JP2014531134A5 - - Google Patents

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Publication number
JP2014531134A5
JP2014531134A5 JP2014537171A JP2014537171A JP2014531134A5 JP 2014531134 A5 JP2014531134 A5 JP 2014531134A5 JP 2014537171 A JP2014537171 A JP 2014537171A JP 2014537171 A JP2014537171 A JP 2014537171A JP 2014531134 A5 JP2014531134 A5 JP 2014531134A5
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JP
Japan
Prior art keywords
microelectronic
chip
package
semiconductor chip
microelectronic device
Prior art date
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Application number
JP2014537171A
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English (en)
Japanese (ja)
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JP6061937B2 (ja
JP2014531134A (ja
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Publication date
Priority claimed from US13/277,330 external-priority patent/US8723327B2/en
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Publication of JP2014531134A publication Critical patent/JP2014531134A/ja
Publication of JP2014531134A5 publication Critical patent/JP2014531134A5/ja
Application granted granted Critical
Publication of JP6061937B2 publication Critical patent/JP6061937B2/ja
Active legal-status Critical Current
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JP2014537171A 2011-10-20 2012-10-17 積層された超小型電子装置を有する超小型電子パッケージ及びその製造方法 Active JP6061937B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/277,330 US8723327B2 (en) 2011-10-20 2011-10-20 Microelectronic package with stacked microelectronic units and method for manufacture thereof
US13/277,330 2011-10-20
PCT/US2012/060585 WO2013059297A1 (en) 2011-10-20 2012-10-17 Microelectronic package with stacked microelectronic units and method for manufacture thereof

Publications (3)

Publication Number Publication Date
JP2014531134A JP2014531134A (ja) 2014-11-20
JP2014531134A5 true JP2014531134A5 (enExample) 2015-12-03
JP6061937B2 JP6061937B2 (ja) 2017-01-18

Family

ID=47215738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014537171A Active JP6061937B2 (ja) 2011-10-20 2012-10-17 積層された超小型電子装置を有する超小型電子パッケージ及びその製造方法

Country Status (6)

Country Link
US (4) US8723327B2 (enExample)
EP (1) EP2769412B1 (enExample)
JP (1) JP6061937B2 (enExample)
KR (1) KR101904409B1 (enExample)
TW (1) TWI463635B (enExample)
WO (1) WO2013059297A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8553420B2 (en) 2010-10-19 2013-10-08 Tessera, Inc. Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
US9013033B2 (en) 2011-04-21 2015-04-21 Tessera, Inc. Multiple die face-down stacking for two or more die
US8304881B1 (en) 2011-04-21 2012-11-06 Tessera, Inc. Flip-chip, face-up and face-down wirebond combination package
US8952516B2 (en) 2011-04-21 2015-02-10 Tessera, Inc. Multiple die stacking for two or more die
US8633576B2 (en) * 2011-04-21 2014-01-21 Tessera, Inc. Stacked chip-on-board module with edge connector
US8928153B2 (en) 2011-04-21 2015-01-06 Tessera, Inc. Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8970028B2 (en) 2011-12-29 2015-03-03 Invensas Corporation Embedded heat spreader for package with multiple microelectronic elements and face-down connection
US8723327B2 (en) 2011-10-20 2014-05-13 Invensas Corporation Microelectronic package with stacked microelectronic units and method for manufacture thereof
US8709868B2 (en) * 2012-08-23 2014-04-29 Freescale Semiconductor, Inc. Sensor packages and method of packaging dies of differing sizes
US9401338B2 (en) * 2012-11-29 2016-07-26 Freescale Semiconductor, Inc. Electronic devices with embedded die interconnect structures, and methods of manufacture thereof
US9472533B2 (en) * 2013-11-20 2016-10-18 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming wire bondable fan-out EWLB package
TWI649856B (zh) * 2016-05-13 2019-02-01 精材科技股份有限公司 晶片封裝體與其製造方法
CN112117242B (zh) * 2019-06-20 2023-01-31 江苏长电科技股份有限公司 芯片封装结构及其制造方法
KR102699633B1 (ko) * 2019-06-25 2024-08-29 삼성전자주식회사 반도체 장치 및 그 제조 방법
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5422435A (en) 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
US5998864A (en) 1995-05-26 1999-12-07 Formfactor, Inc. Stacking semiconductor devices, particularly memory chips
JP3644662B2 (ja) * 1997-10-29 2005-05-11 株式会社ルネサステクノロジ 半導体モジュール
JP3481444B2 (ja) 1998-01-14 2003-12-22 シャープ株式会社 半導体装置及びその製造方法
DE10023823A1 (de) 2000-05-15 2001-12-06 Infineon Technologies Ag Multichip-Gehäuse
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
US7049691B2 (en) * 2002-10-08 2006-05-23 Chippac, Inc. Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package
JP2005353837A (ja) 2004-06-10 2005-12-22 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
DE102005006333B4 (de) 2005-02-10 2007-10-18 Infineon Technologies Ag Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben
US20060202317A1 (en) 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
US7402911B2 (en) 2005-06-28 2008-07-22 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
TWI263313B (en) * 2005-08-15 2006-10-01 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board
KR100681263B1 (ko) 2006-01-17 2007-02-09 삼성전자주식회사 반도체 패키지
KR100885419B1 (ko) 2006-04-26 2009-02-24 삼성전자주식회사 적층형 패키지 구조체
US8384199B2 (en) * 2007-06-25 2013-02-26 Epic Technologies, Inc. Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
US20090001529A1 (en) * 2007-06-27 2009-01-01 Ming Hsun Lee Package stacking using unbalanced molded tsop
US8299626B2 (en) 2007-08-16 2012-10-30 Tessera, Inc. Microelectronic package
KR20090055316A (ko) * 2007-11-28 2009-06-02 삼성전자주식회사 반도체 패키지와, 이를 구비하는 전자 기기 및 반도체패키지의 제조방법
US8531043B2 (en) * 2008-09-23 2013-09-10 Stats Chippac Ltd. Planar encapsulation and mold cavity package in package system
US8026589B1 (en) * 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US8169065B2 (en) * 2009-12-22 2012-05-01 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
US8487421B2 (en) 2011-08-01 2013-07-16 Tessera, Inc. Microelectronic package with stacked microelectronic elements and method for manufacture thereof
US8723327B2 (en) * 2011-10-20 2014-05-13 Invensas Corporation Microelectronic package with stacked microelectronic units and method for manufacture thereof

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