JP2012117881A - バーンインボード及びバーンインシステム - Google Patents

バーンインボード及びバーンインシステム Download PDF

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Publication number
JP2012117881A
JP2012117881A JP2010266673A JP2010266673A JP2012117881A JP 2012117881 A JP2012117881 A JP 2012117881A JP 2010266673 A JP2010266673 A JP 2010266673A JP 2010266673 A JP2010266673 A JP 2010266673A JP 2012117881 A JP2012117881 A JP 2012117881A
Authority
JP
Japan
Prior art keywords
burn
board
connector
edge
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010266673A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012117881A5 (enExample
Inventor
Shinichi Kimura
村 伸 一 木
Atsushi Hayashi
篤 志 林
Atsushi Hoshino
野 篤 司 星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Engineering Corp
Original Assignee
Japan Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Engineering Corp filed Critical Japan Engineering Corp
Priority to JP2010266673A priority Critical patent/JP2012117881A/ja
Priority to TW100104946A priority patent/TW201241453A/zh
Priority to SG2011010642A priority patent/SG181207A1/en
Publication of JP2012117881A publication Critical patent/JP2012117881A/ja
Publication of JP2012117881A5 publication Critical patent/JP2012117881A5/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
JP2010266673A 2010-11-30 2010-11-30 バーンインボード及びバーンインシステム Pending JP2012117881A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010266673A JP2012117881A (ja) 2010-11-30 2010-11-30 バーンインボード及びバーンインシステム
TW100104946A TW201241453A (en) 2010-11-30 2011-02-15 Burn-in board and burn-in system
SG2011010642A SG181207A1 (en) 2010-11-30 2011-02-15 Burn-in board and burn-in system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010266673A JP2012117881A (ja) 2010-11-30 2010-11-30 バーンインボード及びバーンインシステム

Publications (2)

Publication Number Publication Date
JP2012117881A true JP2012117881A (ja) 2012-06-21
JP2012117881A5 JP2012117881A5 (enExample) 2014-01-09

Family

ID=46384624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010266673A Pending JP2012117881A (ja) 2010-11-30 2010-11-30 バーンインボード及びバーンインシステム

Country Status (3)

Country Link
JP (1) JP2012117881A (enExample)
SG (1) SG181207A1 (enExample)
TW (1) TW201241453A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017116477A (ja) * 2015-12-25 2017-06-29 株式会社アドバンテスト デバイス測定用治具
KR102115378B1 (ko) * 2019-05-31 2020-05-27 (주)대성이앤티 카드형 엣지 커넥터 및 번인 보드 테스트 장치
US11500012B2 (en) 2020-08-10 2022-11-15 King Yuan Electronics Co., Ltd. Semiconductor component burn-in test module and burn-in test equipment

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201611143A (zh) * 2014-09-03 2016-03-16 Hsinho Advanced Technology Inc 預燒系統之冷卻氣流控制閘門機構
TWI570419B (zh) * 2015-07-31 2017-02-11 陽榮科技股份有限公司 Ic升溫裝置及方法
TWI550287B (zh) * 2015-10-30 2016-09-21 Hon Tech Inc Electronic components preheating unit and its application test classification equipment
CN114078718B (zh) * 2020-08-13 2025-02-28 京元电子股份有限公司 半导体元件预烧测试模块及其预烧测试装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189486U (enExample) * 1987-12-04 1989-06-13
JPH0299585U (enExample) * 1989-01-26 1990-08-08
JPH09320684A (ja) * 1996-05-30 1997-12-12 Japan Aviation Electron Ind Ltd 嵌合ガイド付きコネクタ
JP2000091002A (ja) * 1998-09-16 2000-03-31 Harness Syst Tech Res Ltd プリント基板用コネクタ
JP2000193712A (ja) * 1998-12-28 2000-07-14 Ando Electric Co Ltd バ―ンインボ―ド及びバ―ンインテスト装置
JP2005531010A (ja) * 2002-06-27 2005-10-13 エイアー テスト システムズ 電子デバイスをバーンイン試験するためのシステム
JP2006164757A (ja) * 2004-12-07 2006-06-22 Jst Mfg Co Ltd 複合コネクタ
JP2006308516A (ja) * 2005-05-02 2006-11-09 Nippon Eng Kk バーンインボード
JP2008305611A (ja) * 2007-06-06 2008-12-18 Nippon Eng Kk コネクタ
JP2009300330A (ja) * 2008-06-16 2009-12-24 Nippon Eng Kk バーンインボード、エッジコネクタ及びバーンインシステム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189486U (enExample) * 1987-12-04 1989-06-13
JPH0299585U (enExample) * 1989-01-26 1990-08-08
JPH09320684A (ja) * 1996-05-30 1997-12-12 Japan Aviation Electron Ind Ltd 嵌合ガイド付きコネクタ
JP2000091002A (ja) * 1998-09-16 2000-03-31 Harness Syst Tech Res Ltd プリント基板用コネクタ
JP2000193712A (ja) * 1998-12-28 2000-07-14 Ando Electric Co Ltd バ―ンインボ―ド及びバ―ンインテスト装置
JP2005531010A (ja) * 2002-06-27 2005-10-13 エイアー テスト システムズ 電子デバイスをバーンイン試験するためのシステム
JP2006164757A (ja) * 2004-12-07 2006-06-22 Jst Mfg Co Ltd 複合コネクタ
JP2006308516A (ja) * 2005-05-02 2006-11-09 Nippon Eng Kk バーンインボード
JP2008305611A (ja) * 2007-06-06 2008-12-18 Nippon Eng Kk コネクタ
JP2009300330A (ja) * 2008-06-16 2009-12-24 Nippon Eng Kk バーンインボード、エッジコネクタ及びバーンインシステム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017116477A (ja) * 2015-12-25 2017-06-29 株式会社アドバンテスト デバイス測定用治具
KR102115378B1 (ko) * 2019-05-31 2020-05-27 (주)대성이앤티 카드형 엣지 커넥터 및 번인 보드 테스트 장치
US11500012B2 (en) 2020-08-10 2022-11-15 King Yuan Electronics Co., Ltd. Semiconductor component burn-in test module and burn-in test equipment

Also Published As

Publication number Publication date
TW201241453A (en) 2012-10-16
SG181207A1 (en) 2012-06-28

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