JP2012090252A - 圧電デバイスの製造方法及び圧電デバイス - Google Patents

圧電デバイスの製造方法及び圧電デバイス Download PDF

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Publication number
JP2012090252A
JP2012090252A JP2011053848A JP2011053848A JP2012090252A JP 2012090252 A JP2012090252 A JP 2012090252A JP 2011053848 A JP2011053848 A JP 2011053848A JP 2011053848 A JP2011053848 A JP 2011053848A JP 2012090252 A JP2012090252 A JP 2012090252A
Authority
JP
Japan
Prior art keywords
base
crystal
manufacturing
piezoelectric device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011053848A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012090252A5 (enExample
Inventor
Ryoichi Ichikawa
了一 市川
Yoshiaki Amano
芳明 天野
Kenji Kamezawa
健二 亀澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2011053848A priority Critical patent/JP2012090252A/ja
Priority to CN2011102646202A priority patent/CN102412801A/zh
Priority to TW100132935A priority patent/TW201222908A/zh
Priority to US13/238,770 priority patent/US20120068579A1/en
Publication of JP2012090252A publication Critical patent/JP2012090252A/ja
Publication of JP2012090252A5 publication Critical patent/JP2012090252A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2011053848A 2010-09-22 2011-03-11 圧電デバイスの製造方法及び圧電デバイス Pending JP2012090252A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011053848A JP2012090252A (ja) 2010-09-22 2011-03-11 圧電デバイスの製造方法及び圧電デバイス
CN2011102646202A CN102412801A (zh) 2010-09-22 2011-09-05 压电装置的制造方法及压电装置
TW100132935A TW201222908A (en) 2010-09-22 2011-09-14 Manufacturing method of piezoelectric device and piezoelectric device
US13/238,770 US20120068579A1 (en) 2010-09-22 2011-09-21 Method for Manufacturing a Piezoelectric Device and the Same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010212089 2010-09-22
JP2010212089 2010-09-22
JP2011053848A JP2012090252A (ja) 2010-09-22 2011-03-11 圧電デバイスの製造方法及び圧電デバイス

Publications (2)

Publication Number Publication Date
JP2012090252A true JP2012090252A (ja) 2012-05-10
JP2012090252A5 JP2012090252A5 (enExample) 2014-04-17

Family

ID=45817119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011053848A Pending JP2012090252A (ja) 2010-09-22 2011-03-11 圧電デバイスの製造方法及び圧電デバイス

Country Status (4)

Country Link
US (1) US20120068579A1 (enExample)
JP (1) JP2012090252A (enExample)
CN (1) CN102412801A (enExample)
TW (1) TW201222908A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384406B2 (ja) * 2010-03-30 2014-01-08 日本電波工業株式会社 音叉型水晶振動片の製造方法、水晶デバイス
JP5588784B2 (ja) * 2010-08-20 2014-09-10 日本電波工業株式会社 圧電デバイスの製造方法及び圧電デバイス
JP2013192027A (ja) * 2012-03-14 2013-09-26 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP2016039516A (ja) * 2014-08-08 2016-03-22 日本電波工業株式会社 圧電デバイス
WO2017141996A1 (ja) * 2016-02-18 2017-08-24 コニカミノルタ株式会社 圧電素子の製造方法及び圧電素子
CN115955209B (zh) * 2022-12-05 2024-03-19 泰晶科技股份有限公司 一种晶体谐振器及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033632A (ja) * 2000-07-14 2002-01-31 Seiko Instruments Inc 水晶振動子の製造方法
JP2007129325A (ja) * 2005-11-01 2007-05-24 Seiko Instruments Inc 圧電振動子、発振器、電波時計、電子機器、圧電振動子用ウエハ体及び圧電振動子の製造方法
JP2007129327A (ja) * 2005-11-01 2007-05-24 Seiko Instruments Inc 圧電振動子及びこれを備える発振器、電波時計並びに電子機器
JP2008283243A (ja) * 2007-05-08 2008-11-20 Nec Tokin Corp 圧電振動子および圧電振動ジャイロ
JP2010206322A (ja) * 2009-02-27 2010-09-16 Daishinku Corp パッケージ部材および該パッケージ部材の製造方法および該パッケージ部材を用いた圧電振動デバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58146117A (ja) * 1982-02-24 1983-08-31 Kinseki Kk 圧電振動子の製造方法
JP2001267875A (ja) * 2000-03-22 2001-09-28 Seiko Epson Corp 水晶振動子及びその製造方法
EP1223607A4 (en) * 2000-05-25 2003-03-12 Toppan Printing Co Ltd SUBSTRATE FOR TRANSFER MASK, TRANSFER MASK AND MANUFACTURING METHOD THEREOF
JP2006238266A (ja) * 2005-02-28 2006-09-07 Seiko Epson Corp 圧電振動片、及び圧電振動子
JP2007258917A (ja) * 2006-03-22 2007-10-04 Epson Toyocom Corp 圧電デバイス
CN101068107A (zh) * 2006-05-01 2007-11-07 爱普生拓优科梦株式会社 压电振子及其制造方法
JP2009060478A (ja) * 2007-09-03 2009-03-19 Nippon Dempa Kogyo Co Ltd 圧電振動片の製造方法及び音叉型圧電振動片

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033632A (ja) * 2000-07-14 2002-01-31 Seiko Instruments Inc 水晶振動子の製造方法
JP2007129325A (ja) * 2005-11-01 2007-05-24 Seiko Instruments Inc 圧電振動子、発振器、電波時計、電子機器、圧電振動子用ウエハ体及び圧電振動子の製造方法
JP2007129327A (ja) * 2005-11-01 2007-05-24 Seiko Instruments Inc 圧電振動子及びこれを備える発振器、電波時計並びに電子機器
JP2008283243A (ja) * 2007-05-08 2008-11-20 Nec Tokin Corp 圧電振動子および圧電振動ジャイロ
JP2010206322A (ja) * 2009-02-27 2010-09-16 Daishinku Corp パッケージ部材および該パッケージ部材の製造方法および該パッケージ部材を用いた圧電振動デバイス

Also Published As

Publication number Publication date
US20120068579A1 (en) 2012-03-22
TW201222908A (en) 2012-06-01
CN102412801A (zh) 2012-04-11

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