JP2019106479A5 - - Google Patents

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Publication number
JP2019106479A5
JP2019106479A5 JP2017238793A JP2017238793A JP2019106479A5 JP 2019106479 A5 JP2019106479 A5 JP 2019106479A5 JP 2017238793 A JP2017238793 A JP 2017238793A JP 2017238793 A JP2017238793 A JP 2017238793A JP 2019106479 A5 JP2019106479 A5 JP 2019106479A5
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JP
Japan
Prior art keywords
substrate
image sensor
rotation angle
predetermined
center position
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JP2017238793A
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English (en)
Japanese (ja)
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JP2019106479A (ja
JP7030497B2 (ja
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Priority claimed from JP2017238793A external-priority patent/JP7030497B2/ja
Priority to JP2017238793A priority Critical patent/JP7030497B2/ja
Priority to TW107138983A priority patent/TWI794325B/zh
Priority to KR1020180148148A priority patent/KR102497959B1/ko
Priority to CN201811515896.1A priority patent/CN110010521B/zh
Priority to US16/217,936 priority patent/US10991605B2/en
Publication of JP2019106479A publication Critical patent/JP2019106479A/ja
Publication of JP2019106479A5 publication Critical patent/JP2019106479A5/ja
Publication of JP7030497B2 publication Critical patent/JP7030497B2/ja
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JP2017238793A 2017-12-13 2017-12-13 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 Active JP7030497B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017238793A JP7030497B2 (ja) 2017-12-13 2017-12-13 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
TW107138983A TWI794325B (zh) 2017-12-13 2018-11-02 基板處理裝置、基板處理裝置的控制方法及儲存有程式的記憶媒體
KR1020180148148A KR102497959B1 (ko) 2017-12-13 2018-11-27 기판 처리 장치, 기판 처리 장치의 제어 방법, 프로그램을 저장한 기억 매체
CN201811515896.1A CN110010521B (zh) 2017-12-13 2018-12-11 基板处理装置、其控制方法、保存有程序的存储介质
US16/217,936 US10991605B2 (en) 2017-12-13 2018-12-12 Substrate processing device, method for controlling substrate processing device, and storage medium storing a program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017238793A JP7030497B2 (ja) 2017-12-13 2017-12-13 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体

Publications (3)

Publication Number Publication Date
JP2019106479A JP2019106479A (ja) 2019-06-27
JP2019106479A5 true JP2019106479A5 (enExample) 2020-09-03
JP7030497B2 JP7030497B2 (ja) 2022-03-07

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JP2017238793A Active JP7030497B2 (ja) 2017-12-13 2017-12-13 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体

Country Status (5)

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US (1) US10991605B2 (enExample)
JP (1) JP7030497B2 (enExample)
KR (1) KR102497959B1 (enExample)
CN (1) CN110010521B (enExample)
TW (1) TWI794325B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421340B2 (ja) * 2020-01-06 2024-01-24 株式会社荏原製作所 基板処理装置、および基板処理方法
JP7464472B2 (ja) * 2020-07-17 2024-04-09 株式会社ディスコ 加工装置
JP7517936B2 (ja) * 2020-10-01 2024-07-17 株式会社ディスコ 加工装置
US12237220B2 (en) 2021-04-15 2025-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for determining horizontal position of substrate using lasers
US11942341B2 (en) * 2022-01-26 2024-03-26 Asmpt Nexx, Inc. Adaptive focusing and transport system for electroplating
WO2025064070A1 (en) * 2023-09-22 2025-03-27 Applied Materials, Inc. Handling panel substrates
TWI886625B (zh) * 2023-11-02 2025-06-11 揚博科技股份有限公司 用於基板之影像檢測裝置

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JPH10329064A (ja) * 1997-05-29 1998-12-15 Mitsubishi Electric Corp 産業ロボット装置及び産業ロボットの制御方法
AU1351199A (en) * 1997-12-03 1999-06-16 Nikon Corporation Substrate transferring device and method
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP4117762B2 (ja) 2001-07-04 2008-07-16 松下電器産業株式会社 基板の位置決め方法と装置
JP3795820B2 (ja) 2002-03-27 2006-07-12 株式会社東芝 基板のアライメント装置
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JP2006214942A (ja) * 2005-02-04 2006-08-17 Ricoh Co Ltd 光ファイバープローブ、光検出装置及び光検出方法
JP4324606B2 (ja) 2006-08-10 2009-09-02 株式会社オーク製作所 アライメント装置および露光装置
JP5132904B2 (ja) 2006-09-05 2013-01-30 東京エレクトロン株式会社 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
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JP4744610B2 (ja) * 2009-01-20 2011-08-10 シーケーディ株式会社 三次元計測装置
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TWI580814B (zh) 2010-10-21 2017-05-01 荏原製作所股份有限公司 基板處理裝置，以及鍍覆裝置及鍍覆方法
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