JP2012526688A5 - - Google Patents

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Publication number
JP2012526688A5
JP2012526688A5 JP2012510965A JP2012510965A JP2012526688A5 JP 2012526688 A5 JP2012526688 A5 JP 2012526688A5 JP 2012510965 A JP2012510965 A JP 2012510965A JP 2012510965 A JP2012510965 A JP 2012510965A JP 2012526688 A5 JP2012526688 A5 JP 2012526688A5
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JP
Japan
Prior art keywords
polymer
alkyl
substituted
unsubstituted aryl
composite film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012510965A
Other languages
English (en)
Japanese (ja)
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JP2012526688A (ja
Filing date
Publication date
Priority claimed from US12/465,128 external-priority patent/US8440292B2/en
Application filed filed Critical
Publication of JP2012526688A publication Critical patent/JP2012526688A/ja
Publication of JP2012526688A5 publication Critical patent/JP2012526688A5/ja
Pending legal-status Critical Current

Links

JP2012510965A 2009-05-13 2010-05-12 フレキシブルプリント回路用の多層品 Pending JP2012526688A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/465,128 US8440292B2 (en) 2009-05-13 2009-05-13 Multi-layer article for flexible printed circuits
US12/465,128 2009-05-13
PCT/US2010/034475 WO2010132522A2 (en) 2009-05-13 2010-05-12 Multi-layer article for flexible printed circuits

Publications (2)

Publication Number Publication Date
JP2012526688A JP2012526688A (ja) 2012-11-01
JP2012526688A5 true JP2012526688A5 (OSRAM) 2013-06-20

Family

ID=43068742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012510965A Pending JP2012526688A (ja) 2009-05-13 2010-05-12 フレキシブルプリント回路用の多層品

Country Status (6)

Country Link
US (1) US8440292B2 (OSRAM)
EP (1) EP2429815A2 (OSRAM)
JP (1) JP2012526688A (OSRAM)
KR (1) KR20120026538A (OSRAM)
CN (1) CN102421596A (OSRAM)
WO (1) WO2010132522A2 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
US8784980B2 (en) * 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
US8288466B2 (en) * 2009-05-13 2012-10-16 E I Du Pont De Nemours And Company Composite of a polymer and surface modified hexagonal boron nitride particles
WO2012026012A1 (ja) 2010-08-26 2012-03-01 電気化学工業株式会社 樹脂組成物及び該樹脂組成物からなる成形体と基板材並びに該基板材を含んでなる回路基板
WO2014014947A1 (en) * 2012-07-17 2014-01-23 Hedin Logan Brook Thermally conductive printed circuit boards
TWI462672B (zh) * 2013-02-08 2014-11-21 Ichia Tech Inc 前驅基板、軟性印刷電路板及其製造方法
CN105453707B (zh) * 2013-08-14 2018-07-06 电化株式会社 氮化硼-树脂复合体电路基板、氮化硼-树脂复合体散热板一体型电路基板
KR102318231B1 (ko) * 2015-01-29 2021-10-27 엘지이노텍 주식회사 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판
TWI671364B (zh) 2015-12-30 2019-09-11 美商聖高拜陶器塑膠公司 改質氮化物顆粒、寡聚物官能化氮化物顆粒及基於聚合物之複合材料
WO2017158919A1 (ja) * 2016-03-14 2017-09-21 ナミックス株式会社 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法
US10561025B2 (en) * 2017-01-10 2020-02-11 Bgt Materials Limited Method of manufacturing polymer printed circuit board
US20230056185A1 (en) * 2020-01-20 2023-02-23 Sekisui Chemical Co., Ltd. Thermally conductive sheet, laminate, and semiconductor device

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US7658988B2 (en) * 2006-04-03 2010-02-09 E. I. Du Pont De Nemours And Company Printed circuits prepared from filled epoxy compositions
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US8784980B2 (en) 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles

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