JP2013084849A - 基体処理システム用の基体搬送装置 - Google Patents
基体処理システム用の基体搬送装置 Download PDFInfo
- Publication number
- JP2013084849A JP2013084849A JP2011224996A JP2011224996A JP2013084849A JP 2013084849 A JP2013084849 A JP 2013084849A JP 2011224996 A JP2011224996 A JP 2011224996A JP 2011224996 A JP2011224996 A JP 2011224996A JP 2013084849 A JP2013084849 A JP 2013084849A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- space
- pipe
- inner hole
- optical window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 238000012546 transfer Methods 0.000 title claims abstract description 78
- 238000012545 processing Methods 0.000 title abstract description 46
- 230000003287 optical effect Effects 0.000 claims abstract description 70
- 239000007789 gas Substances 0.000 claims description 25
- 230000007723 transport mechanism Effects 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 37
- 238000005259 measurement Methods 0.000 abstract description 12
- 230000007246 mechanism Effects 0.000 abstract description 7
- 230000032258 transport Effects 0.000 description 77
- 238000004891 communication Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】基体搬送装置は、チャンバ壁12、テーブル14、リニアモータ搬送機構16、光学窓18、及び、レーザ計測器を備える。チャンバ壁は、搬送空間Sを画成する。テーブルは、搬送空間内に収容されている。当該テーブル上には基体を載置可能である。リニアモータ搬送機構は、搬送空間内においてリニアモータによりテーブルを移動させる。光学窓は、搬送空間と当該搬送空間の外部空間との間に設けられている。例えば、光学窓は、チャンバ壁に画成された開口を封止するように設けられる。レーザ計測器は、光学窓を介してテーブルに向けてレーザ光を照射し、テーブルからの反射光を受けて、テーブルの位置を計測する。
【選択図】図3
Description
Claims (8)
- 搬送空間を画成するチャンバ壁と、
前記搬送空間内に収容されたテーブルと、
前記搬送空間内において前記テーブルを移動させるためのリニアモータ搬送機構と、
前記搬送空間と該搬送空間の外部空間との間に設けられた光学窓と、
前記光学窓を介して前記テーブルに向けてレーザ光を照射し、前記テーブルからの反射光を受けて、前記テーブルの位置を計測するためのレーザ計測器と、
を備える基体搬送装置。 - 前記搬送空間は、減圧可能な搬送空間である、請求項1に記載の基体搬送装置。
- 前記光学窓と前記搬送空間とを光学的に接続するパイプを更に備え、
前記レーザ計測器は、前記光学窓及び前記パイプの内孔を介して前記レーザ光を照射し、前記反射光を前記パイプの内孔及び前記光学窓を介して受ける、
請求項1又は2に記載の基体搬送装置。 - 前記パイプは、前記内孔を画成する内面を含み、
前記内面の少なくとも一部は、0.1mm〜3mmの凹凸を有する、
請求項3に記載の基体搬送装置。 - 前記パイプは、前記内孔を画成する内面を含み、
前記内面は、多孔質面である、
請求項3に記載の基体搬送装置。 - 前記パイプの前記内孔は、該パイプの長手方向に沿って第1の内径を有する部分と、前記第1の内径より小径の第2の内径を有する部分と、を含む、請求項3〜5の何れか一項に記載の基体搬送装置。
- 前記内孔は、蛇行する経路に沿って画成されており、
前記パイプの内孔には、該内孔の一端と該内孔の他端とを光学的に結合する一以上の光学ミラーが設けられている、
請求項3に記載の基体搬送装置。 - 前記パイプの前記内孔に不活性ガスを供給するガス供給路を更に含む、請求項1〜7の何れか一項に記載の基体搬送装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011224996A JP5689047B2 (ja) | 2011-10-12 | 2011-10-12 | 基体処理システム用の基体搬送装置 |
PCT/JP2012/075533 WO2013054698A1 (ja) | 2011-10-12 | 2012-10-02 | 基体処理システム用の基体搬送装置 |
US14/351,044 US9230840B2 (en) | 2011-10-12 | 2012-10-02 | Substrate transfer device for substrate processing system |
KR1020147009558A KR101967940B1 (ko) | 2011-10-12 | 2012-10-02 | 기체 처리 시스템용 기체 반송 장치 |
TW101137384A TWI482729B (zh) | 2011-10-12 | 2012-10-11 | A substrate transport device for use in a substrate processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011224996A JP5689047B2 (ja) | 2011-10-12 | 2011-10-12 | 基体処理システム用の基体搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013084849A true JP2013084849A (ja) | 2013-05-09 |
