JP5776949B2 - 検査方法 - Google Patents
検査方法 Download PDFInfo
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- JP5776949B2 JP5776949B2 JP2013271567A JP2013271567A JP5776949B2 JP 5776949 B2 JP5776949 B2 JP 5776949B2 JP 2013271567 A JP2013271567 A JP 2013271567A JP 2013271567 A JP2013271567 A JP 2013271567A JP 5776949 B2 JP5776949 B2 JP 5776949B2
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Images
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013271567A JP5776949B2 (ja) | 2012-12-31 | 2013-12-27 | 検査方法 |
| PCT/JP2013/085285 WO2014104375A1 (ja) | 2012-12-31 | 2013-12-29 | 検査装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012289279 | 2012-12-31 | ||
| JP2012289279 | 2012-12-31 | ||
| JP2013271567A JP5776949B2 (ja) | 2012-12-31 | 2013-12-27 | 検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014142339A JP2014142339A (ja) | 2014-08-07 |
| JP2014142339A5 JP2014142339A5 (enExample) | 2015-04-02 |
| JP5776949B2 true JP5776949B2 (ja) | 2015-09-09 |
Family
ID=51423734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013271567A Ceased JP5776949B2 (ja) | 2012-12-31 | 2013-12-27 | 検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5776949B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102329518B1 (ko) * | 2020-06-24 | 2021-11-23 | 주식회사 크레셈 | 에어리어 스캔 카메라를 이용하여 대면적 기판 고속 검사를 위한 리니어 멀티영상 취득 방법 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102250032B1 (ko) * | 2014-12-29 | 2021-05-12 | 삼성디스플레이 주식회사 | 표시 장치의 검사 장치 및 표시 장치의 검사 방법 |
| US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
| JP2019082853A (ja) * | 2017-10-30 | 2019-05-30 | 日立造船株式会社 | 情報処理装置、情報処理方法、および情報処理プログラム |
| TWI724370B (zh) * | 2019-02-01 | 2021-04-11 | 由田新技股份有限公司 | 用於量測孔狀結構的自動光學檢測系統以及方法 |
| JP6570211B1 (ja) * | 2019-05-29 | 2019-09-04 | ヴィスコ・テクノロジーズ株式会社 | 外観検査装置 |
| JP7573564B2 (ja) * | 2022-04-28 | 2024-10-25 | アンリツ株式会社 | 検査装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3186308B2 (ja) * | 1993-03-10 | 2001-07-11 | 株式会社日立製作所 | セラミック基板の焼結状態監視方法および装置 |
| JPH08271433A (ja) * | 1995-03-30 | 1996-10-18 | Nikon Corp | 錠剤検査装置 |
| JPH09201953A (ja) * | 1996-01-29 | 1997-08-05 | Matsushita Electric Ind Co Ltd | クリーム半田印刷機におけるメタルマスクのクリーニング方法 |
| JPH10227623A (ja) * | 1996-08-21 | 1998-08-25 | Komatsu Ltd | 半導体パッケージの検査装置 |
| JP2000046748A (ja) * | 1998-07-27 | 2000-02-18 | Hitachi Ltd | 導体パターンの検査方法およびその装置並びに多層基板の製造方法 |
| JP3299193B2 (ja) * | 1998-08-21 | 2002-07-08 | 日本電気株式会社 | バンプ検査方法/装置、情報記憶媒体 |
| JP5621178B2 (ja) * | 2009-10-24 | 2014-11-05 | 株式会社第一メカテック | 外観検査装置及び印刷半田検査装置 |
-
2013
- 2013-12-27 JP JP2013271567A patent/JP5776949B2/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102329518B1 (ko) * | 2020-06-24 | 2021-11-23 | 주식회사 크레셈 | 에어리어 스캔 카메라를 이용하여 대면적 기판 고속 검사를 위한 리니어 멀티영상 취득 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014142339A (ja) | 2014-08-07 |
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