JP2012092434A5 - - Google Patents

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Publication number
JP2012092434A5
JP2012092434A5 JP2011204196A JP2011204196A JP2012092434A5 JP 2012092434 A5 JP2012092434 A5 JP 2012092434A5 JP 2011204196 A JP2011204196 A JP 2011204196A JP 2011204196 A JP2011204196 A JP 2011204196A JP 2012092434 A5 JP2012092434 A5 JP 2012092434A5
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JP
Japan
Prior art keywords
silver
pyridyl
hydantoin
acrylic acid
solution
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JP2011204196A
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English (en)
Japanese (ja)
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JP5854727B2 (ja
JP2012092434A (ja
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Publication of JP2012092434A5 publication Critical patent/JP2012092434A5/ja
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JP2011204196A 2010-09-21 2011-09-20 シアン化物を含まない銀電気めっき液 Active JP5854727B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38506610P 2010-09-21 2010-09-21
US61/385066 2010-09-21

Publications (3)

Publication Number Publication Date
JP2012092434A JP2012092434A (ja) 2012-05-17
JP2012092434A5 true JP2012092434A5 (https=) 2015-12-10
JP5854727B2 JP5854727B2 (ja) 2016-02-09

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ID=44719414

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JP2011204196A Active JP5854727B2 (ja) 2010-09-21 2011-09-20 シアン化物を含まない銀電気めっき液

Country Status (7)

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US (1) US8608932B2 (https=)
EP (1) EP2431502B1 (https=)
JP (1) JP5854727B2 (https=)
KR (1) KR101779410B1 (https=)
CN (1) CN102409373B (https=)
SG (1) SG179380A1 (https=)
TW (1) TWI427194B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN105506683A (zh) * 2015-12-23 2016-04-20 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液
CN107604394A (zh) * 2017-09-29 2018-01-19 佛山市春暖花开科技有限公司 一种银的电镀液
JP7405827B2 (ja) * 2018-08-21 2023-12-26 ウミコレ・ガルファノテフニック・ゲーエムベーハー 銀の非シアン系析出用電解質
DE102018120357A1 (de) * 2018-08-21 2020-02-27 Umicore Galvanotechnik Gmbh Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
CN111349934A (zh) * 2020-03-12 2020-06-30 华东师范大学 一种柔性银电极及其制备方法
JP7740879B2 (ja) * 2021-01-20 2025-09-17 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
KR102476608B1 (ko) 2021-11-19 2022-12-13 (주)피이솔브 은도금액
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations

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EP2157209B1 (en) * 2008-07-31 2014-10-22 Rohm and Haas Electronic Materials LLC Inhibiting Background Plating
CN101665963B (zh) * 2009-09-23 2011-08-24 福建师范大学 一种环保型无氰银电镀液
EP2431501B1 (en) * 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel

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