JP2014142339A5 - - Google Patents

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Publication number
JP2014142339A5
JP2014142339A5 JP2013271567A JP2013271567A JP2014142339A5 JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5 JP 2013271567 A JP2013271567 A JP 2013271567A JP 2013271567 A JP2013271567 A JP 2013271567A JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5
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JP
Japan
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difficult
imaging
identify
occur
solder
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JP2013271567A
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English (en)
Japanese (ja)
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JP2014142339A (ja
JP5776949B2 (ja
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Priority to JP2013271567A priority Critical patent/JP5776949B2/ja
Priority claimed from JP2013271567A external-priority patent/JP5776949B2/ja
Priority to PCT/JP2013/085285 priority patent/WO2014104375A1/ja
Publication of JP2014142339A publication Critical patent/JP2014142339A/ja
Publication of JP2014142339A5 publication Critical patent/JP2014142339A5/ja
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Publication of JP5776949B2 publication Critical patent/JP5776949B2/ja
Ceased legal-status Critical Current
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JP2013271567A 2012-12-31 2013-12-27 検査方法 Ceased JP5776949B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013271567A JP5776949B2 (ja) 2012-12-31 2013-12-27 検査方法
PCT/JP2013/085285 WO2014104375A1 (ja) 2012-12-31 2013-12-29 検査装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012289279 2012-12-31
JP2012289279 2012-12-31
JP2013271567A JP5776949B2 (ja) 2012-12-31 2013-12-27 検査方法

Publications (3)

Publication Number Publication Date
JP2014142339A JP2014142339A (ja) 2014-08-07
JP2014142339A5 true JP2014142339A5 (enExample) 2015-04-02
JP5776949B2 JP5776949B2 (ja) 2015-09-09

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ID=51423734

Family Applications (1)

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JP2013271567A Ceased JP5776949B2 (ja) 2012-12-31 2013-12-27 検査方法

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JP (1) JP5776949B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102250032B1 (ko) * 2014-12-29 2021-05-12 삼성디스플레이 주식회사 표시 장치의 검사 장치 및 표시 장치의 검사 방법
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
JP2019082853A (ja) * 2017-10-30 2019-05-30 日立造船株式会社 情報処理装置、情報処理方法、および情報処理プログラム
TWI724370B (zh) * 2019-02-01 2021-04-11 由田新技股份有限公司 用於量測孔狀結構的自動光學檢測系統以及方法
JP6570211B1 (ja) * 2019-05-29 2019-09-04 ヴィスコ・テクノロジーズ株式会社 外観検査装置
KR102329518B1 (ko) * 2020-06-24 2021-11-23 주식회사 크레셈 에어리어 스캔 카메라를 이용하여 대면적 기판 고속 검사를 위한 리니어 멀티영상 취득 방법
JP7573564B2 (ja) * 2022-04-28 2024-10-25 アンリツ株式会社 検査装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186308B2 (ja) * 1993-03-10 2001-07-11 株式会社日立製作所 セラミック基板の焼結状態監視方法および装置
JPH08271433A (ja) * 1995-03-30 1996-10-18 Nikon Corp 錠剤検査装置
JPH09201953A (ja) * 1996-01-29 1997-08-05 Matsushita Electric Ind Co Ltd クリーム半田印刷機におけるメタルマスクのクリーニング方法
JPH10227623A (ja) * 1996-08-21 1998-08-25 Komatsu Ltd 半導体パッケージの検査装置
JP2000046748A (ja) * 1998-07-27 2000-02-18 Hitachi Ltd 導体パターンの検査方法およびその装置並びに多層基板の製造方法
JP3299193B2 (ja) * 1998-08-21 2002-07-08 日本電気株式会社 バンプ検査方法／装置、情報記憶媒体
JP5621178B2 (ja) * 2009-10-24 2014-11-05 株式会社第一メカテック 外観検査装置及び印刷半田検査装置

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