KR101779410B1 - 무시아나이드 은 전기도금액 - Google Patents

무시아나이드 은 전기도금액 Download PDF

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Publication number
KR101779410B1
KR101779410B1 KR1020110095022A KR20110095022A KR101779410B1 KR 101779410 B1 KR101779410 B1 KR 101779410B1 KR 1020110095022 A KR1020110095022 A KR 1020110095022A KR 20110095022 A KR20110095022 A KR 20110095022A KR 101779410 B1 KR101779410 B1 KR 101779410B1
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KR
South Korea
Prior art keywords
silver
electroplating
solution
pyridyl
acrylic acid
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KR1020110095022A
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English (en)
Korean (ko)
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KR20120030982A (ko
Inventor
마르기트 클라우스
반 장-베그링거
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020110095022A 2010-09-21 2011-09-21 무시아나이드 은 전기도금액 Active KR101779410B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38506610P 2010-09-21 2010-09-21
US61/385,066 2010-09-21

Publications (2)

Publication Number Publication Date
KR20120030982A KR20120030982A (ko) 2012-03-29
KR101779410B1 true KR101779410B1 (ko) 2017-09-18

Family

ID=44719414

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110095022A Active KR101779410B1 (ko) 2010-09-21 2011-09-21 무시아나이드 은 전기도금액

Country Status (7)

Country Link
US (1) US8608932B2 (https=)
EP (1) EP2431502B1 (https=)
JP (1) JP5854727B2 (https=)
KR (1) KR101779410B1 (https=)
CN (1) CN102409373B (https=)
SG (1) SG179380A1 (https=)
TW (1) TWI427194B (https=)

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* Cited by examiner, † Cited by third party
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CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN105506683A (zh) * 2015-12-23 2016-04-20 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液
CN107604394A (zh) * 2017-09-29 2018-01-19 佛山市春暖花开科技有限公司 一种银的电镀液
JP7405827B2 (ja) * 2018-08-21 2023-12-26 ウミコレ・ガルファノテフニック・ゲーエムベーハー 銀の非シアン系析出用電解質
DE102018120357A1 (de) * 2018-08-21 2020-02-27 Umicore Galvanotechnik Gmbh Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
CN111349934A (zh) * 2020-03-12 2020-06-30 华东师范大学 一种柔性银电极及其制备方法
JP7740879B2 (ja) * 2021-01-20 2025-09-17 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
KR102476608B1 (ko) 2021-11-19 2022-12-13 (주)피이솔브 은도금액
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations

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US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
JPS534499B2 (https=) 1972-11-13 1978-02-17
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
BG29206A1 (en) 1979-07-06 1980-10-15 Novev Combinated brightnessformer for amonia- sulphamate electrolyte for plating with silver
US4478691A (en) * 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
GB8334226D0 (en) 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
US5198132A (en) 1990-10-11 1993-03-30 The Lubrizol Corporation Antioxidant products
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
JP3012182B2 (ja) * 1995-11-15 2000-02-21 荏原ユージライト株式会社 銀および銀合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
HK1047773B (zh) * 1999-06-17 2006-01-27 德古萨电解技术有限公司 用於电沉积有光泽的金和金合金镀层的酸性浴液及其所用的光泽剂
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2807450B1 (fr) 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
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DE10026680C1 (de) 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124002C1 (de) 2001-05-17 2003-02-06 Ami Doduco Gmbh Saures Silberbad
JP2004225063A (ja) * 2003-01-20 2004-08-12 Electroplating Eng Of Japan Co 非シアン系銀めっき液及び銀めっき方法並びにそれによるバンプ形成方法
JP2005105386A (ja) 2003-10-01 2005-04-21 Nagoya Plating Co Ltd 繊維用の無電解銀めっき液
US20050183961A1 (en) 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
JP2007327127A (ja) * 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
EP2157209B1 (en) * 2008-07-31 2014-10-22 Rohm and Haas Electronic Materials LLC Inhibiting Background Plating
CN101665963B (zh) * 2009-09-23 2011-08-24 福建师范大学 一种环保型无氰银电镀液
EP2431501B1 (en) * 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel

Also Published As

Publication number Publication date
EP2431502A2 (en) 2012-03-21
KR20120030982A (ko) 2012-03-29
EP2431502A3 (en) 2015-11-25
EP2431502B1 (en) 2017-05-24
JP5854727B2 (ja) 2016-02-09
TWI427194B (zh) 2014-02-21
CN102409373B (zh) 2015-05-20
TW201219610A (en) 2012-05-16
US8608932B2 (en) 2013-12-17
US20120067735A1 (en) 2012-03-22
JP2012092434A (ja) 2012-05-17
CN102409373A (zh) 2012-04-11
SG179380A1 (en) 2012-04-27

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