MY155087A - Energy sources for curing in an imprint lithography system - Google Patents

Energy sources for curing in an imprint lithography system

Info

Publication number
MY155087A
MY155087A MYPI2011001493A MYPI20111493A MY155087A MY 155087 A MY155087 A MY 155087A MY PI2011001493 A MYPI2011001493 A MY PI2011001493A MY PI20111493 A MYPI20111493 A MY PI20111493A MY 155087 A MY155087 A MY 155087A
Authority
MY
Malaysia
Prior art keywords
lithography system
imprint lithography
curing
energy sources
energy
Prior art date
Application number
MYPI2011001493A
Other languages
English (en)
Inventor
Ganapathisubramanian Mahadevan
Choi Byung-Jin
Wang Liang
Ruiz Alex
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of MY155087A publication Critical patent/MY155087A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • H01L21/0275Photolithographic processes using lasers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
MYPI2011001493A 2008-10-10 2009-08-04 Energy sources for curing in an imprint lithography system MY155087A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10433108P 2008-10-10 2008-10-10
US12/511,593 US8237133B2 (en) 2008-10-10 2009-07-29 Energy sources for curing in an imprint lithography system

Publications (1)

Publication Number Publication Date
MY155087A true MY155087A (en) 2015-08-28

Family

ID=42098033

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001493A MY155087A (en) 2008-10-10 2009-08-04 Energy sources for curing in an imprint lithography system

Country Status (6)

Country Link
US (1) US8237133B2 (enExample)
JP (1) JP5802557B2 (enExample)
KR (1) KR101707898B1 (enExample)
MY (1) MY155087A (enExample)
TW (1) TWI426353B (enExample)
WO (1) WO2010042141A2 (enExample)

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JP5535164B2 (ja) * 2011-09-22 2014-07-02 株式会社東芝 インプリント方法およびインプリント装置
JP6263930B2 (ja) * 2013-09-30 2018-01-24 大日本印刷株式会社 インプリント装置及びインプリント方法
JP6611450B2 (ja) * 2015-03-31 2019-11-27 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
KR102743032B1 (ko) * 2016-10-14 2024-12-17 삼성디스플레이 주식회사 임프린트용 가압 롤러 및 이를 이용한 임프린트 방법
JP2018125377A (ja) * 2017-01-31 2018-08-09 東芝メモリ株式会社 インプリント装置および半導体装置の製造方法
KR102463923B1 (ko) 2017-09-18 2022-11-07 에스케이하이닉스 주식회사 임프린트 패턴 형성 방법 및 임프린트 장치
US10754078B2 (en) 2018-12-20 2020-08-25 Canon Kabushiki Kaisha Light source, a shaping system using the light source and an article manufacturing method
US11972976B2 (en) 2021-04-29 2024-04-30 Canon Kabushiki Kaisha Planarization system, planarization process, and method of manufacturing an article
US12027373B2 (en) 2021-05-28 2024-07-02 Canon Kabushiki Kaisha Planarization process, planarization system, and method of manufacturing an article
JP7746784B2 (ja) * 2021-10-06 2025-10-01 ウシオ電機株式会社 光加熱装置、加熱処理方法
JP7750154B2 (ja) * 2022-03-28 2025-10-07 ウシオ電機株式会社 光加熱装置、加熱処理方法
JP7750120B2 (ja) * 2022-01-26 2025-10-07 ウシオ電機株式会社 光加熱装置

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Also Published As

Publication number Publication date
US20100090130A1 (en) 2010-04-15
TW201015233A (en) 2010-04-16
JP5802557B2 (ja) 2015-10-28
US8237133B2 (en) 2012-08-07
JP2012505544A (ja) 2012-03-01
KR20110084499A (ko) 2011-07-25
TWI426353B (zh) 2014-02-11
WO2010042141A2 (en) 2010-04-15
WO2010042141A3 (en) 2010-06-10
KR101707898B1 (ko) 2017-02-17

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