US8989899B2 - Transfer system - Google Patents

Transfer system Download PDF

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Publication number
US8989899B2
US8989899B2 US13/607,806 US201213607806A US8989899B2 US 8989899 B2 US8989899 B2 US 8989899B2 US 201213607806 A US201213607806 A US 201213607806A US 8989899 B2 US8989899 B2 US 8989899B2
Authority
US
United States
Prior art keywords
robot
workpiece
temperature
hand
transfer system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US13/607,806
Other languages
English (en)
Other versions
US20130184862A1 (en
Inventor
Ryuji Ando
Kazunori Hino
Shinichi Katsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Assigned to KABUSHIKI KAISHA YASKAWA DENKI reassignment KABUSHIKI KAISHA YASKAWA DENKI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HINO, KAZUNORI, KATSUDA, SHINICHI, ANDO, RYUJI
Publication of US20130184862A1 publication Critical patent/US20130184862A1/en
Application granted granted Critical
Publication of US8989899B2 publication Critical patent/US8989899B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
US13/607,806 2012-01-13 2012-09-10 Transfer system Expired - Fee Related US8989899B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012005332A JP5609896B2 (ja) 2012-01-13 2012-01-13 搬送システム
JP2012-005332 2012-01-13

Publications (2)

Publication Number Publication Date
US20130184862A1 US20130184862A1 (en) 2013-07-18
US8989899B2 true US8989899B2 (en) 2015-03-24

Family

ID=48751249

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/607,806 Expired - Fee Related US8989899B2 (en) 2012-01-13 2012-09-10 Transfer system

Country Status (5)

Country Link
US (1) US8989899B2 (ja)
JP (1) JP5609896B2 (ja)
KR (1) KR101503120B1 (ja)
CN (1) CN103203738B (ja)
TW (1) TWI495608B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098153A1 (ja) * 2013-12-26 2015-07-02 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
WO2016038656A1 (ja) * 2014-09-08 2016-03-17 株式会社安川電機 ロボットシステムおよび搬送方法
JP7136067B2 (ja) * 2019-11-27 2022-09-13 株式会社安川電機 ロボットシステム
CN116000955B (zh) * 2023-03-23 2023-06-09 无锡展硕科技有限公司 一种具有偏压调节夹持功能的免损伤式机械手

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04262555A (ja) 1991-02-15 1992-09-17 Tokyo Electron Ltd 処理装置
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
JP2960151B2 (ja) 1990-11-14 1999-10-06 積水化学工業株式会社 Ｆｒｐ管継手成形用内型およびこの内型を用いたｆｒｐ管継手の成形・脱型方法
US6054181A (en) * 1993-10-29 2000-04-25 Tokyo Electron Limited Method of substrate processing to form a film on multiple target objects
JP2002110761A (ja) 2000-05-04 2002-04-12 Applied Materials Inc 温度感知用途を有するロボット用装置及び方法
JP2002343847A (ja) 2001-05-18 2002-11-29 Nec Yamaguchi Ltd ウェハ搬送装置
TW516154B (en) 2000-12-15 2003-01-01 Yaskawa Denki Seisakusho Kk Robot for carrying substrates
US20030035711A1 (en) 2001-07-14 2003-02-20 Ulysses Gilchrist Centering double side edge grip end effector with integrated mapping sensor
JP2003179119A (ja) 2002-08-20 2003-06-27 Yaskawa Electric Corp 基板搬送用ロボット
US20030190823A1 (en) * 2002-04-05 2003-10-09 Keeton Tony J. Method of loading a wafer onto a wafer holder to reduce thermal shock
JP2004356295A (ja) 2003-05-28 2004-12-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US6877946B2 (en) * 2001-07-13 2005-04-12 Axcelis Technologies, Inc. Wafer transport apparatus
JP2009078805A (ja) 2007-09-25 2009-04-16 Wat Automotive Systems Ag シート調節機能付き多種部品集積モジュール
JP2011205044A (ja) 2010-03-26 2011-10-13 Tokyo Electron Ltd 基板搬送装置及び基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1263584C (zh) * 2001-06-25 2006-07-12 林武秀 半导体或液晶晶片单片运送和转移装载系统
CN101627467B (zh) * 2007-03-02 2011-04-27 株式会社大亨 搬送装置
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960151B2 (ja) 1990-11-14 1999-10-06 積水化学工業株式会社 Ｆｒｐ管継手成形用内型およびこの内型を用いたｆｒｐ管継手の成形・脱型方法
JPH04262555A (ja) 1991-02-15 1992-09-17 Tokyo Electron Ltd 処理装置
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
US6054181A (en) * 1993-10-29 2000-04-25 Tokyo Electron Limited Method of substrate processing to form a film on multiple target objects
JP2002110761A (ja) 2000-05-04 2002-04-12 Applied Materials Inc 温度感知用途を有するロボット用装置及び方法
TW516154B (en) 2000-12-15 2003-01-01 Yaskawa Denki Seisakusho Kk Robot for carrying substrates
JP2002343847A (ja) 2001-05-18 2002-11-29 Nec Yamaguchi Ltd ウェハ搬送装置
US6877946B2 (en) * 2001-07-13 2005-04-12 Axcelis Technologies, Inc. Wafer transport apparatus
US6969227B2 (en) * 2001-07-13 2005-11-29 Axcolis Technologies, Inc. Wafer transport apparatus
JP2004535681A (ja) 2001-07-14 2004-11-25 ブルックス オートメーション インコーポレイテッド 統合マッピングセンサを備えた中心位置決め用両側エッジグリップ・エンドエフェクタ
US20030035711A1 (en) 2001-07-14 2003-02-20 Ulysses Gilchrist Centering double side edge grip end effector with integrated mapping sensor
US20030190823A1 (en) * 2002-04-05 2003-10-09 Keeton Tony J. Method of loading a wafer onto a wafer holder to reduce thermal shock
JP2003179119A (ja) 2002-08-20 2003-06-27 Yaskawa Electric Corp 基板搬送用ロボット
JP2004356295A (ja) 2003-05-28 2004-12-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2009078805A (ja) 2007-09-25 2009-04-16 Wat Automotive Systems Ag シート調節機能付き多種部品集積モジュール
JP2011205044A (ja) 2010-03-26 2011-10-13 Tokyo Electron Ltd 基板搬送装置及び基板処理装置

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Chinese Office Action for corresponding CN Application No. 201210405661.3, 08-28-20104.
Japanese Decision of a Patent Grant for corresponding JP Application No. 2012-005332, Aug. 5, 2014.
Japanese Office Action for corresponding JP Application No. 2012-005332, Nov. 26, 2013.
Korean Office Action for corresponding KR Application No. 10-2012-0118063, Jul. 3, 2014.
Taiwanese Office Action for corresponding TW Application No. 101137453, Jan. 15, 2015.

Also Published As

Publication number Publication date
TW201331111A (zh) 2013-08-01
KR20130083809A (ko) 2013-07-23
TWI495608B (zh) 2015-08-11
US20130184862A1 (en) 2013-07-18
CN103203738B (zh) 2015-09-30
JP2013145797A (ja) 2013-07-25
KR101503120B1 (ko) 2015-03-16
JP5609896B2 (ja) 2014-10-22
CN103203738A (zh) 2013-07-17

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