JP2014142339A5 - - Google Patents

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Publication number
JP2014142339A5
JP2014142339A5 JP2013271567A JP2013271567A JP2014142339A5 JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5 JP 2013271567 A JP2013271567 A JP 2013271567A JP 2013271567 A JP2013271567 A JP 2013271567A JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5
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JP
Japan
Prior art keywords
difficult
imaging
identify
occur
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013271567A
Other languages
Japanese (ja)
Other versions
JP5776949B2 (en
JP2014142339A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2013271567A priority Critical patent/JP5776949B2/en
Priority claimed from JP2013271567A external-priority patent/JP5776949B2/en
Priority to PCT/JP2013/085285 priority patent/WO2014104375A1/en
Publication of JP2014142339A publication Critical patent/JP2014142339A/en
Publication of JP2014142339A5 publication Critical patent/JP2014142339A5/ja
Application granted granted Critical
Publication of JP5776949B2 publication Critical patent/JP5776949B2/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

撮像対象に光を照射する照明装置と、
前記光の照射に基づく、前記撮像対象からの反射光を、受光する撮像装置と、
前記撮像装置の中に存在し、前記反射光を受光する撮像素子と、を有し、
前記撮像対象の2次元画像、3次元画像のいずれかまたは双方を取得する検査装置において、
前記照明装置と前記撮像対象の間に偏光子を設置し、
前記撮像対象と前記撮像装置の間に検光子を設置し、
前記偏光子の透過軸方向と前記検光子の透過軸方向を垂直の関係にし、
前記2次元画像、前記3次元画像のいずれかまたは双方における、識別困難領域の発生を抑制し、
識別困難領域としては、以下の(イ)、(ロ)、(ハ)、(ニ)、(ホ)、(ヘ)、(ト)のいずれかを含む
(イ)はんだに含まれる透明物質または半透明物質に起因する識別困難領域
(ロ)基板上に設けたソルダーレジストの表面の形状が変化する場所に、発生する場合がある識別困難領域
(ハ)部品を実装するための金属の表面と、はんだの表面との間で発生する場合がある識別困難領域
(ニ)基板上に設けたコーティング層の表面の形状が変化する場所に、発生する場合がある識別困難領域
(ホ)錠剤の表面の形状が変化する場所に、発生する場合がある識別困難領域
(ヘ)メタルマスクの表面と、はんだの表面との間で発生する場合がある識別困難領域
(ト)メタルマスクの傷に起因する識別困難領域
ことを特徴とする検査装置。

An illuminating device for irradiating the imaging object with light;
An imaging device that receives reflected light from the imaging target based on the irradiation of the light; and
An imaging element that is present in the imaging device and receives the reflected light; and
In the inspection apparatus for acquiring either or both of the two-dimensional image and the three-dimensional image of the imaging target,
A polarizer is installed between the illumination device and the imaging target,
Installing an analyzer between the imaging object and the imaging device;
The transmission axis direction of the polarizer and the transmission axis direction of the analyzer are in a vertical relationship,
Suppressing the occurrence of difficult-to-identify regions in one or both of the two-dimensional image and the three-dimensional image,
The difficult-to-identify areas include any of the following (a), (b), (c), (d), (e), (f), (g) (a) a transparent substance contained in solder or Difficult identification area due to translucent material (b) Difficult identification area (c) Metal surface for mounting parts that may occur at the location where the surface shape of the solder resist provided on the substrate changes Difficult-to-identify areas that may occur between the solder surface (d) Difficult-to-identify areas that may occur in places where the shape of the surface of the coating layer provided on the substrate changes (e) The surface of the tablet Difficult-to-identify region (f) that may occur at the location where the shape of the metal changes (f) Due to scratches on the difficult-to-identify region (g) metal mask that may occur between the surface of the solder and the solder surface An inspection device characterized by a difficult-to-identify area.

JP2013271567A 2012-12-31 2013-12-27 Inspection method Ceased JP5776949B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013271567A JP5776949B2 (en) 2012-12-31 2013-12-27 Inspection method
PCT/JP2013/085285 WO2014104375A1 (en) 2012-12-31 2013-12-29 Inspection device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012289279 2012-12-31
JP2012289279 2012-12-31
JP2013271567A JP5776949B2 (en) 2012-12-31 2013-12-27 Inspection method

Publications (3)

Publication Number Publication Date
JP2014142339A JP2014142339A (en) 2014-08-07
JP2014142339A5 true JP2014142339A5 (en) 2015-04-02
JP5776949B2 JP5776949B2 (en) 2015-09-09

Family

ID=51423734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013271567A Ceased JP5776949B2 (en) 2012-12-31 2013-12-27 Inspection method

Country Status (1)

Country Link
JP (1) JP5776949B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102250032B1 (en) * 2014-12-29 2021-05-12 삼성디스플레이 주식회사 Detecting device of display device and detecting method of display device
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
JP2019082853A (en) * 2017-10-30 2019-05-30 日立造船株式会社 Information processing device, information processing method, and information processing program
TWI724370B (en) * 2019-02-01 2021-04-11 由田新技股份有限公司 An automatic optical inspection system, and method for measuring a hole structure
JP6570211B1 (en) * 2019-05-29 2019-09-04 ヴィスコ・テクノロジーズ株式会社 Appearance inspection device
KR102329518B1 (en) * 2020-06-24 2021-11-23 주식회사 크레셈 Linear multi image obtaining method for high-speed inspection of large area substrate using area scan camera

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186308B2 (en) * 1993-03-10 2001-07-11 株式会社日立製作所 Method and apparatus for monitoring sintering state of ceramic substrate
JPH08271433A (en) * 1995-03-30 1996-10-18 Nikon Corp Tablet inspection equipment
JPH09201953A (en) * 1996-01-29 1997-08-05 Matsushita Electric Ind Co Ltd Metal mask cleaning method for cream solder printer
JPH10227623A (en) * 1996-08-21 1998-08-25 Komatsu Ltd Device for inspecting semiconductor package
JP2000046748A (en) * 1998-07-27 2000-02-18 Hitachi Ltd Method and apparatus for inspecting conductor pattern and production of multilayered substrate
JP3299193B2 (en) * 1998-08-21 2002-07-08 日本電気株式会社 Bump inspection method / apparatus, information storage medium
JP5621178B2 (en) * 2009-10-24 2014-11-05 株式会社第一メカテック Appearance inspection device and printed solder inspection device

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