TW201214647A - Package substrate, module and electric/electronic devices using the same - Google Patents

Package substrate, module and electric/electronic devices using the same Download PDF

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Publication number
TW201214647A
TW201214647A TW100128424A TW100128424A TW201214647A TW 201214647 A TW201214647 A TW 201214647A TW 100128424 A TW100128424 A TW 100128424A TW 100128424 A TW100128424 A TW 100128424A TW 201214647 A TW201214647 A TW 201214647A
Authority
TW
Taiwan
Prior art keywords
package substrate
region
conductive layer
resistance
layer
Prior art date
Application number
TW100128424A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuhiro Hanabe
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW201214647A publication Critical patent/TW201214647A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW100128424A 2010-09-22 2011-08-09 Package substrate, module and electric/electronic devices using the same TW201214647A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010211641A JP5581933B2 (ja) 2010-09-22 2010-09-22 パッケージ基板及びこれを用いたモジュール並びに電気・電子機器

Publications (1)

Publication Number Publication Date
TW201214647A true TW201214647A (en) 2012-04-01

Family

ID=45817006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100128424A TW201214647A (en) 2010-09-22 2011-08-09 Package substrate, module and electric/electronic devices using the same

Country Status (5)

Country Link
US (1) US8866277B2 (enExample)
JP (1) JP5581933B2 (enExample)
KR (1) KR20120031121A (enExample)
CN (1) CN102412209A (enExample)
TW (1) TW201214647A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570732B (zh) * 2012-08-27 2017-02-11 英帆薩斯公司 共支撐電路板和微電子封裝

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987872B2 (en) * 2013-03-11 2015-03-24 Qualcomm Incorporated Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
US8901748B2 (en) * 2013-03-14 2014-12-02 Intel Corporation Direct external interconnect for embedded interconnect bridge package
US9955568B2 (en) 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
US9824990B2 (en) * 2014-06-12 2017-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad design for reliability enhancement in packages
US9650242B2 (en) * 2015-09-22 2017-05-16 International Business Machines Corporation Multi-faced component-based electromechanical device
US10164002B2 (en) * 2016-11-29 2018-12-25 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and layout method
US10431537B1 (en) * 2018-06-21 2019-10-01 Intel Corporation Electromigration resistant and profile consistent contact arrays
US11488901B2 (en) * 2020-04-29 2022-11-01 Advanced Semiconductor Engineering, Inc. Package structure and method for manufacturing the same
CN115377051B (zh) * 2022-08-25 2025-03-25 飞腾信息技术有限公司 封装基板、封装基板设计方法及相关设备
US20240145364A1 (en) * 2022-11-02 2024-05-02 Stmicroelectronics S.R.L. Semiconductor device and corresponding method
EP4372812A1 (en) * 2022-11-16 2024-05-22 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Defining distribution of wiring elements compliant with target current-related value in component carrier with rows of equidistant wiring elements
WO2024104845A1 (en) * 2022-11-16 2024-05-23 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with mutually offset rows of equidistant wiring elements
US12389538B2 (en) * 2023-01-26 2025-08-12 Hewlett Packard Enterprise Development Lp Varying diameters of power-vias in a PCB based on via location

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5665473A (en) * 1994-09-16 1997-09-09 Tokuyama Corporation Package for mounting a semiconductor device
JP2004134679A (ja) * 2002-10-11 2004-04-30 Dainippon Printing Co Ltd コア基板とその製造方法、および多層配線基板
JP4534062B2 (ja) * 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
JP2007201030A (ja) * 2006-01-25 2007-08-09 Fujitsu Ltd 電子デバイス
JP2007221014A (ja) * 2006-02-20 2007-08-30 Hitachi Ltd 多層配線基板構造
JP5165912B2 (ja) * 2007-03-15 2013-03-21 株式会社日立製作所 低ノイズ半導体装置
TWI416673B (zh) * 2007-03-30 2013-11-21 住友電木股份有限公司 覆晶半導體封裝用之接續構造、增層材料、密封樹脂組成物及電路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570732B (zh) * 2012-08-27 2017-02-11 英帆薩斯公司 共支撐電路板和微電子封裝

Also Published As

Publication number Publication date
KR20120031121A (ko) 2012-03-30
CN102412209A (zh) 2012-04-11
US8866277B2 (en) 2014-10-21
US20120068322A1 (en) 2012-03-22
JP2012069618A (ja) 2012-04-05
JP5581933B2 (ja) 2014-09-03

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