JP2013106050A5 - - Google Patents

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Publication number
JP2013106050A5
JP2013106050A5 JP2012250063A JP2012250063A JP2013106050A5 JP 2013106050 A5 JP2013106050 A5 JP 2013106050A5 JP 2012250063 A JP2012250063 A JP 2012250063A JP 2012250063 A JP2012250063 A JP 2012250063A JP 2013106050 A5 JP2013106050 A5 JP 2013106050A5
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JP
Japan
Prior art keywords
etching
substrate
scattered
camera
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012250063A
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English (en)
Japanese (ja)
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JP2013106050A (ja
JP6301578B2 (ja
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Publication date
Priority claimed from GBGB1119598.9A external-priority patent/GB201119598D0/en
Application filed filed Critical
Publication of JP2013106050A publication Critical patent/JP2013106050A/ja
Publication of JP2013106050A5 publication Critical patent/JP2013106050A5/ja
Application granted granted Critical
Publication of JP6301578B2 publication Critical patent/JP6301578B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012250063A 2011-11-14 2012-11-14 エッチング装置及び方法 Active JP6301578B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1119598.9 2011-11-14
GBGB1119598.9A GB201119598D0 (en) 2011-11-14 2011-11-14 Etching apparatus and methods

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017203582A Division JP2018014538A (ja) 2011-11-14 2017-10-20 エッチング装置及び方法

Publications (3)

Publication Number Publication Date
JP2013106050A JP2013106050A (ja) 2013-05-30
JP2013106050A5 true JP2013106050A5 (enExample) 2016-01-07
JP6301578B2 JP6301578B2 (ja) 2018-03-28

Family

ID=45444084

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012250063A Active JP6301578B2 (ja) 2011-11-14 2012-11-14 エッチング装置及び方法
JP2017203582A Pending JP2018014538A (ja) 2011-11-14 2017-10-20 エッチング装置及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017203582A Pending JP2018014538A (ja) 2011-11-14 2017-10-20 エッチング装置及び方法

Country Status (6)

Country Link
EP (1) EP2592646B1 (enExample)
JP (2) JP6301578B2 (enExample)
KR (3) KR101986845B1 (enExample)
CN (1) CN103107113B (enExample)
GB (1) GB201119598D0 (enExample)
TW (1) TWI575551B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104134618B (zh) * 2014-06-12 2017-12-08 京东方科技集团股份有限公司 一种关键图形的尺寸检测装置及尺寸检测方法
NL2019007A (en) * 2016-06-13 2017-12-20 Asml Netherlands Bv Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate
CN109148316A (zh) * 2018-09-07 2019-01-04 北京智芯微电子科技有限公司 用于精确判定等离子体刻蚀机刻蚀芯片终点的监测方法
GB201916079D0 (en) * 2019-11-05 2019-12-18 Spts Technologies Ltd Apparatus and method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028233A (ja) * 1983-07-27 1985-02-13 Hitachi Ltd エツチングのモニタ装置
JPS60124823A (ja) * 1983-12-09 1985-07-03 Hitachi Ltd エツチング・モニタ方法
JPS62171127A (ja) * 1986-01-24 1987-07-28 Hitachi Ltd エツチングの終点検出方法
JP3044728B2 (ja) * 1989-12-26 2000-05-22 ソニー株式会社 埋め込みプラグの製造方法
US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
JP4567828B2 (ja) * 1999-09-14 2010-10-20 東京エレクトロン株式会社 終点検出方法
JP2001319922A (ja) * 2000-05-10 2001-11-16 Nec Corp 異常放電検出装置および検出方法
JP2001332534A (ja) * 2000-05-25 2001-11-30 Matsushita Electric Ind Co Ltd プラズマ処理方法及びプラズマ処理装置
JP2003004644A (ja) * 2001-06-19 2003-01-08 Toshiba Corp 表面評価方法、表面処理方法およびその装置
JP4500510B2 (ja) * 2003-06-05 2010-07-14 東京エレクトロン株式会社 エッチング量検出方法，エッチング方法，およびエッチング装置
US20050042777A1 (en) * 2003-08-20 2005-02-24 The Boc Group Inc. Control of etch and deposition processes
JP4278497B2 (ja) * 2003-11-26 2009-06-17 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
JP4181561B2 (ja) * 2005-05-12 2008-11-19 松下電器産業株式会社 半導体加工方法および加工装置
WO2008103994A2 (en) * 2007-02-23 2008-08-28 Rudolph Technologies, Inc. Wafer fabrication monitoring systems and methods, including edge bead removal processing
CN101459049A (zh) * 2007-12-11 2009-06-17 中芯国际集成电路制造(上海)有限公司 一种用于探测刻蚀终点的装置及方法
JP2010010242A (ja) * 2008-06-25 2010-01-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置

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