JP2013119579A5 - - Google Patents
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- Publication number
- JP2013119579A5 JP2013119579A5 JP2011267368A JP2011267368A JP2013119579A5 JP 2013119579 A5 JP2013119579 A5 JP 2013119579A5 JP 2011267368 A JP2011267368 A JP 2011267368A JP 2011267368 A JP2011267368 A JP 2011267368A JP 2013119579 A5 JP2013119579 A5 JP 2013119579A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaning liquid
- liquid composition
- composition according
- phosphonic acid
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 15
- 239000002738 chelating agent Substances 0.000 claims description 5
- 150000007514 bases Chemical class 0.000 claims description 4
- OXHDYFKENBXUEM-UHFFFAOYSA-N glyphosine Chemical compound OC(=O)CN(CP(O)(O)=O)CP(O)(O)=O OXHDYFKENBXUEM-UHFFFAOYSA-N 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims description 3
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims description 2
- 239000003945 anionic surfactant Substances 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 238000007865 diluting Methods 0.000 claims description 2
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002736 nonionic surfactant Substances 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 2
- -1 hydrogen ions Chemical class 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 1
- 229960005070 ascorbic acid Drugs 0.000 claims 1
- 235000010323 ascorbic acid Nutrition 0.000 claims 1
- 239000011668 ascorbic acid Substances 0.000 claims 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011267368A JP6066552B2 (ja) | 2011-12-06 | 2011-12-06 | 電子デバイス用洗浄液組成物 |
| MYPI2012005069A MY165726A (en) | 2011-12-06 | 2012-11-23 | Cleaning liquid composition for electronic device |
| EP12195375.6A EP2602309B1 (en) | 2011-12-06 | 2012-12-04 | Method of cleaning an electronic device with an alkaline liquid composition comprising a phosphonic acid derivative chelating agent |
| KR1020120140462A KR102041624B1 (ko) | 2011-12-06 | 2012-12-05 | 전자 디바이스용 세정액 조성물 |
| CN2012105179042A CN103146509A (zh) | 2011-12-06 | 2012-12-05 | 清洁液组合物及其浓缩液和使用清洁液组合物的清洁方法 |
| US13/705,575 US9334470B2 (en) | 2011-12-06 | 2012-12-05 | Cleaning liquid composition for electronic device |
| TW101145895A TWI565797B (zh) | 2011-12-06 | 2012-12-06 | 電子元件用洗淨液組成物 |
| SG2012089926A SG191504A1 (en) | 2011-12-06 | 2012-12-06 | Cleaning liquid composition for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011267368A JP6066552B2 (ja) | 2011-12-06 | 2011-12-06 | 電子デバイス用洗浄液組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013119579A JP2013119579A (ja) | 2013-06-17 |
| JP2013119579A5 true JP2013119579A5 (enExample) | 2014-12-25 |
| JP6066552B2 JP6066552B2 (ja) | 2017-01-25 |
Family
ID=47323949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011267368A Active JP6066552B2 (ja) | 2011-12-06 | 2011-12-06 | 電子デバイス用洗浄液組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9334470B2 (enExample) |
| EP (1) | EP2602309B1 (enExample) |
| JP (1) | JP6066552B2 (enExample) |
| KR (1) | KR102041624B1 (enExample) |
| CN (1) | CN103146509A (enExample) |
| MY (1) | MY165726A (enExample) |
| SG (1) | SG191504A1 (enExample) |
