JP2013145797A - 搬送システム - Google Patents
搬送システム Download PDFInfo
- Publication number
- JP2013145797A JP2013145797A JP2012005332A JP2012005332A JP2013145797A JP 2013145797 A JP2013145797 A JP 2013145797A JP 2012005332 A JP2012005332 A JP 2012005332A JP 2012005332 A JP2012005332 A JP 2012005332A JP 2013145797 A JP2013145797 A JP 2013145797A
- Authority
- JP
- Japan
- Prior art keywords
- hand
- temperature
- robot
- wafer
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
【解決手段】上記の課題を解決するために、ロボットと、決定部とを備えるように搬送システムを構成する。ロボットは、薄板状のワークを保持するロボットハンドをかかるロボットハンドの高さ位置がそれぞれ異なるように具備する。決定部は、ロボットハンドによってそれぞれ保持される予定のワークの温度の組み合わせに基づいてかかるワークを保持するロボットハンドをそれぞれ決定する。
【選択図】図4
Description
2 基板搬送部
3 基板供給部
4 基板処理部
10 ロボット
11 ハンド
11a 上段ハンド
11b 下段ハンド
12 アーム部
12a 昇降部
12b 関節部
12c 第1アーム
12d 関節部
12e 第2アーム
12f 関節部
13 基台
20 筐体
21、22 側面
23 基台設置フレーム
24 フィルタユニット
25 脚具
26 プリアライナ装置
30 フープ
31 テーブル
40 処理装置
50 制御装置
60 上位装置
100 設置面
111 プレート
112 先端側支持部
113 基端側支持部
114 押圧駆動部
114a 押圧部
114b 突出部
Claims (7)
- 薄板状のワークを保持するロボットハンドを該ロボットハンドの高さ位置がそれぞれ異なるように具備するロボットと、
前記ロボットハンドによってそれぞれ保持される予定の前記ワークの温度の組み合わせに基づいて該ワークを保持する前記ロボットハンドをそれぞれ決定する決定部と
を備えることを特徴とする搬送システム。 - 前記決定部は、
前記ロボットが設けられる空間におけるダウンフローの大きさに基づいて前記ワークを保持する前記ロボットハンドを決定すること
を特徴とする請求項1に記載の搬送システム。 - 前記決定部は、
前記温度が常温である前記ワークが温度変化を許容するか否かに基づいて前記ワークを保持する前記ロボットハンドを決定すること
を特徴とする請求項1または2に記載の搬送システム。 - 前記ロボットハンドは、
水平方向に動作するアームにおける先端部上に、共通の旋回軸まわりに個別に旋回するように近接して設けられること
を特徴とする請求項1、2または3に記載の搬送システム。 - 前記決定部は、
前記ワークの温度を常温と非常温とに区分けしたうえで前記組み合わせを生成すること
を特徴とする請求項1〜4のいずれか一つに記載の搬送システム。 - 前記決定部は、
前記ワークの温度を常温と、前記常温よりも高い高温と、前記常温よりも低い低温とに区分けしたうえで前記組み合わせを生成すること
を特徴とする請求項1〜4のいずれか一つに記載の搬送システム。 - 前記決定部は、
前記ロボットハンドによってそれぞれ保持される予定の前記ワークの温度を、前記ロボットの動作を規定する教示データに基づいて取得すること
を特徴とする請求項1〜6のいずれか一つに記載の搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012005332A JP5609896B2 (ja) | 2012-01-13 | 2012-01-13 | 搬送システム |
US13/607,806 US8989899B2 (en) | 2012-01-13 | 2012-09-10 | Transfer system |
TW101137453A TWI495608B (zh) | 2012-01-13 | 2012-10-11 | 移送系統 |
CN201210405661.3A CN103203738B (zh) | 2012-01-13 | 2012-10-23 | 搬运系统 |
KR1020120118063A KR101503120B1 (ko) | 2012-01-13 | 2012-10-23 | 반송 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012005332A JP5609896B2 (ja) | 2012-01-13 | 2012-01-13 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013145797A true JP2013145797A (ja) | 2013-07-25 |
JP5609896B2 JP5609896B2 (ja) | 2014-10-22 |
Family
ID=48751249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012005332A Expired - Fee Related JP5609896B2 (ja) | 2012-01-13 | 2012-01-13 | 搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US8989899B2 (ja) |
JP (1) | JP5609896B2 (ja) |
KR (1) | KR101503120B1 (ja) |
CN (1) | CN103203738B (ja) |
TW (1) | TWI495608B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106104785A (zh) * | 2013-12-26 | 2016-11-09 | 川崎重工业株式会社 | 末端执行器及基板搬送机器人 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016038656A1 (ja) * | 2014-09-08 | 2016-03-17 | 株式会社安川電機 | ロボットシステムおよび搬送方法 |
JP7136067B2 (ja) * | 2019-11-27 | 2022-09-13 | 株式会社安川電機 | ロボットシステム |
CN116000955B (zh) * | 2023-03-23 | 2023-06-09 | 无锡展硕科技有限公司 | 一种具有偏压调节夹持功能的免损伤式机械手 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04262555A (ja) * | 1991-02-15 | 1992-09-17 | Tokyo Electron Ltd | 処理装置 |
