JP2012505544A5 - - Google Patents

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Publication number
JP2012505544A5
JP2012505544A5 JP2011531011A JP2011531011A JP2012505544A5 JP 2012505544 A5 JP2012505544 A5 JP 2012505544A5 JP 2011531011 A JP2011531011 A JP 2011531011A JP 2011531011 A JP2011531011 A JP 2011531011A JP 2012505544 A5 JP2012505544 A5 JP 2012505544A5
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JP
Japan
Prior art keywords
energy
substrate
energy source
polymerizable material
elements
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JP2011531011A
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English (en)
Japanese (ja)
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JP5802557B2 (ja
JP2012505544A (ja
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Priority claimed from US12/511,593 external-priority patent/US8237133B2/en
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Publication of JP2012505544A5 publication Critical patent/JP2012505544A5/ja
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JP2011531011A 2008-10-10 2009-08-04 インプリント・リソグラフィ・システムでの硬化用のエネルギー源 Active JP5802557B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10433108P 2008-10-10 2008-10-10
US61/104,331 2008-10-10
US12/511,593 2009-07-29
US12/511,593 US8237133B2 (en) 2008-10-10 2009-07-29 Energy sources for curing in an imprint lithography system
PCT/US2009/004454 WO2010042141A2 (en) 2008-10-10 2009-08-04 Energy sources for curing in an imprint lithography system

Publications (3)

Publication Number Publication Date
JP2012505544A JP2012505544A (ja) 2012-03-01
JP2012505544A5 true JP2012505544A5 (enExample) 2012-08-23
JP5802557B2 JP5802557B2 (ja) 2015-10-28

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ID=42098033

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JP2011531011A Active JP5802557B2 (ja) 2008-10-10 2009-08-04 インプリント・リソグラフィ・システムでの硬化用のエネルギー源

Country Status (6)

Country Link
US (1) US8237133B2 (enExample)
JP (1) JP5802557B2 (enExample)
KR (1) KR101707898B1 (enExample)
MY (1) MY155087A (enExample)
TW (1) TWI426353B (enExample)
WO (1) WO2010042141A2 (enExample)

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JP5366735B2 (ja) * 2009-09-24 2013-12-11 東芝機械株式会社 転写装置および転写方法
JP5535164B2 (ja) * 2011-09-22 2014-07-02 株式会社東芝 インプリント方法およびインプリント装置
JP6263930B2 (ja) * 2013-09-30 2018-01-24 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6611450B2 (ja) * 2015-03-31 2019-11-27 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
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JP2018125377A (ja) * 2017-01-31 2018-08-09 東芝メモリ株式会社 インプリント装置および半導体装置の製造方法
KR102463923B1 (ko) 2017-09-18 2022-11-07 에스케이하이닉스 주식회사 임프린트 패턴 형성 방법 및 임프린트 장치
US10754078B2 (en) 2018-12-20 2020-08-25 Canon Kabushiki Kaisha Light source, a shaping system using the light source and an article manufacturing method
US11972976B2 (en) 2021-04-29 2024-04-30 Canon Kabushiki Kaisha Planarization system, planarization process, and method of manufacturing an article
US12027373B2 (en) 2021-05-28 2024-07-02 Canon Kabushiki Kaisha Planarization process, planarization system, and method of manufacturing an article
JP7746784B2 (ja) * 2021-10-06 2025-10-01 ウシオ電機株式会社 光加熱装置、加熱処理方法
JP7750154B2 (ja) * 2022-03-28 2025-10-07 ウシオ電機株式会社 光加熱装置、加熱処理方法
JP7750120B2 (ja) * 2022-01-26 2025-10-07 ウシオ電機株式会社 光加熱装置

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