CN110591597A - 一种导电双面胶带 - Google Patents
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- 239000002390 adhesive tape Substances 0.000 title description 18
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 11
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 17
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- 239000004744 fabric Substances 0.000 claims description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003522 acrylic cement Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000003575 carbonaceous material Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 5
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000013329 compounding Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000084 colloidal system Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
本发明公开了一种导电双面胶带,包括离型纸和导电基材,所述离型纸在导电基材的上下两侧面对称设置,且两组所述离型纸均通过导电压敏胶黏剂与导电基材粘接固定,所述导电基材的厚度为0.02‑1mm,导电阻抗小于0.2Ω/cm2,且导电压敏胶黏剂由以下重量份的原料制成:丙烯酸树脂100‑150份、双氰胺固化剂0.25‑1.0份、导电粒子5‑10份和适量的溶剂。该导电双面胶带,提供一种导电双面胶带,通过使用导电材料作为导电胶带的基材以及导电压敏胶黏剂作为胶体,具有粘接作用的同时有效消除电磁干扰、隔离电磁波对人体的危害,导电基材增加了胶带的抗拉伸强度,坚固耐用,不易磨损不易折断,在导电胶带的普及上有着广泛的市场前景低的问题。
Description
技术领域
本发明属于胶带技术领域,具体涉及一种导电双面胶带。
背景技术
胶带是日常生活和工作中常用的粘接封装和遮蔽的工具之一,按功效可分为高温胶带、双面胶带、导电胶带、特种胶带、压敏胶带、模切胶带等等,根据不同的功效适用于不同的场所和领域,其中导电胶带又是常用的胶带之一。在电子领域,导电胶带广泛使用。导电胶带可应用于无线电、非可焊接基板与元器件的导电连接,可应用于医疗设备、等离子体电视、手机、太阳能电池、印刷电路板(PCB)、电脑、MP4、LED、智能卡、陶瓷电容、集成电路芯片等电子元器件的封装和粘接,也可用于制备电磁屏蔽薄膜,在军用和民用市场均有一定的应用。但现有导电胶带导电性稳定性低、强度低、不耐磨损,不利于长期使用。
发明内容
本发明的目的在于提供一种导电双面胶带,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种导电双面胶带,包括离型纸和导电基材,所述离型纸在导电基材的上下两侧面对称设置,且两组所述离型纸均通过导电压敏胶黏剂与导电基材粘接固定。
优选的,所述导电基材的厚度为0.02-1mm,导电阻抗小于0.2Ω/cm2,且导电基材可以为铝箔、铜箔、导电布、导电矽和导电泡棉中的任一种。
