CN111835943A - 影像感测器封装结构、镜头模组及电子装置 - Google Patents
影像感测器封装结构、镜头模组及电子装置 Download PDFInfo
- Publication number
- CN111835943A CN111835943A CN201910328502.XA CN201910328502A CN111835943A CN 111835943 A CN111835943 A CN 111835943A CN 201910328502 A CN201910328502 A CN 201910328502A CN 111835943 A CN111835943 A CN 111835943A
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- photo
- adhesive layer
- image sensor
- circuit board
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims description 52
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910328502.XA CN111835943A (zh) | 2019-04-23 | 2019-04-23 | 影像感测器封装结构、镜头模组及电子装置 |
US16/826,419 US20200343285A1 (en) | 2019-04-23 | 2020-03-23 | Packaging structure for image sensor, lens module, and electronic device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910328502.XA CN111835943A (zh) | 2019-04-23 | 2019-04-23 | 影像感测器封装结构、镜头模组及电子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111835943A true CN111835943A (zh) | 2020-10-27 |
Family
ID=72911511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910328502.XA Pending CN111835943A (zh) | 2019-04-23 | 2019-04-23 | 影像感测器封装结构、镜头模组及电子装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20200343285A1 (zh) |
CN (1) | CN111835943A (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102738189A (zh) * | 2011-04-07 | 2012-10-17 | 索尼公司 | 固体摄像装置及其制造方法和电子系统 |
US20160028928A1 (en) * | 2013-03-25 | 2016-01-28 | Sony Corporation | Solid state imaging device, camera module and electronic device |
CN206596090U (zh) * | 2016-03-28 | 2017-10-27 | 宁波舜宇光电信息有限公司 | 电子设备和摄像模组 |
CN107359173A (zh) * | 2017-06-12 | 2017-11-17 | 格科微电子(上海)有限公司 | 图像传感器模组的装配方法 |
CN208509047U (zh) * | 2018-05-17 | 2019-02-15 | 江西联益光学有限公司 | 摄像头模组 |
CN109510925A (zh) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | 摄像模组 |
-
2019
- 2019-04-23 CN CN201910328502.XA patent/CN111835943A/zh active Pending
-
2020
- 2020-03-23 US US16/826,419 patent/US20200343285A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102738189A (zh) * | 2011-04-07 | 2012-10-17 | 索尼公司 | 固体摄像装置及其制造方法和电子系统 |
US20160028928A1 (en) * | 2013-03-25 | 2016-01-28 | Sony Corporation | Solid state imaging device, camera module and electronic device |
CN206596090U (zh) * | 2016-03-28 | 2017-10-27 | 宁波舜宇光电信息有限公司 | 电子设备和摄像模组 |
CN107359173A (zh) * | 2017-06-12 | 2017-11-17 | 格科微电子(上海)有限公司 | 图像传感器模组的装配方法 |
CN109510925A (zh) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | 摄像模组 |
CN208509047U (zh) * | 2018-05-17 | 2019-02-15 | 江西联益光学有限公司 | 摄像头模组 |
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Publication number | Publication date |
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US20200343285A1 (en) | 2020-10-29 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201119 Address after: 518109 Four, Six, Seven and Thirteen Workshops in Area B of Foxconn Guanlan Science Park, Dasan Community, Guanlan Street, Longhua New District, Shenzhen City, Guangdong Province (Section I) Applicant after: Fu Tai Hua Industry (Shenzhen) Co.,Ltd. Applicant after: SOCLETECHNOLOGY Corp. Address before: 518109 Four, Six, Seven and Thirteen Workshops in Area B of Foxconn Guanlan Science Park, Dasan Community, Guanlan Street, Longhua New District, Shenzhen City, Guangdong Province (Section I) Applicant before: Fu Tai Hua Industry (Shenzhen) Co.,Ltd. Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
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Application publication date: 20201027 |