27 프린트 배선판 및 그 제조 방법
CNA200510118461XA CN1767720A (zh) 2004-10-28 2005-10-28 印刷布线板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004313814A JP2006128360A (ja) 2004-10-28 2004-10-28 プリント配線板およびその製造方法

Publications (1)

Publication Number Publication Date
JP2006128360A true JP2006128360A (ja) 2006-05-18

Family

ID=36722754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004313814A Pending JP2006128360A (ja) 2004-10-28 2004-10-28 プリント配線板およびその製造方法

Country Status (4)

Country Link
JP (1) JP2006128360A (enExample)
KR (1) KR100742679B1 (enExample)
CN (1) CN1767720A (enExample)
TW (1) TW200631483A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113202A1 (ja) 2008-03-10 2009-09-17 イビデン株式会社 フレキシブル配線板及びその製造方法
JP2010232585A (ja) * 2009-03-30 2010-10-14 Toppan Printing Co Ltd 多層配線基板およびその製造方法
JP2011082317A (ja) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板及びこれを備える電子機器
US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
JP2015161975A (ja) * 2014-02-26 2015-09-07 レノボ・シンガポール・プライベート・リミテッド 引出構造、キーボードユニット及び携帯用情報機器
CN110913577A (zh) * 2019-12-24 2020-03-24 江苏弘信华印电路科技有限公司 一种六层软硬结合板的叠构结构

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754080B1 (ko) 2006-07-13 2007-08-31 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
KR100771310B1 (ko) 2006-08-22 2007-10-29 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
CN103327738B (zh) * 2012-03-22 2016-03-09 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法
CN104602448B (zh) * 2013-10-30 2017-11-03 鹏鼎控股(深圳)股份有限公司 可挠式电路板及其制作方法
TWI517775B (zh) 2014-03-06 2016-01-11 相互股份有限公司 印刷電路板及其製法
CN105592638B (zh) * 2014-10-20 2018-10-30 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法
TWI713420B (zh) * 2019-04-01 2020-12-11 新揚科技股份有限公司 電路板結構

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841996B2 (ja) * 1992-01-13 1998-12-24 日立化成工業株式会社 リジッドフレックス配線板の製造方法
JPH0750455A (ja) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc リジッドフレックスプリント配線板およびその製造方法
JPH07193370A (ja) * 1993-12-25 1995-07-28 Ibiden Co Ltd フレックスリジッドプリント基板及びその製造方法
JPH0955562A (ja) * 1995-08-11 1997-02-25 Cmk Corp プリント配線板
US6350387B2 (en) 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8925194B2 (en) 2006-10-23 2015-01-06 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
US8476531B2 (en) 2006-10-23 2013-07-02 Ibiden Co., Ltd Flex-rigid wiring board and method of manufacturing the same
US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8479389B2 (en) 2006-10-30 2013-07-09 Ibiden Co., Ltd. Method of manufacturing a flex-rigid wiring board
US8525038B2 (en) 2006-10-30 2013-09-03 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US9271405B2 (en) 2006-10-30 2016-02-23 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8405999B2 (en) 2008-03-10 2013-03-26 Ibiden Co., Ltd. Flexible wiring board and method of manufacturing same
WO2009113202A1 (ja) 2008-03-10 2009-09-17 イビデン株式会社 フレキシブル配線板及びその製造方法
JP2010232585A (ja) * 2009-03-30 2010-10-14 Toppan Printing Co Ltd 多層配線基板およびその製造方法
JP2011082317A (ja) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板及びこれを備える電子機器
JP2015161975A (ja) * 2014-02-26 2015-09-07 レノボ・シンガポール・プライベート・リミテッド 引出構造、キーボードユニット及び携帯用情報機器
CN110913577A (zh) * 2019-12-24 2020-03-24 江苏弘信华印电路科技有限公司 一种六层软硬结合板的叠构结构

Also Published As

Publication number Publication date
TWI302080B (enExample) 2008-10-11
CN1767720A (zh) 2006-05-03
KR100742679B1 (ko) 2007-07-25
TW200631483A (en) 2006-09-01
KR20060052260A (ko) 2006-05-19

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