JP2012069618A5 - - Google Patents
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- Publication number
- JP2012069618A5 JP2012069618A5 JP2010211641A JP2010211641A JP2012069618A5 JP 2012069618 A5 JP2012069618 A5 JP 2012069618A5 JP 2010211641 A JP2010211641 A JP 2010211641A JP 2010211641 A JP2010211641 A JP 2010211641A JP 2012069618 A5 JP2012069618 A5 JP 2012069618A5
- Authority
- JP
- Japan
- Prior art keywords
- package substrate
- semiconductor chip
- vias
- system board
- configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010211641A JP5581933B2 (ja) | 2010-09-22 | 2010-09-22 | パッケージ基板及びこれを用いたモジュール並びに電気・電子機器 |
| TW100128424A TW201214647A (en) | 2010-09-22 | 2011-08-09 | Package substrate, module and electric/electronic devices using the same |
| KR1020110086435A KR20120031121A (ko) | 2010-09-22 | 2011-08-29 | 패키지 기판 및 이것을 이용한 모듈 및 전기/전자 기기 |
| US13/231,518 US8866277B2 (en) | 2010-09-22 | 2011-09-13 | Package substrate, module and electric/electronic devices using the same |
| CN2011102742479A CN102412209A (zh) | 2010-09-22 | 2011-09-15 | 封装基板及使用该封装基板的模块和电气/电子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010211641A JP5581933B2 (ja) | 2010-09-22 | 2010-09-22 | パッケージ基板及びこれを用いたモジュール並びに電気・電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012069618A JP2012069618A (ja) | 2012-04-05 |
| JP2012069618A5 true JP2012069618A5 (enExample) | 2013-09-19 |
| JP5581933B2 JP5581933B2 (ja) | 2014-09-03 |
Family
ID=45817006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010211641A Expired - Fee Related JP5581933B2 (ja) | 2010-09-22 | 2010-09-22 | パッケージ基板及びこれを用いたモジュール並びに電気・電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8866277B2 (enExample) |
| JP (1) | JP5581933B2 (enExample) |
| KR (1) | KR20120031121A (enExample) |
| CN (1) | CN102412209A (enExample) |
| TW (1) | TW201214647A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9368477B2 (en) * | 2012-08-27 | 2016-06-14 | Invensas Corporation | Co-support circuit panel and microelectronic packages |
| US8987872B2 (en) * | 2013-03-11 | 2015-03-24 | Qualcomm Incorporated | Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages |
| US8901748B2 (en) * | 2013-03-14 | 2014-12-02 | Intel Corporation | Direct external interconnect for embedded interconnect bridge package |
| US9955568B2 (en) | 2014-01-24 | 2018-04-24 | Dell Products, Lp | Structure to dampen barrel resonance of unused portion of printed circuit board via |
| US9824990B2 (en) * | 2014-06-12 | 2017-11-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad design for reliability enhancement in packages |
| US9650242B2 (en) * | 2015-09-22 | 2017-05-16 | International Business Machines Corporation | Multi-faced component-based electromechanical device |
| US10164002B2 (en) * | 2016-11-29 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and layout method |
| US10431537B1 (en) * | 2018-06-21 | 2019-10-01 | Intel Corporation | Electromigration resistant and profile consistent contact arrays |
| US11488901B2 (en) * | 2020-04-29 | 2022-11-01 | Advanced Semiconductor Engineering, Inc. | Package structure and method for manufacturing the same |
| CN115377051B (zh) * | 2022-08-25 | 2025-03-25 | 飞腾信息技术有限公司 | 封装基板、封装基板设计方法及相关设备 |
| US20240145364A1 (en) * | 2022-11-02 | 2024-05-02 | Stmicroelectronics S.R.L. | Semiconductor device and corresponding method |
| EP4372812A1 (en) * | 2022-11-16 | 2024-05-22 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Defining distribution of wiring elements compliant with target current-related value in component carrier with rows of equidistant wiring elements |
| WO2024104845A1 (en) * | 2022-11-16 | 2024-05-23 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with mutually offset rows of equidistant wiring elements |
| US12389538B2 (en) * | 2023-01-26 | 2025-08-12 | Hewlett Packard Enterprise Development Lp | Varying diameters of power-vias in a PCB based on via location |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5665473A (en) * | 1994-09-16 | 1997-09-09 | Tokuyama Corporation | Package for mounting a semiconductor device |
| JP2004134679A (ja) * | 2002-10-11 | 2004-04-30 | Dainippon Printing Co Ltd | コア基板とその製造方法、および多層配線基板 |
| JP4534062B2 (ja) * | 2005-04-19 | 2010-09-01 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2007201030A (ja) * | 2006-01-25 | 2007-08-09 | Fujitsu Ltd | 電子デバイス |
| JP2007221014A (ja) * | 2006-02-20 | 2007-08-30 | Hitachi Ltd | 多層配線基板構造 |
| JP5165912B2 (ja) * | 2007-03-15 | 2013-03-21 | 株式会社日立製作所 | 低ノイズ半導体装置 |
| TWI416673B (zh) * | 2007-03-30 | 2013-11-21 | 住友電木股份有限公司 | 覆晶半導體封裝用之接續構造、增層材料、密封樹脂組成物及電路基板 |
-
2010
- 2010-09-22 JP JP2010211641A patent/JP5581933B2/ja not_active Expired - Fee Related
-
2011
- 2011-08-09 TW TW100128424A patent/TW201214647A/zh unknown
- 2011-08-29 KR KR1020110086435A patent/KR20120031121A/ko not_active Withdrawn
- 2011-09-13 US US13/231,518 patent/US8866277B2/en not_active Expired - Fee Related
- 2011-09-15 CN CN2011102742479A patent/CN102412209A/zh active Pending
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