JP5689047B2 JP5689047B2 (ja) | 2015-03-25 |
Family
ID=48081755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011224996A Active JP5689047B2 (ja) | 2011-10-12 | 2011-10-12 | 基体処理システム用の基体搬送装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9230840B2 (ja) |
JP (1) | JP5689047B2 (ja) |
KR (1) | KR101967940B1 (ja) |
TW (1) | TWI482729B (ja) |
WO (1) | WO2013054698A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10476354B2 (en) * | 2011-09-16 | 2019-11-12 | Persimmon Technologies Corp. | Robot drive with isolated optical encoder |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06100164A (ja) * | 1992-08-27 | 1994-04-12 | Hitachi Ltd | 磁気的に結合された搬送装置 |
JPH10289943A (ja) * | 1997-04-16 | 1998-10-27 | Canon Inc | ステージ装置およびデバイス製造方法 |
JP2001126977A (ja) * | 1999-10-27 | 2001-05-11 | Nikon Corp | ステージ装置および露光装置ならびに回路デバイス製造方法 |
JP2003254739A (ja) * | 2002-03-01 | 2003-09-10 | Canon Inc | 位置決め装置及びその制御方法、並びに露光装置、並びにその制御方法により制御される露光装置により半導体デバイスを製造する製造方法 |
JP2005223163A (ja) * | 2004-02-06 | 2005-08-18 | Hitachi High-Technologies Corp | ステージ制御装置,ステージ制御方法、および製造装置 |
JP2006253386A (ja) * | 2005-03-10 | 2006-09-21 | Nsk Ltd | 位置決め装置 |
JP2009158974A (ja) * | 2003-02-17 | 2009-07-16 | Nikon Corp | ステージ装置及び露光装置、並びにデバイス製造方法 |
JP2010040945A (ja) * | 2008-08-07 | 2010-02-18 | Sinfonia Technology Co Ltd | 真空処理装置 |
JP2010040946A (ja) * | 2008-08-07 | 2010-02-18 | Sinfonia Technology Co Ltd | 真空処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3628028A (en) * | 1968-03-01 | 1971-12-14 | Honeywell Inc | Window cleaning apparatus for photometric instruments |
US5306209A (en) * | 1992-05-04 | 1994-04-26 | Lang Fred D | Contaminant shield for viewing ports |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP4363064B2 (ja) | 2003-03-07 | 2009-11-11 | 株式会社安川電機 | 真空内駆動装置およびこれを用いた基板搬送装置 |
JP2008151542A (ja) * | 2006-12-14 | 2008-07-03 | Canon Inc | ステージ装置、制御システム、露光装置及びデバイス製造方法 |
JP2010070946A (ja) | 2008-09-17 | 2010-04-02 | Taisuke Otsubo | 床支持ボルトおよび床支持装置 |
JP5548375B2 (ja) * | 2009-03-23 | 2014-07-16 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
US9417122B2 (en) * | 2012-06-15 | 2016-08-16 | Empire Technology Development Llc | Self-cleaning lens |
-
2011
- 2011-10-12 JP JP2011224996A patent/JP5689047B2/ja active Active
-
2012
- 2012-10-02 US US14/351,044 patent/US9230840B2/en active Active
- 2012-10-02 WO PCT/JP2012/075533 patent/WO2013054698A1/ja active Application Filing
- 2012-10-02 KR KR1020147009558A patent/KR101967940B1/ko active IP Right Grant
- 2012-10-11 TW TW101137384A patent/TWI482729B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06100164A (ja) * | 1992-08-27 | 1994-04-12 | Hitachi Ltd | 磁気的に結合された搬送装置 |
JPH10289943A (ja) * | 1997-04-16 | 1998-10-27 | Canon Inc | ステージ装置およびデバイス製造方法 |
