CN102738189A - 固体摄像装置及其制造方法和电子系统 - Google Patents

固体摄像装置及其制造方法和电子系统 Download PDF

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Publication number
CN102738189A
CN102738189A CN2012100910012A CN201210091001A CN102738189A CN 102738189 A CN102738189 A CN 102738189A CN 2012100910012 A CN2012100910012 A CN 2012100910012A CN 201210091001 A CN201210091001 A CN 201210091001A CN 102738189 A CN102738189 A CN 102738189A
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China
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solid
state imaging
imaging device
pad
framing component
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Chinese (zh)
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鎌田康博
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Sony Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
CN2012100910012A 2011-04-07 2012-03-30 固体摄像装置及其制造方法和电子系统 Pending CN102738189A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011085328A JP2012222546A (ja) 2011-04-07 2011-04-07 固体撮像装置及びその製造方法、並びに電子機器
JP2011-085328 2011-04-07

Publications (1)

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CN102738189A true CN102738189A (zh) 2012-10-17

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US (2) US9025079B2 (enExample)
JP (1) JP2012222546A (enExample)
CN (1) CN102738189A (enExample)
TW (1) TW201304525A (enExample)

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CN104103656A (zh) * 2013-04-01 2014-10-15 索尼公司 固态成像装置和电子设备
CN104698723A (zh) * 2013-12-09 2015-06-10 三星电机株式会社 相机模块
WO2015176601A1 (zh) * 2014-05-20 2015-11-26 格科微电子（上海）有限公司 图像传感器结构及其封装方法
CN106415840A (zh) * 2014-07-14 2017-02-15 索尼公司 成像装置、制造装置和制造方法
CN106534652A (zh) * 2016-12-26 2017-03-22 努比亚技术有限公司 一种镜头模组、镜头以及终端
CN109952648A (zh) * 2016-12-28 2019-06-28 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN110475049A (zh) * 2018-05-11 2019-11-19 三星电机株式会社 相机模块及其制造方法
CN111373852A (zh) * 2017-12-04 2020-07-03 株式会社富士 电子元件安装方向确认系统及电子元件安装方向确认方法
CN111835943A (zh) * 2019-04-23 2020-10-27 富泰华工业（深圳）有限公司 影像感测器封装结构、镜头模组及电子装置
TWI816747B (zh) * 2018-02-19 2023-10-01 中國大陸商成都奕斯偉系統集成電路有限公司 玻璃框架扇出封裝及其製造方法

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CN104854699B (zh) 2012-12-03 2017-09-01 富士胶片株式会社 固体摄影元件用保持基板及其制造方法、固体摄影装置
WO2014087901A1 (ja) 2012-12-03 2014-06-12 富士フイルム株式会社 Ｉｒカットフィルタ及びその製造方法、固体撮像装置、遮光膜の形成方法
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
TWI659648B (zh) * 2013-03-25 2019-05-11 Sony Corporation 固體攝像裝置及照相機模組、以及電子機器
DE102014212034A1 (de) * 2014-06-24 2015-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines Imager-Moduls und ein entsprechendes Imagermodul
JP2016139763A (ja) * 2015-01-29 2016-08-04 ソニー株式会社 撮像装置、電子機器
DE102015208701A1 (de) * 2015-05-11 2016-11-17 Infratec Gmbh Vorrichtung zur gleichzeitigen Bestimmung mehrerer unterschiedlicher Stoffe und/oder Stoffkonzentrationen
JP6191728B2 (ja) 2015-08-10 2017-09-06 大日本印刷株式会社 イメージセンサモジュール
CN105206640B (zh) * 2015-10-08 2020-04-21 格科微电子（上海）有限公司 摄像头模组及其装配方法
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CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
JP2017158097A (ja) 2016-03-03 2017-09-07 株式会社デンソー カメラ装置
US10192914B2 (en) * 2016-03-20 2019-01-29 Ningbo Sunny Opotech Co., Ltd. Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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CN110661934B (zh) * 2018-06-29 2021-04-20 三赢科技（深圳）有限公司 镜头模组
CN208424550U (zh) * 2018-06-29 2019-01-22 三赢科技（深圳）有限公司 相机模组
JP7294792B2 (ja) * 2018-10-26 2023-06-20 ヌヴォトンテクノロジージャパン株式会社 撮像モジュール
WO2020184267A1 (ja) * 2019-03-08 2020-09-17 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP7624393B2 (ja) * 2019-09-04 2025-01-30 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、電子装置、および、半導体パッケージの製造方法
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JP7696214B2 (ja) * 2021-03-17 2025-06-20 株式会社小糸製作所 受光素子及び測定装置
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WO2024117639A1 (ko) * 2022-11-30 2024-06-06 삼성전자 주식회사 이미지 센서 및 그를 포함하는 전자 장치
WO2025100094A1 (ja) * 2023-11-06 2025-05-15 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、半導体装置、および、半導体パッケージの製造方法

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103656A (zh) * 2013-04-01 2014-10-15 索尼公司 固态成像装置和电子设备
CN104698723A (zh) * 2013-12-09 2015-06-10 三星电机株式会社 相机模块
CN103996684B (zh) * 2014-05-20 2017-06-20 格科微电子（上海）有限公司 图像传感器结构及其封装方法
WO2015176601A1 (zh) * 2014-05-20 2015-11-26 格科微电子（上海）有限公司 图像传感器结构及其封装方法
CN106415840B (zh) * 2014-07-14 2020-01-14 索尼公司 成像装置、制造装置和制造方法
US10356295B2 (en) 2014-07-14 2019-07-16 Sony Corporation Imaging device, manufacturing device, and manufacturing method
CN106415840A (zh) * 2014-07-14 2017-02-15 索尼公司 成像装置、制造装置和制造方法
CN106534652A (zh) * 2016-12-26 2017-03-22 努比亚技术有限公司 一种镜头模组、镜头以及终端
CN109952648A (zh) * 2016-12-28 2019-06-28 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN109952648B (zh) * 2016-12-28 2023-07-14 索尼半导体解决方案公司 相机模块、相机模块的制造方法和电子设备
CN111373852A (zh) * 2017-12-04 2020-07-03 株式会社富士 电子元件安装方向确认系统及电子元件安装方向确认方法
TWI816747B (zh) * 2018-02-19 2023-10-01 中國大陸商成都奕斯偉系統集成電路有限公司 玻璃框架扇出封裝及其製造方法
CN110475049A (zh) * 2018-05-11 2019-11-19 三星电机株式会社 相机模块及其制造方法
CN110475049B (zh) * 2018-05-11 2022-03-15 三星电机株式会社 相机模块及其制造方法
CN111835943A (zh) * 2019-04-23 2020-10-27 富泰华工业（深圳）有限公司 影像感测器封装结构、镜头模组及电子装置

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TW201304525A (zh) 2013-01-16
US20120257075A1 (en) 2012-10-11
US20150215551A1 (en) 2015-07-30
JP2012222546A (ja) 2012-11-12
US9025079B2 (en) 2015-05-05
US9325921B2 (en) 2016-04-26

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Application publication date: 20121017