CN102738189A - 固体摄像装置及其制造方法和电子系统 - Google Patents

固体摄像装置及其制造方法和电子系统 Download PDF

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Publication number
CN102738189A
CN102738189A CN2012100910012A CN201210091001A CN102738189A CN 102738189 A CN102738189 A CN 102738189A CN 2012100910012 A CN2012100910012 A CN 2012100910012A CN 201210091001 A CN201210091001 A CN 201210091001A CN 102738189 A CN102738189 A CN 102738189A
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solid
state imaging
imaging device
pad
framing component
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CN2012100910012A
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Chinese (zh)
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鎌田康博
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Sony Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
CN2012100910012A 2011-04-07 2012-03-30 固体摄像装置及其制造方法和电子系统 Pending CN102738189A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011085328A JP2012222546A (ja) 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器
JP2011-085328 2011-04-07

Publications (1)

Publication Number Publication Date
CN102738189A true CN102738189A (zh) 2012-10-17

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Country Status (4)

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US (2) US9025079B2 (enExample)
JP (1) JP2012222546A (enExample)
CN (1) CN102738189A (enExample)
TW (1) TW201304525A (enExample)

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CN104103656A (zh) * 2013-04-01 2014-10-15 索尼公司 固态成像装置和电子设备
CN104698723A (zh) * 2013-12-09 2015-06-10 三星电机株式会社 相机模块
WO2015176601A1 (zh) * 2014-05-20 2015-11-26 格科微电子（上海）有限公司 图像传感器结构及其封装方法
CN106415840A (zh) * 2014-07-14 2017-02-15 索尼公司 成像装置、制造装置和制造方法
CN106534652A (zh) * 2016-12-26 2017-03-22 努比亚技术有限公司 一种镜头模组、镜头以及终端
CN109952648A (zh) * 2016-12-28 2019-06-28 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN110475049A (zh) * 2018-05-11 2019-11-19 三星电机株式会社 相机模块及其制造方法
CN111373852A (zh) * 2017-12-04 2020-07-03 株式会社富士 电子元件安装方向确认系统及电子元件安装方向确认方法
CN111835943A (zh) * 2019-04-23 2020-10-27 富泰华工业（深圳）有限公司 影像感测器封装结构、镜头模组及电子装置
TWI816747B (zh) * 2018-02-19 2023-10-01 中國大陸商成都奕斯偉系統集成電路有限公司 玻璃框架扇出封裝及其製造方法

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CN104854699B (zh) 2012-12-03 2017-09-01 富士胶片株式会社 固体摄影元件用保持基板及其制造方法、固体摄影装置
EP2927718B1 (en) 2012-12-03 2018-09-19 FUJIFILM Corporation Ir-cut filter and manufacturing method thereof, solid state image pickup device, and light blocking film formation method
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
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JP6191728B2 (ja) 2015-08-10 2017-09-06 大日本印刷株式会社 イメージセンサモジュール
CN105206640B (zh) * 2015-10-08 2020-04-21 格科微电子（上海）有限公司 摄像头模组及其装配方法
WO2017077792A1 (ja) 2015-11-05 2017-05-11 ソニー株式会社 半導体装置、半導体装置の製造方法、及び、電子機器
CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
JP2017158097A (ja) * 2016-03-03 2017-09-07 株式会社デンソー カメラ装置
US10192914B2 (en) * 2016-03-20 2019-01-29 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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TWI678570B (zh) * 2018-06-06 2019-12-01 鴻海精密工業股份有限公司 接合結構及具有該接合結構之相機模組
CN110661934B (zh) * 2018-06-29 2021-04-20 三赢科技（深圳）有限公司 镜头模组
CN208424550U (zh) * 2018-06-29 2019-01-22 三赢科技（深圳）有限公司 相机模组
JP7294792B2 (ja) * 2018-10-26 2023-06-20 ヌヴォトンテクノロジージャパン株式会社 撮像モジュール
KR20230157536A (ko) * 2019-03-08 2023-11-16 데쿠세리아루즈 가부시키가이샤 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
WO2021044703A1 (ja) * 2019-09-04 2021-03-11 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、電子装置、および、半導体パッケージの製造方法
US11515220B2 (en) * 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same
KR102914870B1 (ko) * 2020-10-08 2026-01-16 삼성전자 주식회사 이미지 센서 패키지 및 그 패키지 제조방법
JP7696215B2 (ja) * 2021-03-17 2025-06-20 株式会社小糸製作所 受光素子及び測定装置
JP7696214B2 (ja) * 2021-03-17 2025-06-20 株式会社小糸製作所 受光素子及び測定装置
KR20230053241A (ko) * 2021-10-14 2023-04-21 삼성전기주식회사 이미지 센서 모듈 및 이를 포함하는 카메라 모듈
EP4586320A4 (en) * 2022-11-30 2025-10-15 Samsung Electronics Co Ltd IMAGE SENSOR AND ELECTRONIC DEVICE THEREFOR
WO2025100094A1 (ja) * 2023-11-06 2025-05-15 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、半導体装置、および、半導体パッケージの製造方法

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Cited By (15)

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Publication number Priority date Publication date Assignee Title
CN104103656A (zh) * 2013-04-01 2014-10-15 索尼公司 固态成像装置和电子设备
CN104698723A (zh) * 2013-12-09 2015-06-10 三星电机株式会社 相机模块
CN103996684B (zh) * 2014-05-20 2017-06-20 格科微电子（上海）有限公司 图像传感器结构及其封装方法
WO2015176601A1 (zh) * 2014-05-20 2015-11-26 格科微电子（上海）有限公司 图像传感器结构及其封装方法
CN106415840B (zh) * 2014-07-14 2020-01-14 索尼公司 成像装置、制造装置和制造方法
US10356295B2 (en) 2014-07-14 2019-07-16 Sony Corporation Imaging device, manufacturing device, and manufacturing method
CN106415840A (zh) * 2014-07-14 2017-02-15 索尼公司 成像装置、制造装置和制造方法
CN106534652A (zh) * 2016-12-26 2017-03-22 努比亚技术有限公司 一种镜头模组、镜头以及终端
CN109952648A (zh) * 2016-12-28 2019-06-28 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN109952648B (zh) * 2016-12-28 2023-07-14 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN111373852A (zh) * 2017-12-04 2020-07-03 株式会社富士 电子元件安装方向确认系统及电子元件安装方向确认方法
TWI816747B (zh) * 2018-02-19 2023-10-01 中國大陸商成都奕斯偉系統集成電路有限公司 玻璃框架扇出封裝及其製造方法
CN110475049A (zh) * 2018-05-11 2019-11-19 三星电机株式会社 相机模块及其制造方法
CN110475049B (zh) * 2018-05-11 2022-03-15 三星电机株式会社 相机模块及其制造方法
CN111835943A (zh) * 2019-04-23 2020-10-27 富泰华工业（深圳）有限公司 影像感测器封装结构、镜头模组及电子装置

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US9325921B2 (en) 2016-04-26
US20120257075A1 (en) 2012-10-11
TW201304525A (zh) 2013-01-16
US9025079B2 (en) 2015-05-05
JP2012222546A (ja) 2012-11-12
US20150215551A1 (en) 2015-07-30

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Application publication date: 20121017