CN111349934A - 一种柔性银电极及其制备方法 - Google Patents

一种柔性银电极及其制备方法 Download PDF

Info

Publication number
CN111349934A
CN111349934A CN202010172500.9A CN202010172500A CN111349934A CN 111349934 A CN111349934 A CN 111349934A CN 202010172500 A CN202010172500 A CN 202010172500A CN 111349934 A CN111349934 A CN 111349934A
Authority
CN
China
Prior art keywords
solution
substrate
flexible
nickel
placing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010172500.9A
Other languages
English (en)
Inventor
杜浩东
姚文静
张健
苗倩倩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
East China Normal University
Original Assignee
East China Normal University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by East China Normal University filed Critical East China Normal University
Priority to CN202010172500.9A priority Critical patent/CN111349934A/zh
Publication of CN111349934A publication Critical patent/CN111349934A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

本发明公开了一种柔性银电极及其制备方法,其方法包括:将柔性衬底置于硫酸镍溶液中,使得衬底表面进行金属离子吸附,再将其置于硼氢化钠溶液中生成镍种子层,随后在商用无电镀镍溶液中获得致密且导电的镍电极,再将镍电极置于电镀银溶液中进行电镀即获得一种柔性银电极。本发明相比传统工艺而言,不需特定的实验温度及专业设备,且可以与现有的微电子工艺实现衔接,可实现在纸或聚酰亚胺薄膜等柔性衬底上得到银电极。具有成本低、环保度高、可降解性强、电化学稳定性好、粘合性好、热稳定性好以及耐高温等优点,并且可以大规模制造、性价比高。

