JP2012056013A - 研削ホイール - Google Patents
研削ホイール Download PDFInfo
- Publication number
- JP2012056013A JP2012056013A JP2010201257A JP2010201257A JP2012056013A JP 2012056013 A JP2012056013 A JP 2012056013A JP 2010201257 A JP2010201257 A JP 2010201257A JP 2010201257 A JP2010201257 A JP 2010201257A JP 2012056013 A JP2012056013 A JP 2012056013A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grinding wheel
- wheel
- abrasive grains
- diamond abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 claims abstract description 27
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 27
- 239000006061 abrasive grain Substances 0.000 claims abstract description 25
- 150000001639 boron compounds Chemical class 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000004898 kneading Methods 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 42
- 239000002245 particle Substances 0.000 description 35
- 229910052594 sapphire Inorganic materials 0.000 description 33
- 239000010980 sapphire Substances 0.000 description 33
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000005011 phenolic resin Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005323 electroforming Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 被加工物を研削する研削ホイールであって、ホイールマウントに装着されるホイールマウント装着面を有する環状基台と、該環状基台の自由端部にリング状に配設されたダイアモンド砥粒にホウ素化合物を添加して構成された複数の研削砥石と、を具備したことを特徴とする。ホウ素化合物は、B4C、HBN、又はCBNの何れかから構成される
【選択図】図5
Description
フェノール樹脂から形成されたレジンボンドに粒径5μmのダイアモンド砥粒を体積比で10〜20%と粒径1μmのSiC粒子を体積比で35〜25%混入して直方体形状に成形した。この成形体を180℃の焼結温度で約8時間焼結してレジンボンド砥石を形成した。
粒径5μmのダイアモンド砥粒を混入してニッケルメッキ液を作成した。このニッケルメッキ液中にアルミニウムの線材を挿入して電気鋳造した。電気鋳造後アルミニウムの線材を溶解して粒径5μmのダイアモンド砥粒を体積比で15〜20%含有したパイプ形状電鋳砥石を形成した。
10 研削ユニット
11 サファイアウエーハ
18 スピンドル
20 ホイールマウント
22,22A 研削ホイール
23 保護テープ
24,24A 環状基台
26 研削砥石(レジンボンド砥石)
36 チャックテーブル
46 パイプ形状電鋳砥石
Claims (4)
- 被加工物を研削する研削ホイールであって、
ホイールマウントに装着されるホイールマウント装着面を有する環状基台と、
該環状基台の自由端部にリング状に配設されたダイアモンド砥粒にホウ素化合物を添加して構成された複数の研削砥石と、
を具備したことを特徴とする研削ホイール。 - 該ホウ素化合物は、B4C、HBN及びCBNからなる群から選択される請求項1記載の研削ホイール。
- 該研削砥石は、ダイアモンド砥粒及びホウ素化合物をレジンボンド、ビトリファイドボンド、メタルボンドの何れかに混錬して焼結した焼結砥石から構成される請求項1又は2記載の研削ホイール。
- 該切削砥石は、ダイアモンド砥粒及びホウ素化合物をニッケルメッキで固定した電鋳砥石から構成される請求項1又は2記載の研削ホイール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201257A JP2012056013A (ja) | 2010-09-08 | 2010-09-08 | 研削ホイール |
TW100126595A TW201210750A (en) | 2010-09-08 | 2011-07-27 | Grinding disc |
KR1020110078237A KR20120025971A (ko) | 2010-09-08 | 2011-08-05 | 연삭 휠 |
CN2011102625121A CN102398227A (zh) | 2010-09-08 | 2011-09-06 | 磨轮 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201257A JP2012056013A (ja) | 2010-09-08 | 2010-09-08 | 研削ホイール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012056013A true JP2012056013A (ja) | 2012-03-22 |
Family
ID=45881093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010201257A Pending JP2012056013A (ja) | 2010-09-08 | 2010-09-08 | 研削ホイール |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2012056013A (ja) |
KR (1) | KR20120025971A (ja) |
CN (1) | CN102398227A (ja) |
TW (1) | TW201210750A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016147359A (ja) * | 2015-02-13 | 2016-08-18 | 株式会社ディスコ | 研削砥石 |
US20160361793A1 (en) * | 2015-06-10 | 2016-12-15 | Disco Corporation | Abrasive grindstone |
CN109465758A (zh) * | 2018-12-25 | 2019-03-15 | 苏州远东砂轮有限公司 | 用于磨削钛合金的陶瓷结合剂cbn复合砂轮及制备方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201347921A (zh) * | 2012-05-21 | 2013-12-01 | Ritedia Corp | 自潤性砂輪 |
CN102896311B (zh) * | 2012-09-19 | 2014-09-24 | 河南省亚龙金刚石制品有限公司 | 一种金刚石复合片用粉末状粘接剂及其制备方法 |
CN104385118A (zh) * | 2014-09-17 | 2015-03-04 | 浙江舜宇光学有限公司 | 一种金刚石丸片及其应用方法、研磨工具 |
