JP6061937B2 - 積層された超小型電子装置を有する超小型電子パッケージ及びその製造方法 - Google Patents

積層された超小型電子装置を有する超小型電子パッケージ及びその製造方法 Download PDF

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JP6061937B2
JP6061937B2 JP2014537171A JP2014537171A JP6061937B2 JP 6061937 B2 JP6061937 B2 JP 6061937B2 JP 2014537171 A JP2014537171 A JP 2014537171A JP 2014537171 A JP2014537171 A JP 2014537171A JP 6061937 B2 JP6061937 B2 JP 6061937B2
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microelectronic
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microelectronic device
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JP2014531134A (ja
JP2014531134A5 (enExample
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キャスキー，テレンス
モハメッド，イリヤス
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インヴェンサス・コーポレイション
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    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1431—Logic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1434—Memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/186—Material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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JP2014537171A 2011-10-20 2012-10-17 積層された超小型電子装置を有する超小型電子パッケージ及びその製造方法 Active JP6061937B2 (ja)

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US13/277,330 US8723327B2 (en) 2011-10-20 2011-10-20 Microelectronic package with stacked microelectronic units and method for manufacture thereof
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PCT/US2012/060585 WO2013059297A1 (en) 2011-10-20 2012-10-17 Microelectronic package with stacked microelectronic units and method for manufacture thereof

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US20160035712A1 (en) 2016-02-04
KR20140085520A (ko) 2014-07-07
US8723327B2 (en) 2014-05-13
EP2769412A1 (en) 2014-08-27
US9583475B2 (en) 2017-02-28
KR101904409B1 (ko) 2018-10-05
EP2769412B1 (en) 2019-02-20
US9165911B2 (en) 2015-10-20
TWI463635B (zh) 2014-12-01
JP2014531134A (ja) 2014-11-20
US20130099387A1 (en) 2013-04-25
TW201322419A (zh) 2013-06-01
WO2013059297A1 (en) 2013-04-25
US20170141094A1 (en) 2017-05-18
US9876002B2 (en) 2018-01-23
US20140212996A1 (en) 2014-07-31

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