优选的,所述导电压敏胶黏剂为含有“导电粒子”丙烯酸胶系,其中导电粒子为镍粉、银铜粉、碳系材料、石墨烯中的任一种,且导电压敏胶黏剂由以下重量份的原料制成:丙烯酸树脂100-150份、双氰胺固化剂0.25-1.0份、导电粒子5-10份和适量的溶剂。
优选的,所述溶剂为乙酸乙酯、丁酮、环己烷、甲苯、二甲基甲酰胺、二甲基乙酰胺、N-甲基-2-吡咯烷酮中的一种或多种。
优选的,制备过程包括以下步骤:
S1,首先将丙烯酸树脂、双氰胺固化剂、导电粒子和适量的溶剂按照配方的组分混合,并搅拌均匀后得到导电压敏胶黏剂;
S2,取两组离型纸,将S1制备的导电压敏胶黏剂分别涂布到两组离型纸的一侧面上,进行烘干处理,之后分别与导电基材的正面和反面复合。
本发明的技术效果和优点:该导电双面胶带,首先通过将导电基材设置成括铝箔、铜箔、导电布、导电矽和导电泡棉等,可增加胶带的导电性与导电稳定性,实现更好的屏蔽作用,同时可增加胶带的强度;同时导电压敏胶黏剂为含有“导电粒子”丙烯酸胶系,导电粒子为镍粉、银铜粉、碳系材料、石墨烯等,增加胶带的导电稳定性与屏蔽膜作用,同时让导电布具有良好的粘性,可以与任何金属面以粘接的方式完成电搭接和缝隙的电封闭,经济实惠、使用方便;另外制备的导电双面胶带具有结构简单、生产加工简单方便、有利于大规模生产、粘结性强、导电性能优良、同时起粘接封装和屏蔽作用,可以有效消除电磁干扰、隔离电磁波对人体的危害,导电基材的使用增加了胶带强度与导电稳定性,使胶带坚固耐用,不易磨损不易折断,在导电胶带的普及上有着广泛的市场前景。
附图说明
图1为本发明的主视图。
图中:1离型纸、2导电压敏胶黏剂、3导电基材。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
本发明提供了如图1所示的一种导电双面胶带,包括离型纸1和导电基材3,所述离型纸1在导电基材3的上下两侧面对称设置,且两组所述离型纸1均通过导电压敏胶黏剂2与导电基材3粘接固定。
具体的,所述导电基材3的厚度为0.02-1mm,导电阻抗小于0.2Ω/cm2,且导电基材3可以为铝箔、铜箔、导电布、导电矽和导电泡棉中的任一种,此处采用导电布为例。
具体的,所述导电压敏胶黏剂2为含有“导电粒子”丙烯酸胶系,其中导电粒子为镍粉、银铜粉、碳系材料、石墨烯中的任一种,且导电压敏胶黏剂2由以下重量份的原料制成:丙烯酸树脂100份、双氰胺固化剂0.25份、镍粉5份和适量的溶剂,此处导电粒子采用镍粉为例。
具体的,所述溶剂为乙酸乙酯、丁酮、环己烷、甲苯、二甲基甲酰胺、二甲基乙酰胺、N-甲基-2-吡咯烷酮中的一种或多种。
具体的,制备过程包括以下步骤:
S1,首先将丙烯酸树脂、双氰胺固化剂、镍粉和适量的溶剂按照配方的组分混合,并搅拌均匀后得到导电压敏胶黏剂2;
S2,取两组离型纸1,将S1制备的导电压敏胶黏剂2分别涂布到两组离型纸1的一侧面上,进行烘干处理,之后分别与导电布材3的正面和反面复合。
实施例2
本发明提供了如图1所示的一种导电双面胶带,包括离型纸1和导电基材3,所述离型纸1在导电基材3的上下两侧面对称设置,且两组所述离型纸1均通过导电压敏胶黏剂2与导电基材3粘接固定。
具体的,所述导电基材3的厚度为0.02-1mm,导电阻抗小于0.2Ω/cm2,且导电基材3可以为铝箔、铜箔、导电布、导电矽和导电泡棉中的任一种,此处采用导电布为例。
具体的,所述导电压敏胶黏剂2为含有“导电粒子”丙烯酸胶系,其中导电粒子为镍粉、银铜粉、碳系材料、石墨烯中的任一种,且导电压敏胶黏剂2由以下重量份的原料制成:丙烯酸树脂125份、双氰胺固化剂0.70份、镍粉7.5份和适量的溶剂,此处导电粒子采用镍粉为例。
具体的,所述溶剂为乙酸乙酯、丁酮、环己烷、甲苯、二甲基甲酰胺、二甲基乙酰胺、N-甲基-2-吡咯烷酮中的一种或多种。