JP2016168660A (ja) * | 2015-03-13 | 2016-09-23 | 株式会社ディスコ | 研削ホイール |
JP6707278B2 (ja) * | 2015-09-04 | 2020-06-10 | 株式会社ディスコ | 研削ホイール及び被加工物の研削方法 |
CN105856085B (zh) * | 2016-03-30 | 2018-05-18 | 东北大学 | 用碳化硼制备研磨盘的方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62136375A (ja) * | 1985-12-06 | 1987-06-19 | Towa Shoko Kk | 超硬砥粒砥石の製造法 |
JPS62148159A (ja) * | 1985-12-20 | 1987-07-02 | Nippon Seiko Kk | 超砥粒超仕上砥石 |
JPS637458U (ja) * | 1986-06-30 | 1988-01-19 | ||
JPH03190671A (ja) * | 1989-12-21 | 1991-08-20 | Nippon Steel Corp | 焼結錫ボンド研磨砥石およびその製造方法 |
JP2001252874A (ja) * | 2000-03-10 | 2001-09-18 | Asahi Diamond Industrial Co Ltd | レジンボンド超砥粒ホイール及びその製造方法 |
JP2001300856A (ja) * | 2000-04-18 | 2001-10-30 | Allied Material Corp | 超砥粒工具 |
JP2002507491A (ja) * | 1998-03-27 | 2002-03-12 | サンーゴバン アブレイシブズ,インコーポレイティド | 研磨工具 |
JP2003225866A (ja) * | 2002-01-31 | 2003-08-12 | Allied Material Corp | 薄板加工用メタルボンドダイヤモンドラップ定盤 |
JP2004098266A (ja) * | 2002-09-12 | 2004-04-02 | Polymatech Co Ltd | 研磨砥石及びその製造方法 |
JP2005118994A (ja) * | 1999-01-07 | 2005-05-12 | Saint-Gobain Abrasives Inc | 活性結合剤を有する超砥石 |
JP2010052076A (ja) * | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101148037A (zh) * | 2007-11-07 | 2008-03-26 | 南京航空航天大学 | 具有自润滑功能的金属结合剂立方氮化硼砂轮的制作方法 |
-
2010
- 2010-09-08 JP JP2010201257A patent/JP2012056013A/ja active Pending
-
2011
- 2011-07-27 TW TW100126595A patent/TW201210750A/zh unknown
- 2011-08-05 KR KR1020110078237A patent/KR20120025971A/ko not_active Application Discontinuation
- 2011-09-06 CN CN2011102625121A patent/CN102398227A/zh active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62136375A (ja) * | 1985-12-06 | 1987-06-19 | Towa Shoko Kk | 超硬砥粒砥石の製造法 |
JPS62148159A (ja) * | 1985-12-20 | 1987-07-02 | Nippon Seiko Kk | 超砥粒超仕上砥石 |
JPS637458U (ja) * | 1986-06-30 | 1988-01-19 | ||
JPH03190671A (ja) * | 1989-12-21 | 1991-08-20 | Nippon Steel Corp | 焼結錫ボンド研磨砥石およびその製造方法 |
JP2002507491A (ja) * | 1998-03-27 | 2002-03-12 | サンーゴバン アブレイシブズ,インコーポレイティド | 研磨工具 |
JP2005118994A (ja) * | 1999-01-07 | 2005-05-12 | Saint-Gobain Abrasives Inc | 活性結合剤を有する超砥石 |
JP2001252874A (ja) * | 2000-03-10 | 2001-09-18 | Asahi Diamond Industrial Co Ltd | レジンボンド超砥粒ホイール及びその製造方法 |
JP2001300856A (ja) * | 2000-04-18 | 2001-10-30 | Allied Material Corp | 超砥粒工具 |
JP2003225866A (ja) * | 2002-01-31 | 2003-08-12 | Allied Material Corp | 薄板加工用メタルボンドダイヤモンドラップ定盤 |
JP2004098266A (ja) * | 2002-09-12 | 2004-04-02 | Polymatech Co Ltd | 研磨砥石及びその製造方法 |
JP2010052076A (ja) * | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016147359A (ja) * | 2015-02-13 | 2016-08-18 | 株式会社ディスコ | 研削砥石 |
DE102016202162A1 (de) | 2015-02-13 | 2016-08-18 | Disco Corporation | Schleifstein |
KR20160100245A (ko) | 2015-02-13 | 2016-08-23 | 가부시기가이샤 디스코 | 연삭 지석 |
CN105881247A (zh) * | 2015-02-13 | 2016-08-24 | 株式会社迪思科 | 磨削磨具 |
US20160361793A1 (en) * | 2015-06-10 | 2016-12-15 | Disco Corporation | Abrasive grindstone |
DE102016210001A1 (de) | 2015-06-10 | 2016-12-15 | Disco Corporation | Schleifstein |
KR20160145500A (ko) | 2015-06-10 | 2016-12-20 | 가부시기가이샤 디스코 | 연삭 지석 |
CN106239389A (zh) * | 2015-06-10 | 2016-12-21 | 株式会社迪思科 | 磨削磨具 |
JP2017001136A (ja) * | 2015-06-10 | 2017-01-05 | 株式会社ディスコ | 研削砥石 |
KR102549249B1 (ko) * | 2015-06-10 | 2023-06-28 | 가부시기가이샤 디스코 | 연삭 지석 |
CN109465758A (zh) * | 2018-12-25 | 2019-03-15 | 苏州远东砂轮有限公司 | 用于磨削钛合金的陶瓷结合剂cbn复合砂轮及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102398227A (zh) | 2012-04-04 |
KR20120025971A (ko) | 2012-03-16 |
TW201210750A (en) | 2012-03-16 |
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