| TW (1) | TWI565797B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9329486B2 (en) | 2005-10-28 | 2016-05-03 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US8263539B2 (en) | 2005-10-28 | 2012-09-11 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and methods for its use |
| US7632796B2 (en) | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| TWI450052B (zh) * | 2008-06-24 | 2014-08-21 | 黛納羅伊有限責任公司 | 用於後段製程操作有效之剝離溶液 |
| CN104508072A (zh) | 2012-02-15 | 2015-04-08 | 安格斯公司 | 用于cmp后去除的组合物及使用方法 |
| TWI572711B (zh) * | 2012-10-16 | 2017-03-01 | 盟智科技股份有限公司 | 半導體製程用的清洗組成物及清洗方法 |
| US9158202B2 (en) | 2012-11-21 | 2015-10-13 | Dynaloy, Llc | Process and composition for removing substances from substrates |
| JP6203525B2 (ja) * | 2013-04-19 | 2017-09-27 | 関東化學株式会社 | 洗浄液組成物 |
| CN103757648B (zh) * | 2014-01-16 | 2016-03-30 | 段云豪 | 一种手机表面铜锈的去除及防护剂 |
| US11127587B2 (en) | 2014-02-05 | 2021-09-21 | Entegris, Inc. | Non-amine post-CMP compositions and method of use |
| TWI636131B (zh) * | 2014-05-20 | 2018-09-21 | 日商Ｊｓｒ股份有限公司 | 清洗用組成物及清洗方法 |
| CN104018170A (zh) * | 2014-05-29 | 2014-09-03 | 东风汽车紧固件有限公司 | 一种低温环保无铬除磷化膜剂 |
| JP6350080B2 (ja) * | 2014-07-31 | 2018-07-04 | Jsr株式会社 | 半導体基板洗浄用組成物 |
| CN104818133B (zh) * | 2015-03-30 | 2018-04-27 | 蓝思科技（长沙）有限公司 | 一种用于菲林褪镀后脱垢的清洗剂 |
| JP6737436B2 (ja) * | 2015-11-10 | 2020-08-12 | 株式会社Ｓｃｒｅｅｎホールディングス | 膜処理ユニットおよび基板処理装置 |
| US10319605B2 (en) | 2016-05-10 | 2019-06-11 | Jsr Corporation | Semiconductor treatment composition and treatment method |
| CN110234719A (zh) * | 2017-01-18 | 2019-09-13 | 恩特格里斯公司 | 用于从表面去除氧化铈粒子的组合物和方法 |
| JP7220142B2 (ja) * | 2017-03-31 | 2023-02-09 | 関東化学株式会社 | チタン層またはチタン含有層のエッチング液組成物およびエッチング方法 |
| KR20220118520A (ko) * | 2019-12-20 | 2022-08-25 | 버슘머트리얼즈 유에스, 엘엘씨 | Co/cu 선택적 습식 에칭제 |
| WO2022073178A1 (en) * | 2020-10-09 | 2022-04-14 | Henkel Ag & Co. Kgaa | Cleaner for electronic device components |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0641773A (ja) | 1992-05-18 | 1994-02-15 | Toshiba Corp | 半導体ウェーハ処理液 |
| US5421897A (en) * | 1992-07-17 | 1995-06-06 | Grawe; John | Abatement process for contaminants |
| JP3335500B2 (ja) * | 1994-08-03 | 2002-10-15 | シャープ株式会社 | 排水処理装置および排水処理方法 |
| JPH09286999A (ja) * | 1996-04-19 | 1997-11-04 | Kanto Chem Co Inc | シリコンウェハ洗浄用組成物 |
| JP3219020B2 (ja) | 1996-06-05 | 2001-10-15 | 和光純薬工業株式会社 | 洗浄処理剤 |
| TW416987B (en) | 1996-06-05 | 2001-01-01 | Wako Pure Chem Ind Ltd | A composition for cleaning the semiconductor substrate surface |
| JP3165801B2 (ja) | 1997-08-12 | 2001-05-14 | 関東化学株式会社 | 洗浄液 |
| TW387936B (en) | 1997-08-12 | 2000-04-21 | Kanto Kagaku | Washing solution |
| JP3377938B2 (ja) | 1997-10-21 | 2003-02-17 | 花王株式会社 | 洗浄剤組成物及び洗浄方法 |
| JP4252130B2 (ja) | 1998-07-13 | 2009-04-08 | 武藤工業株式会社 | インクジェットプリンタにおける細線の階調表現方法 |
| JP2000252250A (ja) * | 1999-02-26 | 2000-09-14 | Mitsubishi Gas Chem Co Inc | 半導体基板洗浄液およびそれを用いた半導体基板の洗浄方法 |
| JP4516176B2 (ja) | 1999-04-20 | 2010-08-04 | 関東化学株式会社 | 電子材料用基板洗浄液 |
| US6395693B1 (en) * | 1999-09-27 | 2002-05-28 | Cabot Microelectronics Corporation | Cleaning solution for semiconductor surfaces following chemical-mechanical polishing |
| AU2001241190A1 (en) * | 2000-03-21 | 2001-10-03 | Wako Pure Chemical Industries, Ltd. | Semiconductor wafer cleaning agent and cleaning method |
| JP2002069495A (ja) * | 2000-06-16 | 2002-03-08 | Kao Corp | 洗浄剤組成物 |
