JP2012099610A5 - - Google Patents
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- Publication number
- JP2012099610A5 JP2012099610A5 JP2010245359A JP2010245359A JP2012099610A5 JP 2012099610 A5 JP2012099610 A5 JP 2012099610A5 JP 2010245359 A JP2010245359 A JP 2010245359A JP 2010245359 A JP2010245359 A JP 2010245359A JP 2012099610 A5 JP2012099610 A5 JP 2012099610A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- wiring
- layer
- wiring board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims description 140
- 239000011347 resin Substances 0.000 claims description 104
- 229920005989 resin Polymers 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 73
- 238000004519 manufacturing process Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010245359A JP5655244B2 (ja) | 2010-11-01 | 2010-11-01 | 配線基板およびその製造方法、並びに半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010245359A JP5655244B2 (ja) | 2010-11-01 | 2010-11-01 | 配線基板およびその製造方法、並びに半導体装置およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012099610A JP2012099610A (ja) | 2012-05-24 |
| JP2012099610A5 true JP2012099610A5 (enrdf_load_stackoverflow) | 2013-09-05 |
| JP5655244B2 JP5655244B2 (ja) | 2015-01-21 |
Family
ID=46391204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010245359A Active JP5655244B2 (ja) | 2010-11-01 | 2010-11-01 | 配線基板およびその製造方法、並びに半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5655244B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014116548A (ja) | 2012-12-12 | 2014-06-26 | Ngk Spark Plug Co Ltd | 多層配線基板およびその製造方法 |
| JP5462404B1 (ja) * | 2013-09-12 | 2014-04-02 | 太陽誘電株式会社 | 部品内蔵基板及び部品内蔵基板用コア基材 |
| KR102306719B1 (ko) * | 2015-04-22 | 2021-09-30 | 삼성전기주식회사 | 인쇄회로기판, 그 제조방법, 및 전자부품 모듈 |
| KR101666757B1 (ko) * | 2015-07-13 | 2016-10-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 |
| JP2017123459A (ja) * | 2016-01-08 | 2017-07-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | プリント回路基板 |
| KR102671978B1 (ko) | 2019-02-11 | 2024-06-05 | 삼성전기주식회사 | 인쇄회로기판 |
| KR102767455B1 (ko) * | 2020-01-20 | 2025-02-14 | 삼성전자주식회사 | 차단층을 포함하는 반도체 패키지 |
| US11257742B2 (en) | 2020-07-02 | 2022-02-22 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method for manufacturing the same |
| US11355426B2 (en) | 2020-07-31 | 2022-06-07 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method for manufacturing the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3894640B2 (ja) * | 1997-12-25 | 2007-03-22 | 大日本印刷株式会社 | 配線基板の製造方法 |
| JP2005197763A (ja) * | 1999-03-30 | 2005-07-21 | Ngk Spark Plug Co Ltd | コンデンサ付属配線基板、配線基板、及びコンデンサ |
| JP3582645B2 (ja) * | 2000-05-16 | 2004-10-27 | 日立エーアイシー株式会社 | 立体形配線板の製造方法 |
| JP2004235222A (ja) * | 2003-01-28 | 2004-08-19 | Airex Inc | プリント配線板の製造方法 |
| JP4581768B2 (ja) * | 2005-03-16 | 2010-11-17 | ソニー株式会社 | 半導体装置の製造方法 |
| JP4906903B2 (ja) * | 2009-10-20 | 2012-03-28 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法 |
-
2010
- 2010-11-01 JP JP2010245359A patent/JP5655244B2/ja active Active
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