Description

一种柔性银电极及其制备方法
技术领域
本发明涉及柔性电极的制备技术,尤其是一种可以在柔性衬底上、可大规模一次性成型的柔性银电极及制备方法。
背景技术
近年来,出现了许多基于柔性衬底的器件,如可穿戴柔性显示屏、分布式传感器、柔性传感器等。柔性传感器的发展要求更多的具有良好的柔性和稳定性的器件,然而金属电极并不具备良好的柔韧性,同时金属的成本也远高于柔性衬底。此外,柔性电极还具备重量轻、易集成、更环保等优点。因此,柔性电极应用场景将非常广泛。在柔性电极的制备过程中,如中国专利:201710791978.8中公布的一种自支撑柔性电极的制备方法及其应用,虽然可以做到更高的电化学稳定性,但其灵活性和环保度以及成本均不够好。这将会限制柔性电极的大面积量产和应用。
发明内容
本发明的目的是针对现有技术的不足而提供的一种柔性银电极及制备方法,该方法可实现在柔性衬底上制备银电极,可实现在普通滤纸、A4打印纸、聚酰亚胺薄膜等柔性衬底上制备电极,具有电化学稳定性好、粘合性好、介电常数低、热稳定性好、耐高温、成本低、环保度高、可降解、重量轻、可回收性好且可弯曲度好等优点。
实现本发明目的的具体技术方案是:
一种柔性银电极的制备方法,该方法包括以下具体步骤:
步骤1:用去离子水、乙醇及丙酮分别对衬底超声波清洗25~35 min,得到无尘化衬底;
步骤2:将步骤1所得的衬底置于硫酸镍溶液中浸10~15min,使得衬底表面进行金属离子吸附;
步骤3:将步骤2所得的衬底置于硼氢化钠溶液中浸泡30~35min,表面金属离子吸附的部分与溶液发生反应,生成镍种子层;
步骤4:将步骤3所得的衬底置于商用无电镀镍溶液中浸泡20~30min,获得致密且导电的镍电极;
步骤5:将步骤4所得的衬底置于电镀银溶液中电镀10~15min,用去离子水清洗,制得柔性银电极;
其中:
所述衬底为纸或聚酰亚胺薄膜等具有柔性的材料;
所述硫酸镍溶液的浓度为49.5~50.5 mM;
所述硼氢化钠溶液的浓度为0.04~0.06 M;
所述无电镀镍溶液的温度为85~95℃;
所述电镀银溶液由浓度为2.5M的硫代硫酸钠溶液、1.0M的硝酸银溶液和0.8~0.9M的焦亚硫酸钠溶液混合制成。
一种上述方法制得的柔性银电极。
本发明相比传统工艺而言,不需特定的实验温度及专业设备,步骤简单,制作过程对环境友好且可以与现有的微电子工艺实现衔接,可快速实现大规模量产。相比现有的柔性电极的制备方法来说,本发明的制造成本更低,且由于可采用普通的纸或其他低成本的柔性材料作为衬底,在使用后的回收处理上也更加方便,甚至可以作为一次性电极使用,安全高效成本低。本发明制备的柔性银电极的电化学稳定性好、粘合性好、介电常数低且热稳定性好。
附图说明
图1为本发明方法流程图。
具体实施方式
下面结合附图,对本发明进行详细描述。
参阅图1,本发明包括:
S1﹑用去离子水、乙醇及丙酮分别对衬底进行超声波清洗25~35 min,得到衬底11;
S2、将S1所得的衬底置于浓度为49.5~50.5mM的硫酸镍溶液中浸10~15min,使得衬底表面进行金属离子吸附,吸附后得到被离子吸附的区域12;
S3、将S2所得的衬底置于浓度为0.04~0.06M硼氢化钠溶液中浸泡30~35min,表面离子吸附的部分与溶液发生反应,生成镍种子层13,该镍种子层具有较高的化学活性且与衬底具有较高的结合力;
S4、将S3所得的带有镍种子层13的衬底11置于85~95℃的商用无电镀镍溶液中浸泡20~30min,然后,用去离子水清洗,获得致密且导电的镍电极14;
S5、将S4所得的带有镍电极14的衬底11置于电镀银溶液中电镀10~15min,用去离子水清洗,获得柔性银电极15;
实施例1
S1﹑选取大小为2cm×6cm的滤纸,用胶带贴住其中一面,用去离子水、乙醇及丙酮分别对纸超声波清洗30min,得到滤纸衬底11;
S2﹑将S1所得的滤纸衬底上选取2cm×3cm的区域置于浓度为50mM的硫酸镍溶液中浸10min,使得滤纸衬底表面选定的区域进行金属离子吸附,吸附后得到被离子吸附的区域12;
S3﹑将S2所得的滤纸衬底上的2cm×3cm的区域置于浓度为0.05M硼氢化钠溶液中浸泡30min,表面离子吸附的部分与溶液发生反应,生成镍种子层13,该镍种子层具有较高的化学活性且与滤纸具有较高的结合力;
S4﹑将S3所得的滤纸11上的2cm×3cm的区域分别置于90℃的商用无电镀镍溶液中浸泡25min,然后用去离子水清洗,获得致密且导电的镍电极14;
S5﹑将S4所得的带有镍电极14滤纸衬底11置于电镀银溶液中电镀10min,用去离子水清洗,获得柔性银电极15。
实施例2
S1﹑选取大小为2cm×6cm的聚酰亚胺薄膜,用胶带贴住其中一面,用去离子水、乙醇及丙酮分别对纸超声波清洗30min,得到聚酰亚胺衬底11;
S2﹑将S1所得的聚酰亚胺衬底上选取2cm×3cm的区域置于浓度为50mM的硫酸镍溶液中浸10min,使得聚酰亚胺衬底表面选定的区域进行金属离子吸附,吸附后得到被离子吸附的区域12;
S3﹑将S2所得的聚酰亚胺衬底上的2cm×3cm的区域置于浓度为0.05M硼氢化钠溶液中浸泡30min,表面离子吸附的部分与溶液发生反应,生成镍种子层13,该镍种子层具有较高的化学活性且与聚酰亚胺薄膜具有较高的结合力;
S4﹑将S3所得的聚酰亚胺衬底11上的2cm×3cm的区域分别置于90℃的商用无电镀镍溶液中浸泡25min,然后用去离子水清洗,获得致密且导电的镍电极14;
S5﹑将S4所得的带有镍电极14聚酰亚胺衬底11置于电镀银溶液中电镀10min,用去离子水清洗,获得柔性银电极15。
本发明的制备过程:将柔性衬底用去离子水、乙醇、丙酮超声波清洗,得到无尘的柔性衬底;将柔性衬底置于硫酸镍溶液中,使得衬底表面进行金属离子吸附,使得镍离子吸附到柔性衬底表面,吸附后得到指定区域的被镍离子吸附的柔性衬底;由于利用0.04~0.06 M 的硼氢化钠溶液作为还原剂使得表面析出形成图形化的镍种子层,硼氢化钠溶液浓度不宜过高,否则所生长出来的镍层较疏松,该镍种子层具有较高的化学活性且与柔性衬底具有较高的结合力;将所得带有镍种子层的柔性衬底置于85~95℃的商用无电镀镍溶液中20~25min,获得致密且导电的镍电极图形;将柔性衬底置于电镀银溶液中进行电镀得到柔性银电极,所获得的镍电极在柔性衬底的表面,所获得的柔性银电极在镍电极的表面。工艺流程中,无需繁琐的步骤,流程简单易操作,且柔性衬底,如纸或聚酰亚胺薄膜的成本低、柔性高、环保度高、可回收性好,可大规模制备,而且本发明制备的柔性银电极的电化学稳定性好、粘合性好、介电常数低且热稳定性好。

