JP2013101017A - 基板検査装置 - Google Patents

基板検査装置 Download PDF

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Publication number
JP2013101017A
JP2013101017A JP2011244200A JP2011244200A JP2013101017A JP 2013101017 A JP2013101017 A JP 2013101017A JP 2011244200 A JP2011244200 A JP 2011244200A JP 2011244200 A JP2011244200 A JP 2011244200A JP 2013101017 A JP2013101017 A JP 2013101017A
Authority
JP
Japan
Prior art keywords
inspection
substrate
inspected
carry
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011244200A
Other languages
English (en)
Japanese (ja)
Inventor
Yoichi Kishida
陽一 岸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2011244200A priority Critical patent/JP2013101017A/ja
Priority to CN2012104398818A priority patent/CN103084341A/zh
Priority to KR1020120124585A priority patent/KR101365097B1/ko
Priority to TW101141212A priority patent/TW201329471A/zh
Publication of JP2013101017A publication Critical patent/JP2013101017A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2011244200A 2011-11-08 2011-11-08 基板検査装置 Pending JP2013101017A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011244200A JP2013101017A (ja) 2011-11-08 2011-11-08 基板検査装置
CN2012104398818A CN103084341A (zh) 2011-11-08 2012-11-06 基板检查装置
KR1020120124585A KR101365097B1 (ko) 2011-11-08 2012-11-06 기판검사장치
TW101141212A TW201329471A (zh) 2011-11-08 2012-11-06 基板檢查裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011244200A JP2013101017A (ja) 2011-11-08 2011-11-08 基板検査装置

Publications (1)

Publication Number Publication Date
JP2013101017A true JP2013101017A (ja) 2013-05-23

Family

ID=48197760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011244200A Pending JP2013101017A (ja) 2011-11-08 2011-11-08 基板検査装置

Country Status (4)

Country Link
JP (1) JP2013101017A (zh)
KR (1) KR101365097B1 (zh)
CN (1) CN103084341A (zh)
TW (1) TW201329471A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150110327A (ko) * 2014-03-20 2015-10-02 니혼덴산리드가부시키가이샤 가요성 기판 검사 장치
CN105954672A (zh) * 2016-06-18 2016-09-21 东莞华贝电子科技有限公司 一种主板联测机及其测试方法
JP2021012117A (ja) * 2019-07-08 2021-02-04 ヤマハファインテック株式会社 電気検査装置及び保持ユニット

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105021938B (zh) * 2014-04-30 2018-11-09 佰欧特株式会社 检查装置
CN105214966A (zh) * 2015-09-29 2016-01-06 芜湖宏景电子股份有限公司 一种汽车电子板的高效率回收装置
JP6903862B2 (ja) * 2015-12-16 2021-07-14 株式会社リコー シート検査搬送装置及びシート検査・仕分け装置
CN105414043B (zh) * 2016-01-15 2018-12-11 深圳市晶磁材料技术有限公司 一种薄片型磁性材料的分选系统
CN106964560A (zh) * 2017-04-18 2017-07-21 成都蒲江珂贤科技有限公司 一种聚苯板检料机
JP7280068B2 (ja) * 2019-03-12 2023-05-23 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
JP7407629B2 (ja) * 2020-03-16 2024-01-04 東芝Ｉｔコントロールシステム株式会社 非破壊検査装置
CN113319973B (zh) * 2021-06-23 2022-08-30 江苏一言机械科技有限公司 一种高效快速的激光复合封边机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147045A (ja) * 1998-11-05 2000-05-26 Kyoei Sangyo Kk プリント配線板検査装置
KR100423945B1 (ko) * 2001-09-12 2004-03-22 미래산업 주식회사 반도체 소자 테스트용 핸들러
JP2004191166A (ja) * 2002-12-11 2004-07-08 Toppan Printing Co Ltd 毎葉もしくはテープ状基板の搬送機構及びそれを用いた検査装置
JP2008254883A (ja) * 2007-04-05 2008-10-23 Taiyo Kogyo Kk プリント基板の搬送装置、及び、検査装置
JP4803195B2 (ja) * 2008-03-14 2011-10-26 パナソニック株式会社 基板検査装置及び基板検査方法
KR20100067844A (ko) * 2008-12-12 2010-06-22 한미반도체 주식회사 반도체 패키지 검사장치
JP5461268B2 (ja) * 2010-03-29 2014-04-02 日置電機株式会社 基板検査システム
KR101177746B1 (ko) * 2010-04-09 2012-08-29 (주)제이티 소자검사장치

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150110327A (ko) * 2014-03-20 2015-10-02 니혼덴산리드가부시키가이샤 가요성 기판 검사 장치
JP2015184052A (ja) * 2014-03-20 2015-10-22 日本電産リード株式会社 可撓性基板検査装置
US9910084B2 (en) 2014-03-20 2018-03-06 Nidec-Read Corporation Flexible circuit board inspecting apparatus
KR102426032B1 (ko) * 2014-03-20 2022-07-28 니혼덴산리드가부시키가이샤 가요성 기판 검사 장치
CN105954672A (zh) * 2016-06-18 2016-09-21 东莞华贝电子科技有限公司 一种主板联测机及其测试方法
JP2021012117A (ja) * 2019-07-08 2021-02-04 ヤマハファインテック株式会社 電気検査装置及び保持ユニット
JP7371885B2 (ja) 2019-07-08 2023-10-31 ヤマハファインテック株式会社 電気検査装置及び保持ユニット

Also Published As

Publication number Publication date
TW201329471A (zh) 2013-07-16
CN103084341A (zh) 2013-05-08
KR20130050887A (ko) 2013-05-16
KR101365097B1 (ko) 2014-02-19

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