JP2012222546A - 固体撮像装置及びその製造方法、並びに電子機器 - Google Patents

固体撮像装置及びその製造方法、並びに電子機器 Download PDF

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Publication number
JP2012222546A
JP2012222546A JP2011085328A JP2011085328A JP2012222546A JP 2012222546 A JP2012222546 A JP 2012222546A JP 2011085328 A JP2011085328 A JP 2011085328A JP 2011085328 A JP2011085328 A JP 2011085328A JP 2012222546 A JP2012222546 A JP 2012222546A
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Japan
Prior art keywords
solid
imaging device
state imaging
frame member
pad
Prior art date
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Abandoned
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JP2011085328A
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English (en)
Japanese (ja)
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JP2012222546A5 (enExample
Inventor
Yasuhiro Kamata
康博 鎌田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011085328A priority Critical patent/JP2012222546A/ja
Priority to US13/422,915 priority patent/US9025079B2/en
Priority to TW101109669A priority patent/TW201304525A/zh
Priority to CN2012100910012A priority patent/CN102738189A/zh
Publication of JP2012222546A publication Critical patent/JP2012222546A/ja
Publication of JP2012222546A5 publication Critical patent/JP2012222546A5/ja
Priority to US14/677,781 priority patent/US9325921B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2011085328A 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器 Abandoned JP2012222546A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011085328A JP2012222546A (ja) 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器
US13/422,915 US9025079B2 (en) 2011-04-07 2012-03-16 Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus
TW101109669A TW201304525A (zh) 2011-04-07 2012-03-21 固態攝像裝置及其製造方法，以及電子系統
CN2012100910012A CN102738189A (zh) 2011-04-07 2012-03-30 固体摄像装置及其制造方法和电子系统
US14/677,781 US9325921B2 (en) 2011-04-07 2015-04-02 Method for manufacturing an imaging apparatus having a frame member covering a pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011085328A JP2012222546A (ja) 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器

Publications (2)

Publication Number Publication Date
JP2012222546A true JP2012222546A (ja) 2012-11-12
JP2012222546A5 JP2012222546A5 (enExample) 2014-05-01

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JP2011085328A Abandoned JP2012222546A (ja) 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器

Country Status (4)

Country Link
US (2) US9025079B2 (enExample)
JP (1) JP2012222546A (enExample)
CN (1) CN102738189A (enExample)
TW (1) TW201304525A (enExample)

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WO2014087900A1 (ja) 2012-12-03 2014-06-12 富士フイルム株式会社 固体撮像素子用保持基板及びその製造方法、固体撮像装置
WO2014087901A1 (ja) 2012-12-03 2014-06-12 富士フイルム株式会社 Ｉｒカットフィルタ及びその製造方法、固体撮像装置、遮光膜の形成方法
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
JP2014203854A (ja) * 2013-04-01 2014-10-27 ソニー株式会社 固体撮像装置および電子機器
JP2017158097A (ja) * 2016-03-03 2017-09-07 株式会社デンソー カメラ装置
JP2020068349A (ja) * 2018-10-26 2020-04-30 パナソニック株式会社 撮像モジュール
US10681256B2 (en) 2015-08-10 2020-06-09 Dai Nippon Printing Co., Ltd. Image sensor module including a light-transmissive interposer substrate having a through-hole
JP2022143348A (ja) * 2021-03-17 2022-10-03 株式会社小糸製作所 受光素子及び測定装置
JP2022143347A (ja) * 2021-03-17 2022-10-03 株式会社小糸製作所 受光素子及び測定装置
WO2025100094A1 (ja) * 2023-11-06 2025-05-15 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、半導体装置、および、半導体パッケージの製造方法

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CN103996684B (zh) * 2014-05-20 2017-06-20 格科微电子（上海）有限公司 图像传感器结构及其封装方法
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TWI651841B (zh) * 2014-07-14 2019-02-21 Sony Corporation 攝像裝置
JP2016139763A (ja) * 2015-01-29 2016-08-04 ソニー株式会社 撮像装置、電子機器
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CN105206640B (zh) * 2015-10-08 2020-04-21 格科微电子（上海）有限公司 摄像头模组及其装配方法
JP6989383B2 (ja) * 2015-11-05 2022-01-05 ソニーセミコンダクタソリューションズ株式会社 半導体装置、半導体装置の製造方法、及び、電子機器
CN109510932B (zh) * 2016-02-18 2021-05-04 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
US10192914B2 (en) * 2016-03-20 2019-01-29 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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JP6869717B2 (ja) * 2016-12-28 2021-05-12 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法、並びに、電子機器
JP6948406B2 (ja) * 2017-12-04 2021-10-13 株式会社Ｆｕｊｉ 電子部品装着向き確認システム及び電子部品装着向き確認方法
CN111989771A (zh) * 2018-02-19 2020-11-24 迪德鲁科技(Bvi)有限公司 制造玻璃框架扇出型封装的系统和方法
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TWI678570B (zh) * 2018-06-06 2019-12-01 鴻海精密工業股份有限公司 接合結構及具有該接合結構之相機模組
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CN208424550U (zh) * 2018-06-29 2019-01-22 三赢科技（深圳）有限公司 相机模组
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JP7624393B2 (ja) * 2019-09-04 2025-01-30 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、電子装置、および、半導体パッケージの製造方法
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US9952361B2 (en) 2012-12-03 2018-04-24 Fujifilm Corporation IR cut filter, method for manufacturing the same, and solid-state imaging device
WO2014087901A1 (ja) 2012-12-03 2014-06-12 富士フイルム株式会社 Ｉｒカットフィルタ及びその製造方法、固体撮像装置、遮光膜の形成方法
US9571706B2 (en) 2012-12-03 2017-02-14 Fujifilm Corporation Support plate for solid-state imaging element, method for manufacturing the same, and solid-state imaging device
WO2014087900A1 (ja) 2012-12-03 2014-06-12 富士フイルム株式会社 固体撮像素子用保持基板及びその製造方法、固体撮像装置
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
JP2014203854A (ja) * 2013-04-01 2014-10-27 ソニー株式会社 固体撮像装置および電子機器
US10681256B2 (en) 2015-08-10 2020-06-09 Dai Nippon Printing Co., Ltd. Image sensor module including a light-transmissive interposer substrate having a through-hole
US11153471B2 (en) 2015-08-10 2021-10-19 Dai Nippon Printing Co., Ltd. Through-hole electrode substrate
JP2017158097A (ja) * 2016-03-03 2017-09-07 株式会社デンソー カメラ装置
JP2020068349A (ja) * 2018-10-26 2020-04-30 パナソニック株式会社 撮像モジュール
JP7294792B2 (ja) 2018-10-26 2023-06-20 ヌヴォトンテクノロジージャパン株式会社 撮像モジュール
JP2022143348A (ja) * 2021-03-17 2022-10-03 株式会社小糸製作所 受光素子及び測定装置
JP2022143347A (ja) * 2021-03-17 2022-10-03 株式会社小糸製作所 受光素子及び測定装置
JP7696215B2 (ja) 2021-03-17 2025-06-20 株式会社小糸製作所 受光素子及び測定装置
JP7696214B2 (ja) 2021-03-17 2025-06-20 株式会社小糸製作所 受光素子及び測定装置
WO2025100094A1 (ja) * 2023-11-06 2025-05-15 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、半導体装置、および、半導体パッケージの製造方法

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US9025079B2 (en) 2015-05-05
US20120257075A1 (en) 2012-10-11
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