Claims (2)

1.一种柔性银电极的制备方法,其特征在于,该方法包括以下具体步骤:
步骤1:用去离子水、乙醇及丙酮分别对衬底超声波清洗25~35 min,得到无尘化衬底;
步骤2:将步骤1所得的衬底置于硫酸镍溶液中浸10~15min,使得衬底表面进行金属离子吸附;
步骤3:将步骤2所得的衬底置于硼氢化钠溶液中浸泡30~35min,表面金属离子吸附的部分与溶液发生反应,生成镍种子层;
步骤4:将步骤3所得的衬底置于商用无电镀镍溶液中浸泡20~30min,获得致密且导电的镍电极;
步骤5:将步骤4所得的衬底的一端置于电镀银溶液中电镀10~15min,制得所述柔性银电极;
其中:
所述衬底为纸或聚酰亚胺薄膜;
所述硫酸镍溶液的浓度为49.5~50.5 mM;
所述硼氢化钠溶液的浓度为0.04~0.06 M;
所述无电镀镍溶液的温度为85~95℃;
所述电镀银溶液由浓度为2.5M的硫代硫酸钠溶液、1.0M的硝酸银溶液和0.8~0.9M的焦亚硫酸钠溶液混合而成。
2.一种权利要求1所述方法制得的柔性银电极。
CN202010172500.9A 2020-03-12 2020-03-12 一种柔性银电极及其制备方法 Pending CN111349934A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010172500.9A CN111349934A (zh) 2020-03-12 2020-03-12 一种柔性银电极及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010172500.9A CN111349934A (zh) 2020-03-12 2020-03-12 一种柔性银电极及其制备方法

Publications (1)

Publication Number Publication Date
CN111349934A true CN111349934A (zh) 2020-06-30

Family

ID=71192785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010172500.9A Pending CN111349934A (zh) 2020-03-12 2020-03-12 一种柔性银电极及其制备方法

Country Status (1)

