JP2013115428A5 - - Google Patents

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Publication number
JP2013115428A5
JP2013115428A5 JP2012241517A JP2012241517A JP2013115428A5 JP 2013115428 A5 JP2013115428 A5 JP 2013115428A5 JP 2012241517 A JP2012241517 A JP 2012241517A JP 2012241517 A JP2012241517 A JP 2012241517A JP 2013115428 A5 JP2013115428 A5 JP 2013115428A5
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JP
Japan
Prior art keywords
support table
head
semiconductor chip
camera
carriage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012241517A
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English (en)
Japanese (ja)
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JP2013115428A (ja
JP6217958B2 (ja
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Publication date
Priority claimed from CH01886/11A external-priority patent/CH705802B1/de
Application filed filed Critical
Publication of JP2013115428A publication Critical patent/JP2013115428A/ja
Publication of JP2013115428A5 publication Critical patent/JP2013115428A5/ja
Application granted granted Critical
Publication of JP6217958B2 publication Critical patent/JP6217958B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012241517A 2011-11-25 2012-11-01 半導体チップの実装装置 Active JP6217958B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01886/11 2011-11-25
CH01886/11A CH705802B1 (de) 2011-11-25 2011-11-25 Einrichtung für die Montage von Halbleiterchips.

Publications (3)

Publication Number Publication Date
JP2013115428A JP2013115428A (ja) 2013-06-10
JP2013115428A5 true JP2013115428A5 (enExample) 2015-12-17
JP6217958B2 JP6217958B2 (ja) 2017-10-25

Family

ID=48366057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012241517A Active JP6217958B2 (ja) 2011-11-25 2012-11-01 半導体チップの実装装置

Country Status (10)

Country Link
US (1) US9603294B2 (enExample)
JP (1) JP6217958B2 (enExample)
KR (1) KR101991965B1 (enExample)
CN (1) CN103137526B (enExample)
CH (1) CH705802B1 (enExample)
DE (1) DE102012110604B4 (enExample)
FR (1) FR2983344B1 (enExample)
MY (1) MY160071A (enExample)
SG (1) SG190511A1 (enExample)
TW (1) TWI555110B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP6426742B2 (ja) * 2014-08-01 2018-11-21 株式会社Ｆｕｊｉ 部品装着方法および部品装着装置
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
DE102016113328B4 (de) 2015-08-31 2018-07-19 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7340774B2 (ja) * 2019-05-23 2023-09-08 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品圧着方法
CN113471107B (zh) * 2021-06-29 2022-04-19 深圳新益昌科技股份有限公司 固晶机及固晶方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
JP2002271093A (ja) * 2001-03-07 2002-09-20 Fuji Mach Mfg Co Ltd 電気部品装着システム
JP2003086611A (ja) 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
TW567574B (en) 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
WO2005041630A1 (en) * 2003-10-24 2005-05-06 Matsushita Electric Industrial Co. Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
US8137050B2 (en) 2005-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Pickup device and pickup method
US8914971B2 (en) * 2006-04-12 2014-12-23 Kulicke & Soffa Die Bonding Gmbh Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate
KR20080041471A (ko) 2006-11-07 2008-05-13 삼성전자주식회사 다이 본더
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
WO2009072659A1 (en) 2007-12-03 2009-06-11 Panasonic Corporation Chip mounting system
JP4946989B2 (ja) * 2008-07-07 2012-06-06 パナソニック株式会社 電子部品ボンディング装置
JP4788759B2 (ja) * 2008-11-20 2011-10-05 パナソニック株式会社 部品実装装置
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置

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