JP2002110761A (ja) * | 2000-05-04 | 2002-04-12 | Applied Materials Inc | 温度感知用途を有するロボット用装置及び方法 |
JP2003179119A (ja) * | 2002-08-20 | 2003-06-27 | Yaskawa Electric Corp | 基板搬送用ロボット |
JP2004356295A (ja) * | 2003-05-28 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2009076805A (ja) * | 2007-09-25 | 2009-04-09 | Tokyo Electron Ltd | 基板搬送装置及びダウンフロー制御方法 |
JP2011205044A (ja) * | 2010-03-26 | 2011-10-13 | Tokyo Electron Ltd | 基板搬送装置及び基板処理装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2960151B2 (ja) | 1990-11-14 | 1999-10-06 | 積水化学工業株式会社 | Frp管継手成形用内型およびこの内型を用いたfrp管継手の成形・脱型方法 |
US5297910A (en) * | 1991-02-15 | 1994-03-29 | Tokyo Electron Limited | Transportation-transfer device for an object of treatment |
US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
JP2002184834A (ja) | 2000-12-15 | 2002-06-28 | Yaskawa Electric Corp | 基板搬送用ロボット |
JP2002343847A (ja) | 2001-05-18 | 2002-11-29 | Nec Yamaguchi Ltd | ウェハ搬送装置 |
CN1263584C (zh) * | 2001-06-25 | 2006-07-12 | 林武秀 | 半导体或液晶晶片单片运送和转移装载系统 |
US6663333B2 (en) * | 2001-07-13 | 2003-12-16 | Axcelis Technologies, Inc. | Wafer transport apparatus |
JP2004535681A (ja) | 2001-07-14 | 2004-11-25 | ブルックス オートメーション インコーポレイテッド | 統合マッピングセンサを備えた中心位置決め用両側エッジグリップ・エンドエフェクタ |
US6861321B2 (en) * | 2002-04-05 | 2005-03-01 | Asm America, Inc. | Method of loading a wafer onto a wafer holder to reduce thermal shock |
CN101627467B (zh) * | 2007-03-02 | 2011-04-27 | 株式会社大亨 | 搬送装置 |
US20090082927A1 (en) | 2007-09-25 | 2009-03-26 | W.E.T. Automotive Systems Ag | Integrated seat conditioning and multi-component control module |
-
2012
- 2012-01-13 JP JP2012005332A patent/JP5609896B2/ja not_active Expired - Fee Related
- 2012-09-10 US US13/607,806 patent/US8989899B2/en not_active Expired - Fee Related
- 2012-10-11 TW TW101137453A patent/TWI495608B/zh not_active IP Right Cessation
- 2012-10-23 KR KR1020120118063A patent/KR101503120B1/ko not_active IP Right Cessation
- 2012-10-23 CN CN201210405661.3A patent/CN103203738B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04262555A (ja) * | 1991-02-15 | 1992-09-17 | Tokyo Electron Ltd | 処理装置 |
JP2002110761A (ja) * | 2000-05-04 | 2002-04-12 | Applied Materials Inc | 温度感知用途を有するロボット用装置及び方法 |
JP2003179119A (ja) * | 2002-08-20 | 2003-06-27 | Yaskawa Electric Corp | 基板搬送用ロボット |
JP2004356295A (ja) * | 2003-05-28 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2009076805A (ja) * | 2007-09-25 | 2009-04-09 | Tokyo Electron Ltd | 基板搬送装置及びダウンフロー制御方法 |
JP2011205044A (ja) * | 2010-03-26 | 2011-10-13 | Tokyo Electron Ltd | 基板搬送装置及び基板処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106104785A (zh) * | 2013-12-26 | 2016-11-09 | 川崎重工业株式会社 | 末端执行器及基板搬送机器人 |
Also Published As
Publication number | Publication date |
---|---|
TW201331111A (zh) | 2013-08-01 |
KR20130083809A (ko) | 2013-07-23 |
US8989899B2 (en) | 2015-03-24 |
TWI495608B (zh) | 2015-08-11 |
US20130184862A1 (en) | 2013-07-18 |
CN103203738B (zh) | 2015-09-30 |
KR101503120B1 (ko) | 2015-03-16 |
JP5609896B2 (ja) | 2014-10-22 |
CN103203738A (zh) | 2013-07-17 |
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