JP2012064845A - 半導体装置とその製造方法 - Google Patents
半導体装置とその製造方法 Download PDFInfo
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- JP2012064845A JP2012064845A JP2010209115A JP2010209115A JP2012064845A JP 2012064845 A JP2012064845 A JP 2012064845A JP 2010209115 A JP2010209115 A JP 2010209115A JP 2010209115 A JP2010209115 A JP 2010209115A JP 2012064845 A JP2012064845 A JP 2012064845A
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- Prior art keywords
- metal plate
- semiconductor device
- solder
- metal
- metal net
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】本願の発明にかかる半導体装置は、半導体チップと金属板の間に絶縁シートを有するモジュールと、該モジュールを冷却する冷却フィンとを有する。そして、該モジュールの該金属板と、該冷却フィンがはんだで接続され、該はんだの内部には該はんだの高さを均一化する金属網が形成されていることを特徴とする。
【選択図】図2
Description
図1は、本発明の実施の形態に係る半導体装置の正面図である。なお、以後の図において同一構成要素には同一の符号を付して説明の繰り返しを省略する。
Claims (8)
- 半導体チップと金属板の間に絶縁シートを有するモジュールと、
冷却フィンを有し、
前記モジュールの前記金属板と前記冷却フィンがはんだで接続され、前記はんだの内部に金属網が形成されていることを特徴とする半導体装置。 - 前記金属網は、前記はんだよりも熱伝導率が高いことを特徴とする請求項1に記載の半導体装置。
- 前記金属網は、前記金属板の縁と前記冷却フィンの間にのみ形成されていることを特徴とする請求項1に記載の半導体装置。
- 前記半導体チップはワイドバンドギャップ半導体によって形成されていることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置。
- 前記ワイドバンドギャップ半導体は炭化珪素、窒化ガリウム系材料、又はダイヤモンドで構成されていることを特徴とする請求項4に記載の半導体装置。
- 半導体チップと金属板の間に絶縁シートを形成する工程と、
前記半導体チップと前記金属板と前記絶縁シートを、前記金属板の一部が露出するように樹脂で覆ってモジュールを形成する工程と、
前記モジュールの露出した前記金属板と冷却フィンとを、内部に金属網が形成されたはんだで接続する工程を有することを特徴とする半導体装置の製造方法。 - 前記内部に金属網が形成されたはんだは、前記金属板に前記金属網を接合した後、前記金属網を覆うように形成されることを特徴とする請求項6に記載の半導体装置の製造方法。
- 前記内部に金属網が形成されたはんだは、前記冷却フィンに前記金属網を接合した後、前記金属網を覆うように形成されることを特徴とする請求項6に記載の半導体装置の製造方法。
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JP2010209115A JP5609473B2 (ja) | 2010-09-17 | 2010-09-17 | 半導体装置とその製造方法 |
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JP2012064845A true JP2012064845A (ja) | 2012-03-29 |
JP5609473B2 JP5609473B2 (ja) | 2014-10-22 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015043356A (ja) * | 2013-08-26 | 2015-03-05 | 三菱電機株式会社 | パワーモジュール |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5593230A (en) * | 1979-01-10 | 1980-07-15 | Toshiba Corp | Soldering method for semiconductor device |
JPS62198140A (ja) * | 1986-02-26 | 1987-09-01 | Mitsubishi Electric Corp | 半導体装置 |
JPS63105331U (ja) * | 1986-12-24 | 1988-07-08 | ||
JPH0382145A (ja) * | 1989-08-25 | 1991-04-08 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH05136286A (ja) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 半導体装置 |
JP2009124082A (ja) * | 2007-11-19 | 2009-06-04 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2010114257A (ja) * | 2008-11-06 | 2010-05-20 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
-
2010
- 2010-09-17 JP JP2010209115A patent/JP5609473B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5593230A (en) * | 1979-01-10 | 1980-07-15 | Toshiba Corp | Soldering method for semiconductor device |
JPS62198140A (ja) * | 1986-02-26 | 1987-09-01 | Mitsubishi Electric Corp | 半導体装置 |
JPS63105331U (ja) * | 1986-12-24 | 1988-07-08 | ||
JPH0382145A (ja) * | 1989-08-25 | 1991-04-08 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH05136286A (ja) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 半導体装置 |
JP2009124082A (ja) * | 2007-11-19 | 2009-06-04 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2010114257A (ja) * | 2008-11-06 | 2010-05-20 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015043356A (ja) * | 2013-08-26 | 2015-03-05 | 三菱電機株式会社 | パワーモジュール |
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