JP2001126977A (ja) * | 1999-10-27 | 2001-05-11 | Nikon Corp | ステージ装置および露光装置ならびに回路デバイス製造方法 |
JP2003254739A (ja) * | 2002-03-01 | 2003-09-10 | Canon Inc | 位置決め装置及びその制御方法、並びに露光装置、並びにその制御方法により制御される露光装置により半導体デバイスを製造する製造方法 |
JP2009158974A (ja) * | 2003-02-17 | 2009-07-16 | Nikon Corp | ステージ装置及び露光装置、並びにデバイス製造方法 |
JP2005223163A (ja) * | 2004-02-06 | 2005-08-18 | Hitachi High-Technologies Corp | ステージ制御装置,ステージ制御方法、および製造装置 |
JP2006253386A (ja) * | 2005-03-10 | 2006-09-21 | Nsk Ltd | 位置決め装置 |
JP2010040945A (ja) * | 2008-08-07 | 2010-02-18 | Sinfonia Technology Co Ltd | 真空処理装置 |
JP2010040946A (ja) * | 2008-08-07 | 2010-02-18 | Sinfonia Technology Co Ltd | 真空処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US9230840B2 (en) | 2016-01-05 |
WO2013054698A1 (ja) | 2013-04-18 |
TWI482729B (zh) | 2015-05-01 |
US20140271052A1 (en) | 2014-09-18 |
KR20140072094A (ko) | 2014-06-12 |
KR101967940B1 (ko) | 2019-04-10 |
JP5689047B2 (ja) | 2015-03-25 |
TW201345814A (zh) | 2013-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112255889B (zh) | 基板处理装置和基板处理方法 | |
US20080128374A1 (en) | Overhead traveling and transporting apparatus | |
JP7425019B2 (ja) | 点検システム | |
JP4296914B2 (ja) | 位置教示装置及びそれを備えた搬送システム | |
EP2940721B1 (en) | Wafer mapping apparatus and load port including same | |
KR20070092137A (ko) | 기판 처리 장치, 기판 처리 조건 검토 방법 및 기억 매체 | |
KR20120100795A (ko) | 성막장치 | |
JP2007227781A (ja) | 基板の位置ずれ検査機構,処理システム及び基板の位置ずれ検査方法 | |
US10645289B2 (en) | Optical apparatus and vibration removing method | |
JP5689047B2 (ja) | 基体処理システム用の基体搬送装置 | |
US9594014B2 (en) | Installation structure of length meter for measuring a displacement of an object placed in vacuum | |
US9043020B2 (en) | Method for determining substrate transportation path, substrate transporting apparatus, substrate processing apparatus and computer-readable storage medium storing a program for performing the method | |
JP2010283334A (ja) | 基板処理装置及び半導体装置の製造方法 | |
WO2013121919A1 (ja) | 基板処理装置及び基板処理方法 | |
JP2007194332A (ja) | 基板検出センサ及び基板検出方法 | |
WO2003062806A1 (fr) | Dispositif d'inspection utilisant un microscope electronique a balayage | |
JP2008130369A (ja) | 真空装置 | |
JP2010040946A (ja) | 真空処理装置 | |
KR20210075008A (ko) | 반송하는 시스템 및 방법 | |
JP2014175527A (ja) | 基板位置検出システムおよびこれを備えた半導体製造装置 | |
US20230019109A1 (en) | Sonar sensor in processing chamber | |
CN218158369U (zh) | 检测装置及处理设备 | |
US20220367223A1 (en) | Substrate transport apparatus and substrate transport method | |
WO2022142113A1 (zh) | 腔室装置、晶片输送设备和晶片处理方法 | |
JP2005277129A (ja) | 搬送装置、回路パターンの製造装置、及び回路パターンの検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141007 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141121 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150127 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5689047 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |