JP2012086291A - 切削砥石 - Google Patents
切削砥石 Download PDFInfo
- Publication number
- JP2012086291A JP2012086291A JP2010233939A JP2010233939A JP2012086291A JP 2012086291 A JP2012086291 A JP 2012086291A JP 2010233939 A JP2010233939 A JP 2010233939A JP 2010233939 A JP2010233939 A JP 2010233939A JP 2012086291 A JP2012086291 A JP 2012086291A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- grindstone
- blade
- boron
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
Abstract
【解決手段】 ホウ素をドープしたダイアモンド砥粒を含有した切削砥石。切削砥石は、電鋳砥石、レジンボンド砥石、メタルボンド砥石、ビトリファイドボンド砥石の何れかから構成される。
【選択図】図7
Description
平均粒径5μmのダイアモンド砥粒を混入してニッケルメッキ液を作成した。このニッケルメッキ液中でハブブレードの外周を電気鋳造し、平均粒径5μmのダイアモンド砥粒を体積比で15〜20%含有した厚さ30μmの電鋳砥石を有するハブブレード28を製造した。
フェノール樹脂から形成されたレジンボンドに平均粒径5μmのダイアモンド砥粒を体積比で10〜20%と平均粒径1μmのSiC粒子をフィラーとして体積比で35〜25%混入しワッシャー形状に成形した。
18 チャックテーブル
24 切削ユニット
26 スピンドル
28 切削ブレード
50 電鋳砥石
56 ワッシャー状レジンボンド砥石
Claims (3)
- 被加工物を切削する切削砥石であって、
ホウ素をドープしたダイアモンド砥粒によって構成したことを特徴とする切削砥石。 - 切削砥石は、ホウ素をドープしたダイアモンド砥粒をニッケルメッキで固定した電鋳砥石から構成される請求項1記載の切削砥石。
- 切削砥石は、ホウ素をドープしたダイアモンド砥粒をレジンボンド、ビトリファイドボンド、メタルボンドの何れかに混錬して焼結した焼結砥石から構成される請求項1記載の切削砥石。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010233939A JP2012086291A (ja) | 2010-10-18 | 2010-10-18 | 切削砥石 |
KR1020110103144A KR20120040107A (ko) | 2010-10-18 | 2011-10-10 | 절삭 지석 |
CN2011103149739A CN102452047A (zh) | 2010-10-18 | 2011-10-17 | 切削砂轮 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010233939A JP2012086291A (ja) | 2010-10-18 | 2010-10-18 | 切削砥石 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012086291A true JP2012086291A (ja) | 2012-05-10 |
Family
ID=46035944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010233939A Pending JP2012086291A (ja) | 2010-10-18 | 2010-10-18 | 切削砥石 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2012086291A (ja) |
KR (1) | KR20120040107A (ja) |
CN (1) | CN102452047A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015029987A1 (ja) * | 2013-08-26 | 2015-03-05 | 株式会社東京精密 | ダイシングブレード |
WO2015029988A1 (ja) * | 2013-08-26 | 2015-03-05 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
JP2017226057A (ja) * | 2016-06-24 | 2017-12-28 | 株式会社ディスコ | 切削砥石 |
WO2022197132A1 (ko) * | 2021-03-17 | 2022-09-22 | 이화다이아몬드공업주식회사 | 다이아몬드 디스크 및 그 제조 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6564624B2 (ja) * | 2015-06-10 | 2019-08-21 | 株式会社ディスコ | 研削砥石 |
JP6549927B2 (ja) * | 2015-07-24 | 2019-07-24 | 株式会社ディスコ | ホウ素化合物を添加した切削砥石 |
JP2017047502A (ja) * | 2015-09-02 | 2017-03-09 | 株式会社ディスコ | 切削砥石 |
JP7408232B2 (ja) * | 2019-06-11 | 2024-01-05 | 株式会社ディスコ | 環状の砥石の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10151569A (ja) * | 1996-11-25 | 1998-06-09 | Osaka Diamond Ind Co Ltd | 超砥粒砥石及びその製造方法 |
JP2001009729A (ja) * | 1999-06-25 | 2001-01-16 | Osaka Diamond Ind Co Ltd | 超砥粒切断ホイール |
JP2001252876A (ja) * | 2000-03-10 | 2001-09-18 | Allied Material Corp | 粉末高速度工具鋼を基板とした超砥粒切断ホイール |
JP2002331464A (ja) * | 2001-05-09 | 2002-11-19 | Disco Abrasive Syst Ltd | 切削ブレード |
JP2006502955A (ja) * | 2002-10-16 | 2006-01-26 | ダイヤモンド イノベーションズ、インク. | ホウ素をドープしたブルー・ダイヤモンド及びその製造 |
-
2010
- 2010-10-18 JP JP2010233939A patent/JP2012086291A/ja active Pending
-
2011
- 2011-10-10 KR KR1020110103144A patent/KR20120040107A/ko not_active Application Discontinuation
- 2011-10-17 CN CN2011103149739A patent/CN102452047A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10151569A (ja) * | 1996-11-25 | 1998-06-09 | Osaka Diamond Ind Co Ltd | 超砥粒砥石及びその製造方法 |
JP2001009729A (ja) * | 1999-06-25 | 2001-01-16 | Osaka Diamond Ind Co Ltd | 超砥粒切断ホイール |
JP2001252876A (ja) * | 2000-03-10 | 2001-09-18 | Allied Material Corp | 粉末高速度工具鋼を基板とした超砥粒切断ホイール |
JP2002331464A (ja) * | 2001-05-09 | 2002-11-19 | Disco Abrasive Syst Ltd | 切削ブレード |
JP2006502955A (ja) * | 2002-10-16 | 2006-01-26 | ダイヤモンド イノベーションズ、インク. | ホウ素をドープしたブルー・ダイヤモンド及びその製造 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015029987A1 (ja) * | 2013-08-26 | 2015-03-05 | 株式会社東京精密 | ダイシングブレード |
WO2015029988A1 (ja) * | 2013-08-26 | 2015-03-05 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
JP6039084B2 (ja) * | 2013-08-26 | 2016-12-07 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
JP2017226057A (ja) * | 2016-06-24 | 2017-12-28 | 株式会社ディスコ | 切削砥石 |
WO2022197132A1 (ko) * | 2021-03-17 | 2022-09-22 | 이화다이아몬드공업주식회사 | 다이아몬드 디스크 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20120040107A (ko) | 2012-04-26 |
CN102452047A (zh) | 2012-05-16 |
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