JP2012151019A5 - - Google Patents

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Publication number
JP2012151019A5
JP2012151019A5 JP2011009539A JP2011009539A JP2012151019A5 JP 2012151019 A5 JP2012151019 A5 JP 2012151019A5 JP 2011009539 A JP2011009539 A JP 2011009539A JP 2011009539 A JP2011009539 A JP 2011009539A JP 2012151019 A5 JP2012151019 A5 JP 2012151019A5
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JP
Japan
Prior art keywords
fitting member
view
diagram showing
terminal fitting
shows
Prior art date
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JP2011009539A
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English (en)
Japanese (ja)
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JP2012151019A (ja
JP5599328B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2011009539A priority Critical patent/JP5599328B2/ja
Priority claimed from JP2011009539A external-priority patent/JP5599328B2/ja
Priority to US13/223,600 priority patent/US8575745B2/en
Priority to CN201110296956.7A priority patent/CN102686013B/zh
Priority to DE102011087414.3A priority patent/DE102011087414B4/de
Publication of JP2012151019A publication Critical patent/JP2012151019A/ja
Publication of JP2012151019A5 publication Critical patent/JP2012151019A5/ja
Application granted granted Critical
Publication of JP5599328B2 publication Critical patent/JP5599328B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011009539A 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構 Expired - Fee Related JP5599328B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011009539A JP5599328B2 (ja) 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構
US13/223,600 US8575745B2 (en) 2011-01-20 2011-09-01 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
CN201110296956.7A CN102686013B (zh) 2011-01-20 2011-09-30 功率半导体装置、印刷布线板和它们的连接机构
DE102011087414.3A DE102011087414B4 (de) 2011-01-20 2011-11-30 Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011009539A JP5599328B2 (ja) 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構

Publications (3)

Publication Number Publication Date
JP2012151019A JP2012151019A (ja) 2012-08-09
JP2012151019A5 true JP2012151019A5 (enExample) 2013-07-18
JP5599328B2 JP5599328B2 (ja) 2014-10-01

Family

ID=46510898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011009539A Expired - Fee Related JP5599328B2 (ja) 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構

Country Status (4)

Country Link
US (1) US8575745B2 (enExample)
JP (1) JP5599328B2 (enExample)
CN (1) CN102686013B (enExample)
DE (1) DE102011087414B4 (enExample)

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* Cited by examiner, † Cited by third party
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JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
WO2014132803A1 (ja) * 2013-02-26 2014-09-04 三菱電機株式会社 電力用半導体装置
CN103367299B (zh) * 2013-07-03 2017-02-15 株洲南车时代电气股份有限公司 半导体模块功率互联装置及其方法
JP6117661B2 (ja) 2013-09-19 2017-04-19 日立オートモティブシステムズ株式会社 電子制御装置
US9706643B2 (en) 2014-06-19 2017-07-11 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing the same
DE102014116793B4 (de) 2014-11-17 2018-03-08 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
JP6316504B2 (ja) * 2015-05-21 2018-04-25 三菱電機株式会社 電力用半導体装置
JP6380244B2 (ja) 2015-06-15 2018-08-29 三菱電機株式会社 半導体装置、電力変換装置
JP6455364B2 (ja) 2015-08-28 2019-01-23 三菱電機株式会社 半導体装置、インテリジェントパワーモジュールおよび電力変換装置
JP6743542B2 (ja) 2016-07-15 2020-08-19 富士電機株式会社 半導体装置及び半導体装置用ケース
JP6445066B2 (ja) * 2017-03-22 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
JP6445068B2 (ja) * 2017-03-23 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
EP3442080A1 (de) * 2017-08-09 2019-02-13 HILTI Aktiengesellschaft Steckkupplung für eine akkueinheit
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10497635B2 (en) * 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11901273B2 (en) * 2021-07-26 2024-02-13 Infineon Technologies Ag Power module with press-fit contacts
US12494418B2 (en) 2021-07-26 2025-12-09 Infineon Technologies Ag Power module with press-fit contacts
US12438068B2 (en) 2022-01-18 2025-10-07 Infineon Technologies Austria Ag Stacked module arrangement
DE102022118358A1 (de) * 2022-07-22 2024-01-25 HARTING Electronics GmbH Steckverbinder mit Transportsicherung für Gegenkontaktelemente

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JP5350804B2 (ja) * 2007-01-22 2013-11-27 三菱電機株式会社 電力用半導体装置
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JP4607995B2 (ja) * 2008-11-28 2011-01-05 三菱電機株式会社 電力用半導体装置

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