JP2013004984A5 - - Google Patents

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Publication number
JP2013004984A5
JP2013004984A5 JP2012135669A JP2012135669A JP2013004984A5 JP 2013004984 A5 JP2013004984 A5 JP 2013004984A5 JP 2012135669 A JP2012135669 A JP 2012135669A JP 2012135669 A JP2012135669 A JP 2012135669A JP 2013004984 A5 JP2013004984 A5 JP 2013004984A5
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JP
Japan
Prior art keywords
carrier
semiconductor package
grid array
seat
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012135669A
Other languages
English (en)
Japanese (ja)
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JP2013004984A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2013004984A publication Critical patent/JP2013004984A/ja
Publication of JP2013004984A5 publication Critical patent/JP2013004984A5/ja
Pending legal-status Critical Current

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JP2012135669A 2011-06-17 2012-06-15 半導体パッケージ Pending JP2013004984A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161497966P 2011-06-17 2011-06-17
US61/497,966 2011-06-17

Publications (2)

Publication Number Publication Date
JP2013004984A JP2013004984A (ja) 2013-01-07
JP2013004984A5 true JP2013004984A5 (enExample) 2015-05-21

Family

ID=46087515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012135669A Pending JP2013004984A (ja) 2011-06-17 2012-06-15 半導体パッケージ

Country Status (3)

Country Link
US (1) US8981546B2 (enExample)
EP (1) EP2535926A3 (enExample)
JP (1) JP2013004984A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104966708B (zh) 2015-07-01 2018-06-12 英特尔公司 半导体封装结构
US10916529B2 (en) * 2018-03-29 2021-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Electronics card including multi-chip module
EP3603740A1 (de) * 2018-08-02 2020-02-05 BIOTRONIK SE & Co. KG Implantat
GB2600918B (en) * 2020-10-30 2022-11-23 Npl Management Ltd Ion microtrap assembly and method of making of making such an assembly

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
US5334857A (en) * 1992-04-06 1994-08-02 Motorola, Inc. Semiconductor device with test-only contacts and method for making the same
JP3150560B2 (ja) * 1995-03-07 2001-03-26 松下電子工業株式会社 半導体装置
JP3447908B2 (ja) * 1997-02-13 2003-09-16 富士通株式会社 ボールグリッドアレイパッケージ
JP3052874B2 (ja) * 1997-02-19 2000-06-19 日本電気株式会社 Ｂｇａ型半導体装置のプローブ装置
JPH1117058A (ja) * 1997-06-26 1999-01-22 Nec Corp Ｂｇａパッケージ、その試験用ソケットおよびｂｇａパッケージの試験方法
US20040135242A1 (en) * 2003-01-09 2004-07-15 Hsin Chung Hsien Stacked structure of chips
US7100814B2 (en) * 2004-02-18 2006-09-05 Cardiac Pacemakers, Inc. Method for preparing integrated circuit modules for attachment to printed circuit substrates
JP4322844B2 (ja) * 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
JP4947054B2 (ja) * 2006-09-19 2012-06-06 パナソニック株式会社 ソケットおよびモジュール基板およびそれを用いる検査システム
JP2008277595A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

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