JP2013086217A - 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 - Google Patents

研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 Download PDF

Info

Publication number
JP2013086217A
JP2013086217A JP2011229669A JP2011229669A JP2013086217A JP 2013086217 A JP2013086217 A JP 2013086217A JP 2011229669 A JP2011229669 A JP 2011229669A JP 2011229669 A JP2011229669 A JP 2011229669A JP 2013086217 A JP2013086217 A JP 2013086217A
Authority
JP
Japan
Prior art keywords
polishing pad
polishing
urethane resin
resin composition
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011229669A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013086217A5 (enExample
Inventor
Yoshiyuki Oda
善之 小田
Hiroshi Suzaki
弘 須崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp, Dainippon Ink and Chemicals Co Ltd filed Critical DIC Corp
Priority to JP2011229669A priority Critical patent/JP2013086217A/ja
Priority to KR1020120103093A priority patent/KR20130043060A/ko
Priority to TW101134971A priority patent/TW201323496A/zh
Priority to CN201210397917.0A priority patent/CN103059551B/zh
Publication of JP2013086217A publication Critical patent/JP2013086217A/ja
Publication of JP2013086217A5 publication Critical patent/JP2013086217A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2011229669A 2011-10-19 2011-10-19 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 Pending JP2013086217A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011229669A JP2013086217A (ja) 2011-10-19 2011-10-19 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR1020120103093A KR20130043060A (ko) 2011-10-19 2012-09-18 연마 패드용 우레탄 수지 조성물 및 폴리우레탄 연마 패드
TW101134971A TW201323496A (zh) 2011-10-19 2012-09-24 拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊
CN201210397917.0A CN103059551B (zh) 2011-10-19 2012-10-18 研磨垫用氨基甲酸酯树脂组合物以及聚氨酯研磨垫

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011229669A JP2013086217A (ja) 2011-10-19 2011-10-19 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法

Publications (2)

Publication Number Publication Date
JP2013086217A true JP2013086217A (ja) 2013-05-13
JP2013086217A5 JP2013086217A5 (enExample) 2014-10-23

Family

ID=48102466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011229669A Pending JP2013086217A (ja) 2011-10-19 2011-10-19 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法

Country Status (4)

Country Link
JP (1) JP2013086217A (enExample)
KR (1) KR20130043060A (enExample)
CN (1) CN103059551B (enExample)
TW (1) TW201323496A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146892A1 (ja) * 2012-03-29 2013-10-03 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
CN104742031A (zh) * 2015-04-07 2015-07-01 蓝思科技（长沙）有限公司 一种调节研磨垫磨削切削力的组合物、方法及模具
JP2015208854A (ja) * 2014-04-25 2015-11-24 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械研磨パッド
JP2016112640A (ja) * 2014-12-15 2016-06-23 Dic株式会社 研磨パッド
WO2017217278A1 (ja) * 2016-06-16 2017-12-21 Dic株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
KR101949911B1 (ko) * 2017-09-11 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2019050365A1 (ko) * 2017-09-11 2019-03-14 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2020095832A1 (ja) * 2018-11-09 2020-05-14 株式会社クラレ 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
CN114874409A (zh) * 2022-04-26 2022-08-09 江苏利宏科技发展有限公司 一种基于聚醚多元醇的聚氨酯树脂及其制备方法
CN119426743A (zh) * 2025-01-10 2025-02-14 合肥真萍电子科技有限公司 一种晶圆级回流焊设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104261726B (zh) * 2014-09-18 2016-02-03 蓝思科技股份有限公司 一种光学玻璃双面精加工专用研磨垫及其制备方法
CN104772693B (zh) * 2015-04-20 2017-10-17 蓝思科技（长沙）有限公司 一种用于加工超硬陶瓷的金刚石研磨垫及其制备方法
SG11201704554SA (en) * 2016-04-06 2017-11-29 Kpx Chemical Co Ltd Method of manufacturing polishing pad
CN106985061A (zh) * 2017-03-21 2017-07-28 安徽禾臣新材料有限公司 一种适用于精打磨的吸附垫
JP7331453B2 (ja) * 2019-05-17 2023-08-23 Dic株式会社 多孔体の製造方法
CN111534079A (zh) * 2020-05-27 2020-08-14 安徽禾臣新材料有限公司 聚氨脂高抛研磨材料及其制备方法
CN112094493A (zh) * 2020-08-14 2020-12-18 沈阳化工大学 一种纳米改性热塑性聚氨酯弹性体抛光材料及其制备方法
CN112226192B (zh) * 2020-09-30 2022-06-28 深圳善跑体育产业集团有限公司 一种单组分热塑性聚氨酯胶粘剂及其制备方法
KR20230135081A (ko) * 2021-01-29 2023-09-22 가부시끼가이샤 도꾸야마 환상 다관능 모노머를 포함하는 경화성 조성물
CN114957965A (zh) * 2022-07-07 2022-08-30 福建长泰万泰矿物制品有限公司 一种高耐热聚氨酯组合物、聚氨酯盘及其制备方法
CN115319649B (zh) * 2022-09-03 2023-08-04 深圳市永霖科技有限公司 一种用于玻璃抛光pu抛光砂纸及其制备方法
CN116444977B (zh) * 2023-06-16 2023-09-05 山东一诺威聚氨酯股份有限公司 聚氨酯弹性体及利用其制备抛光磨块的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134445A (ja) * 2000-10-24 2002-05-10 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
JP2005068168A (ja) * 2003-08-21 2005-03-17 Kanebo Ltd ガラス研磨ポリウレタンパッド用２液型組成物、該組成物を用いたガラス研磨ポリウレタンパッド、及びその製造方法
US20100273399A1 (en) * 2009-04-23 2010-10-28 Cabot Microelectronics Corporation Cmp porous pad with particles in a polymeric matrix
WO2011001755A1 (ja) * 2009-06-29 2011-01-06 Dic株式会社 研磨パッド用２液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113662A (ja) * 2000-10-04 2002-04-16 Sinto Brator Co Ltd 回転テーブル及び噴射ノズルの制御方法
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US7598315B2 (en) * 2005-01-24 2009-10-06 Lubrizol Advanced Materials, Inc. Aqueous dispersions of nanoparticle/polyurethane composites
KR101352235B1 (ko) * 2009-05-27 2014-01-15 로저스코포레이션 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법
CN101812229B (zh) * 2010-04-02 2012-06-20 宜兴市新光科技有限公司 隔热减震防护膜及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134445A (ja) * 2000-10-24 2002-05-10 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
JP2005068168A (ja) * 2003-08-21 2005-03-17 Kanebo Ltd ガラス研磨ポリウレタンパッド用２液型組成物、該組成物を用いたガラス研磨ポリウレタンパッド、及びその製造方法
US20100273399A1 (en) * 2009-04-23 2010-10-28 Cabot Microelectronics Corporation Cmp porous pad with particles in a polymeric matrix
WO2011001755A1 (ja) * 2009-06-29 2011-01-06 Dic株式会社 研磨パッド用２液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146892A1 (ja) * 2012-03-29 2013-10-03 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2013202775A (ja) * 2012-03-29 2013-10-07 Fujibo Holdings Inc 研磨パッド及び研磨パッドの製造方法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US11396081B2 (en) 2014-04-25 2022-07-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP2015208854A (ja) * 2014-04-25 2015-11-24 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械研磨パッド
JP2016112640A (ja) * 2014-12-15 2016-06-23 Dic株式会社 研磨パッド
CN104742031A (zh) * 2015-04-07 2015-07-01 蓝思科技（长沙）有限公司 一种调节研磨垫磨削切削力的组合物、方法及模具
JPWO2017217278A1 (ja) * 2016-06-16 2018-11-08 Dic株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
WO2017217278A1 (ja) * 2016-06-16 2017-12-21 Dic株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
KR101949911B1 (ko) * 2017-09-11 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2019050365A1 (ko) * 2017-09-11 2019-03-14 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
US11642752B2 (en) 2017-09-11 2023-05-09 Sk Enpulse Co., Ltd. Porous polyurethane polishing pad and process for preparing the same
WO2020095832A1 (ja) * 2018-11-09 2020-05-14 株式会社クラレ 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法
JPWO2020095832A1 (ja) * 2018-11-09 2021-10-07 株式会社クラレ 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法
JP7104174B2 (ja) 2018-11-09 2022-07-20 株式会社クラレ 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
TWI791157B (zh) * 2019-07-12 2023-02-01 美商Ｃｍｃ材料股份有限公司 採用聚胺及環己烷二甲醇固化劑之研磨墊
CN114874409A (zh) * 2022-04-26 2022-08-09 江苏利宏科技发展有限公司 一种基于聚醚多元醇的聚氨酯树脂及其制备方法
CN119426743A (zh) * 2025-01-10 2025-02-14 合肥真萍电子科技有限公司 一种晶圆级回流焊设备

Also Published As

Publication number Publication date
CN103059551A (zh) 2013-04-24
KR20130043060A (ko) 2013-04-29
CN103059551B (zh) 2017-06-06
TW201323496A (zh) 2013-06-16

Similar Documents

Publication Publication Date Title
JP2013086217A (ja) 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
JP4636347B1 (ja) 研磨パッド用２液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法
JP4897082B2 (ja) ポリウレタン発泡体及び研磨パッド
JP6315246B2 (ja) 研磨パッド及びその製造方法
CN109311138B (zh) 研磨垫、研磨垫的制造方法和研磨方法
TWI492817B (zh) A polishing pad and its manufacturing method, and manufacturing method of a semiconductor device
WO2012141327A1 (ja) 研磨パッド及びその製造方法
WO2012141328A1 (ja) 研磨パッド及びその製造方法
TW201641546A (zh) 研磨墊及其製造方法
TWI787420B (zh) 研磨墊
JP2013194163A (ja) 研磨パッド用ポリウレタン樹脂組成物、ポリウレタン研磨パッド及びその製造方法
JP7405500B2 (ja) 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法
TWI532758B (zh) 研磨墊用胺基甲酸酯樹脂組成物、研磨墊及其製造方法
JP5078513B2 (ja) 研磨パッドおよび研磨パッドの製造方法
TWI461450B (zh) 研磨墊用２液型胺基甲酸酯樹脂組成物、使用它而成之聚胺基甲酸酯研磨墊、及聚胺基甲酸酯研磨墊之製法
WO2010038725A1 (ja) 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造法。
JP7135581B2 (ja) 研磨パッド及びその製造方法
TW201942175A (zh) 研磨墊、研磨墊之製造方法及光學材料或半導體材料之表面研磨方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140904

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140904

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150421

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150422

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150615

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150910