具体的,制备过程包括以下步骤:
S1,首先将丙烯酸树脂、双氰胺固化剂、镍粉和适量的溶剂按照配方的组分混合,并搅拌均匀后得到导电压敏胶黏剂2;
S2,取两组离型纸1,将S1制备的导电压敏胶黏剂2分别涂布到两组离型纸1的一侧面上,进行烘干处理,之后分别与导电布材3的正面和反面复合。
实施例3
本发明提供了如图1所示的一种导电双面胶带,包括离型纸1和导电基材3,所述离型纸1在导电基材3的上下两侧面对称设置,且两组所述离型纸1均通过导电压敏胶黏剂2与导电基材3粘接固定。
具体的,所述导电基材3的厚度为0.02-1mm,导电阻抗小于0.2Ω/cm2,且导电基材3可以为铝箔、铜箔、导电布、导电矽和导电泡棉中的任一种,此处采用导电布为例。
具体的,所述导电压敏胶黏剂2为含有“导电粒子”丙烯酸胶系,其中导电粒子为镍粉、银铜粉、碳系材料、石墨烯中的任一种,且导电压敏胶黏剂2由以下重量份的原料制成:丙烯酸树脂150份、双氰胺固化剂1.00份、镍粉10份和适量的溶剂,此处导电粒子采用镍粉为例。
具体的,所述溶剂为乙酸乙酯、丁酮、环己烷、甲苯、二甲基甲酰胺、二甲基乙酰胺、N-甲基-2-吡咯烷酮中的一种或多种。
具体的,制备过程包括以下步骤:
S1,首先将丙烯酸树脂、双氰胺固化剂、镍粉和适量的溶剂按照配方的组分混合,并搅拌均匀后得到导电压敏胶黏剂2;
S2,取两组离型纸1,将S1制备的导电压敏胶黏剂2分别涂布到两组离型纸1的一侧面上,进行烘干处理,之后分别与导电布材3的正面和反面复合。
具体的,该导电双面胶带,导电基材3与导电压敏胶黏剂2组成完整的导电体,经性能检测,增加胶带的导电性、导电稳定性与强度,同时起到更好的屏蔽效果,且胶带两面的离型纸1采用离型力大小不一致便于与胶带分离,且该导电双面胶带,提供一种导电双面胶带,通过使用导电材料作为导电胶带的基材以及导电压敏胶黏剂作为胶体,具有粘接作用的同时有效消除电磁干扰、隔离电磁波对人体的危害,导电基材增加了胶带的抗拉伸强度,坚固耐用,不易磨损不易折断,在导电胶带的普及上有着广泛的市场前景。
最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (5)
1.一种导电双面胶带,包括离型纸(1)和导电基材(3),其特征在于:所述离型纸(1)在导电基材(3)的上下两侧面对称设置,且两组所述离型纸(1)均通过导电压敏胶黏剂(2)与导电基材(3)粘接固定。
2.根据权利要求1所述的一种导电双面胶带,其特征在于:所述导电基材(3)的厚度为0.02-1mm,导电阻抗小于0.2Ω/cm2,且导电基材(3)可以为铝箔、铜箔、导电布、导电矽和导电泡棉中的任一种。
3.根据权利要求1所述的一种导电双面胶带,其特征在于:所述导电压敏胶黏剂(2)为含有“导电粒子”丙烯酸胶系,其中导电粒子为镍粉、银铜粉、碳系材料、石墨烯中的任一种,且导电压敏胶黏剂(2)由以下重量份的原料制成:丙烯酸树脂100-150份、双氰胺固化剂0.25-1.0份、导电粒子5-10份和适量的溶剂。
4.根据权利要求3所述的一种导电双面胶带,其特征在于:所述溶剂为乙酸乙酯、丁酮、环己烷、甲苯、二甲基甲酰胺、二甲基乙酰胺、N-甲基-2-吡咯烷酮中的一种或多种。
5.根据权利要求1-4任一项所述的一种导电双面胶带,其特征在于:制备过程包括以下步骤:
S1,首先将丙烯酸树脂、双氰胺固化剂、导电粒子和适量的溶剂按照配方的组分混合,并搅拌均匀后得到导电压敏胶黏剂(2);
S2,取两组离型纸(1),将S1制备的导电压敏胶黏剂(2)分别涂布到两组离型纸(1)的一侧面上,进行烘干处理,之后分别与导电基材(3)的正面和反面复合。
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