| KR100867287B1 (ko) * | 2000-06-16 | 2008-11-06 | 카오카부시키가이샤 | 세정제 조성물 |
| US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| JP2002257809A (ja) * | 2001-03-06 | 2002-09-11 | Nec Corp | テトラメチルアンモニウムハイドロオキサイドの検出方法および装置 |
| MY131912A (en) * | 2001-07-09 | 2007-09-28 | Avantor Performance Mat Inc | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| TWI297102B (en) * | 2001-08-03 | 2008-05-21 | Nec Electronics Corp | Removing composition |
| JP2003129089A (ja) * | 2001-10-24 | 2003-05-08 | Daikin Ind Ltd | 洗浄用組成物 |
| TWI276682B (en) * | 2001-11-16 | 2007-03-21 | Mitsubishi Chem Corp | Substrate surface cleaning liquid mediums and cleaning method |
| WO2003104900A2 (en) * | 2002-06-07 | 2003-12-18 | Mallinckrodt Baker Inc. | Microelectronic cleaning compositions containing oxidizers and organic solvents |
| JP2004042811A (ja) | 2002-07-12 | 2004-02-12 | Denso Corp | 車両用空調装置 |
| JP4752270B2 (ja) * | 2002-11-08 | 2011-08-17 | 和光純薬工業株式会社 | 洗浄液及びそれを用いた洗浄方法 |
| JP2005101479A (ja) * | 2002-11-08 | 2005-04-14 | Sumitomo Chemical Co Ltd | 半導体基板用洗浄液 |
| JP4485786B2 (ja) * | 2003-01-10 | 2010-06-23 | 関東化学株式会社 | 半導体基板用洗浄液 |
| TWI324362B (en) * | 2003-01-10 | 2010-05-01 | Kanto Kagaku | Cleaning solution for semiconductor substrate |
| WO2004094581A1 (en) * | 2003-04-18 | 2004-11-04 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
| JP2005060660A (ja) * | 2003-07-31 | 2005-03-10 | Sumitomo Chemical Co Ltd | 半導体基板用洗浄液 |
| US20050205835A1 (en) * | 2004-03-19 | 2005-09-22 | Tamboli Dnyanesh C | Alkaline post-chemical mechanical planarization cleaning compositions |
| JP4628209B2 (ja) * | 2004-11-18 | 2011-02-09 | 花王株式会社 | 剥離剤組成物 |
| TWI282363B (en) * | 2005-05-19 | 2007-06-11 | Epoch Material Co Ltd | Aqueous cleaning composition for semiconductor copper processing |
| SG162725A1 (en) | 2005-05-26 | 2010-07-29 | Advanced Tech Materials | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
| JP5192952B2 (ja) | 2007-09-14 | 2013-05-08 | 三洋化成工業株式会社 | 磁気ディスク基板用洗浄剤 |
| JP5192953B2 (ja) | 2007-09-14 | 2013-05-08 | 三洋化成工業株式会社 | 磁気ディスク用ガラス基板洗浄剤 |
| JP2009194049A (ja) * | 2008-02-13 | 2009-08-27 | Sanyo Chem Ind Ltd | 銅配線半導体用洗浄剤 |
| JP5553985B2 (ja) * | 2008-12-11 | 2014-07-23 | 三洋化成工業株式会社 | 電子材料用洗浄剤 |
| JP5410943B2 (ja) | 2008-12-18 | 2014-02-05 | 三洋化成工業株式会社 | 電子材料用洗浄剤 |
| US8765653B2 (en) | 2009-07-07 | 2014-07-01 | Air Products And Chemicals, Inc. | Formulations and method for post-CMP cleaning |
| US8148310B2 (en) * | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
| US8148311B2 (en) * | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
| JP5401359B2 (ja) * | 2010-02-16 | 2014-01-29 | 花王株式会社 | 硬質表面用アルカリ洗浄剤組成物 |
-
2011
- 2011-12-06 JP JP2011267368A patent/JP6066552B2/ja active Active
-
2012
- 2012-11-23 MY MYPI2012005069A patent/MY165726A/en unknown
- 2012-12-04 EP EP12195375.6A patent/EP2602309B1/en active Active
- 2012-12-05 CN CN2012105179042A patent/CN103146509A/zh active Pending
- 2012-12-05 KR KR1020120140462A patent/KR102041624B1/ko active Active
- 2012-12-05 US US13/705,575 patent/US9334470B2/en active Active
- 2012-12-06 TW TW101145895A patent/TWI565797B/zh active
- 2012-12-06 SG SG2012089926A patent/SG191504A1/en unknown
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