Country Link
CN (1) CN111349934A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764741A (zh) * 2021-07-29 2021-12-07 华东师范大学 一种柔性纸基电池及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120067735A1 (en) * 2010-09-21 2012-03-22 Rohm And Haas Electronic Materials Llc Cyanide-free silver electroplating solutions
CN104514020A (zh) * 2013-09-27 2015-04-15 无锡华冶钢铁有限公司 一种硫代硫酸盐镀银电镀液
CN105154930A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种无氰镀银电镀液及其电镀方法
CN108181363A (zh) * 2017-08-30 2018-06-19 大连大学 一种采用电化学沉积法制备的基于树枝状纳米银结构的柔性电极
US20190017175A1 (en) * 2017-07-14 2019-01-17 Microcosm Technology Co., Ltd Method of forming a metal layer on a photosensitive resin
CN109951901A (zh) * 2019-02-15 2019-06-28 华东师范大学 一种基于聚酰亚胺原位生长银电极的柔性加热器
CN110082407A (zh) * 2019-03-29 2019-08-02 华东师范大学 一种柔性金电极及制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120067735A1 (en) * 2010-09-21 2012-03-22 Rohm And Haas Electronic Materials Llc Cyanide-free silver electroplating solutions
CN104514020A (zh) * 2013-09-27 2015-04-15 无锡华冶钢铁有限公司 一种硫代硫酸盐镀银电镀液
CN105154930A (zh) * 2015-08-21 2015-12-16 无锡桥阳机械制造有限公司 一种无氰镀银电镀液及其电镀方法
US20190017175A1 (en) * 2017-07-14 2019-01-17 Microcosm Technology Co., Ltd Method of forming a metal layer on a photosensitive resin
CN108181363A (zh) * 2017-08-30 2018-06-19 大连大学 一种采用电化学沉积法制备的基于树枝状纳米银结构的柔性电极
CN109951901A (zh) * 2019-02-15 2019-06-28 华东师范大学 一种基于聚酰亚胺原位生长银电极的柔性加热器
CN110082407A (zh) * 2019-03-29 2019-08-02 华东师范大学 一种柔性金电极及制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李东光主编: "《精细化工产品配方与工艺(一)》", 30 June 2000, 北京:化学工业出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113764741A (zh) * 2021-07-29 2021-12-07 华东师范大学 一种柔性纸基电池及其制备方法
CN113764741B (zh) * 2021-07-29 2023-07-25 华东师范大学 一种柔性纸基电池及其制备方法

Similar Documents

Publication Publication Date Title
US10512170B2 (en) Highly conductive transparent glass-based circuit board
SE445278B (sv) Tunn flexibel elektrod, sett for framstellning derav samt anvendning i en elektrokemisk cell
WO2018107924A1 (zh) 一种柔性线路板及其制备方法、太阳能光伏组件
CN108684084B (zh) 石墨烯加热膜的制备工艺
CN107655949A (zh) 一种基于树枝状纳米银结构的柔性电极及其制备方法
CN112216419B (zh) 一种柔性导电薄膜常温低压转印方法
CN108305705B (zh) 石墨烯复合薄膜及其制备方法和应用
CN111349934A (zh) 一种柔性银电极及其制备方法
CN207885103U (zh) 一种电磁波屏蔽膜
CN108790346B (zh) 一种柔性电路板快压用离型纸及其制造工艺
CN207330823U (zh) 一种丙烯酸酯膨胀胶带
CN110098063B (zh) 一种柔性金电极及制备方法
CN108864965A (zh) 一种导电胶带及其制备方法
CN112635604B (zh) 光伏玻璃及其制备方法、光伏组件及其制备方法
CN104205353B (zh) 结晶类太阳能电池模块及其制造方法
CN108766630B (zh) 一种基于金属纳米线的柔性传感器、及其制备方法
CN113421698A (zh) 一种可牢固焊接的柔性导电薄膜及其制备方法和应用
CN102385999B (zh) 一种染料敏化太阳能电池的柔性复合对电极及其制备方法
CN110649151A (zh) 一种图形化n、p型热电薄膜及制备方法和柔性薄膜热电器件
CN104362227B (zh) 一种金属电极贴片的制备方法
CN107546326A (zh) 低熔点金属电极型钙钛矿太阳能电池
CN112888097A (zh) 一种发热膜及其制备方法
CN208690368U (zh) 一种超薄锂电池
CN113412043A (zh) 一种柔性可焊接抗氧化电磁屏蔽膜及制备方法
CN110591597A (zh) 一种导电双面胶带

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200630