JP2014142339A5 - - Google Patents
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- Publication number
- JP2014142339A5 JP2014142339A5 JP2013271567A JP2013271567A JP2014142339A5 JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5 JP 2013271567 A JP2013271567 A JP 2013271567A JP 2013271567 A JP2013271567 A JP 2013271567A JP 2014142339 A5 JP2014142339 A5 JP 2014142339A5
- Authority
- JP
- Japan
- Prior art keywords
- difficult
- imaging
- identify
- occur
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims 9
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 230000001678 irradiating Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000001629 suppression Effects 0.000 claims 1
Claims (1)
前記光の照射に基づく、前記撮像対象からの反射光を、受光する撮像装置と、
前記撮像装置の中に存在し、前記反射光を受光する撮像素子と、を有し、
前記撮像対象の2次元画像、3次元画像のいずれかまたは双方を取得する検査装置において、
前記照明装置と前記撮像対象の間に偏光子を設置し、
前記撮像対象と前記撮像装置の間に検光子を設置し、
前記偏光子の透過軸方向と前記検光子の透過軸方向を垂直の関係にし、
前記2次元画像、前記3次元画像のいずれかまたは双方における、識別困難領域の発生を抑制し、
識別困難領域としては、以下の(イ)、(ロ)、(ハ)、(ニ)、(ホ)、(ヘ)、(ト)のいずれかを含む
(イ)はんだに含まれる透明物質または半透明物質に起因する識別困難領域
(ロ)基板上に設けたソルダーレジストの表面の形状が変化する場所に、発生する場合がある識別困難領域
(ハ)部品を実装するための金属の表面と、はんだの表面との間で発生する場合がある識別困難領域
(ニ)基板上に設けたコーティング層の表面の形状が変化する場所に、発生する場合がある識別困難領域
(ホ)錠剤の表面の形状が変化する場所に、発生する場合がある識別困難領域
(ヘ)メタルマスクの表面と、はんだの表面との間で発生する場合がある識別困難領域
(ト)メタルマスクの傷に起因する識別困難領域
ことを特徴とする検査装置。
An illuminating device for irradiating the imaging object with light;
An imaging device that receives reflected light from the imaging target based on the irradiation of the light; and
An imaging element that is present in the imaging device and receives the reflected light; and
In the inspection apparatus for acquiring either or both of the two-dimensional image and the three-dimensional image of the imaging target,
A polarizer is installed between the illumination device and the imaging target,
Installing an analyzer between the imaging object and the imaging device;
The transmission axis direction of the polarizer and the transmission axis direction of the analyzer are in a vertical relationship,
Suppressing the occurrence of difficult-to-identify regions in one or both of the two-dimensional image and the three-dimensional image,
The difficult-to-identify areas include any of the following (a), (b), (c), (d), (e), (f), (g) (a) a transparent substance contained in solder or Difficult identification area due to translucent material (b) Difficult identification area (c) Metal surface for mounting parts that may occur at the location where the surface shape of the solder resist provided on the substrate changes Difficult-to-identify areas that may occur between the solder surface (d) Difficult-to-identify areas that may occur in places where the shape of the surface of the coating layer provided on the substrate changes (e) The surface of the tablet Difficult-to-identify region (f) that may occur at the location where the shape of the metal changes (f) Due to scratches on the difficult-to-identify region (g) metal mask that may occur between the surface of the solder and the solder surface An inspection device characterized by a difficult-to-identify area.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013271567A JP5776949B2 (en) | 2012-12-31 | 2013-12-27 | Inspection method |
PCT/JP2013/085285 WO2014104375A1 (en) | 2012-12-31 | 2013-12-29 | Inspection device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012289279 | 2012-12-31 | ||
JP2012289279 | 2012-12-31 | ||
JP2013271567A JP5776949B2 (en) | 2012-12-31 | 2013-12-27 | Inspection method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014142339A JP2014142339A (en) | 2014-08-07 |
JP2014142339A5 true JP2014142339A5 (en) | 2015-04-02 |
JP5776949B2 JP5776949B2 (en) | 2015-09-09 |
Family
ID=51423734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013271567A Ceased JP5776949B2 (en) | 2012-12-31 | 2013-12-27 | Inspection method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5776949B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102250032B1 (en) * | 2014-12-29 | 2021-05-12 | 삼성디스플레이 주식회사 | Detecting device of display device and detecting method of display device |
US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
JP2019082853A (en) * | 2017-10-30 | 2019-05-30 | 日立造船株式会社 | Information processing device, information processing method, and information processing program |
TWI724370B (en) * | 2019-02-01 | 2021-04-11 | 由田新技股份有限公司 | An automatic optical inspection system, and method for measuring a hole structure |
JP6570211B1 (en) * | 2019-05-29 | 2019-09-04 | ヴィスコ・テクノロジーズ株式会社 | Appearance inspection device |
KR102329518B1 (en) * | 2020-06-24 | 2021-11-23 | 주식회사 크레셈 | Linear multi image obtaining method for high-speed inspection of large area substrate using area scan camera |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3186308B2 (en) * | 1993-03-10 | 2001-07-11 | 株式会社日立製作所 | Method and apparatus for monitoring sintering state of ceramic substrate |
JPH08271433A (en) * | 1995-03-30 | 1996-10-18 | Nikon Corp | Tablet inspection equipment |
JPH09201953A (en) * | 1996-01-29 | 1997-08-05 | Matsushita Electric Ind Co Ltd | Metal mask cleaning method for cream solder printer |
JPH10227623A (en) * | 1996-08-21 | 1998-08-25 | Komatsu Ltd | Device for inspecting semiconductor package |
JP2000046748A (en) * | 1998-07-27 | 2000-02-18 | Hitachi Ltd | Method and apparatus for inspecting conductor pattern and production of multilayered substrate |
JP3299193B2 (en) * | 1998-08-21 | 2002-07-08 | 日本電気株式会社 | Bump inspection method / apparatus, information storage medium |
JP5621178B2 (en) * | 2009-10-24 | 2014-11-05 | 株式会社第一メカテック | Appearance inspection device and printed solder inspection device |
-
2013
- 2013-12-27 JP JP2013271567A patent/JP5776949B2/en not_active Ceased
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