JP2012004543A - 半導体ユニットおよびそれを用いた半導体装置 - Google Patents
半導体ユニットおよびそれを用いた半導体装置 Download PDFInfo
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- JP2012004543A JP2012004543A JP2011097015A JP2011097015A JP2012004543A JP 2012004543 A JP2012004543 A JP 2012004543A JP 2011097015 A JP2011097015 A JP 2011097015A JP 2011097015 A JP2011097015 A JP 2011097015A JP 2012004543 A JP2012004543 A JP 2012004543A
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Abstract
【解決手段】半導体ユニット100はL字型の導電板1,2を有し、各導電板は、この半導体ユニットの下部に固着した放熱板15に対して平行に配置された脚部1b、2bと、垂直方向に配置された平板状の胴体部1a,2aとから成る。2枚のL字型の導電板1,2の胴体部1a,2aで半導体チップ6を挟み込む構造とすることで、半導体チップ6から発生する熱をチップの両面から放熱できて放熱性能を向上することができる。また、L字型の導電板1,2の脚部1b,2bから放熱板15に熱を逃がすため、半導体ユニット100の冷却のために放熱板15が占める平面積が小さくなり、半導体装置300の小型化を図ることができる。
【選択図】 図6
Description
図17において、絶縁基板55は半田等により放熱板54上に接合され、IGBTチップ56は絶縁基板55を介して放熱板54上に搭載される。IGBTチップ56のコレクタ電極58は半田等の導電性材料で、絶縁基板55上の金属薄板55aに電気的に接続されている。
また、特許請求の範囲の請求項10に記載の発明によれば、請求項1に記載の発明において、前記半導体チップがIGBTチップと該IGBTチップと逆並列に接続するFWDチップであるとよい。
また、特許請求の範囲の請求項12に記載の発明によれば、請求項4に記載の発明において、前記外部導出端子は、前記筐体内において、互いに離して上下に配置されるが互いに離して上下に配置されるとよい。
半導体チップに流れる主電流を導電板で流すために、大電流を通電できる半導体装置に
することができる。
<実施例1>
図1は、この発明の第1実施例の半導体ユニット100の外形図であり同図(a)は正面図、同図(b)は左側面図、同図(c)は右側面図、同図(d)は上面図、同図(e)は下面図である。
L字型の導体板であるコレクタ導電板1には、IGBTチップ6の図示しないコレクタ電極が半田8によって半田付けされる。また、同じくL字型の導体板であるエミッタ導体板2には、IGBTチップ6の図示しないエミッタ電極に一方の面が半田8によって接合されたスペーサ7の他面が半田8によって半田付けされる
さらにコレクタ導電板1には、IGBTチップ6に隣接して、FWDチップ9の図示しないカソード電極も半田8によってはんだ付け付けされる。
そして、IGBTチップ6の制御電極にはワイヤ4で制御端子3が接続され、これらを樹脂5にて封止して、半導体ユニット100を構成する。
導体ユニット100の脚部1b,2bを図示しない回路基板へ実装する。したがって、脚部1b,2bによって、図示しない回路基板へ電気的に接続されるとともに、脚部1b,2bを介して、IGBTチップ6,FWDチップ9で発生した熱を図示しない放熱板や冷却フィンに伝導させる。
前記の半田8付けはAgペーストなどの導電接着剤を用いてもよい。
IGBTチップ6,FWDチップ9は扁平な形状をしており、半導体ユニット100の回路基板等への実装面に対して、扁平な面が垂直となる方向に配置される。また、制御端子3を樹脂5の上部から引き出している。このため、半導体ユニット100の脚部1b,2bの両端部の幅Wを小さくできる。パワー半導体素子を、絶縁基板上に並べて配置していた図17の構成に比べると、実装面積を大幅に縮小することができる。
同図(a)において、L字型のコレクタ導電板1の胴体部1aが水平になるように治具11に設置し、この胴体部1a上に板半田を載置し、その上にIGBTチップ6のコレクタ電極とFWDチップ9のカソード電極が接するように、IGBTチップ6とFWDチップ9を載置する。続いて、リフロー炉を通して板半田を溶融し、冷却してそれぞれを半田8で固着する。
<実施例2>
図4は、この発明の第2実施例の半導体装置の要部断面図である。これは図1の半導体ユニットを1個収容した例である。
この半導体装置200では、チップ6,9(図4ではIGBTチップ6のみ示されている)で発生した熱はIGBTチップ6,FWDチップ9の両面からL字型のコレクタ導電板1およびL字型のエミッタ導電板2に放熱され、さらにそれぞれの脚部1b、2bを通して放熱板15に放熱される。このようにIGBTチップ6,FWDチップ9で発生した熱がチップの両面から放熱されるので放熱性能は向上する。
<実施例3>
図6は、この発明の第3実施例の半導体装置の要部断面図である。この半導体装置300と図4の半導体装置200との違いは、筐体20上にドライブ基板22を配置した点である。このドライブ基板22には、IGBTチップ6を制御・保護する各種回路部品が搭載されている。そして、半導体ユニット100から導出されている制御端子3が、ドライブ基板22の回路パターン(図示せず)に接合される。
<実施例4>
図7は、この発明の第4実施例の半導体装置の要部断面図である。この半導体装置400と図4の半導体装置200との違いは、脚部1b、2bに外部導出端子17,18をレーザー溶接19した点である。こうすることで、半導体装置300をさらに小型化できる。この場合も図6のようにドライブ基板を配置する場合もある。
<実施例5>
図8は、この発明の第5実施例の半導体装置の要部断面図である。この半導体装置500と図4の半導体装置200との違いは、放熱板15の代わりに冷却体23を用いた点で
ある。冷却体23は水冷フィンもしくは風冷フィンなどを備えている。放熱板15を冷却体23に代えることで、半導体装置500の放熱効率を高めることができる。
<実施例6>
図9は、この発明の第6実施例の半導体装置の要部断面図である。この半導体装置600は2個の半導体ユニット100が直列接続された例である。
前記したように、絶縁層14は高熱伝導の絶縁樹脂シートで脚部1b,2bと放熱板15を熱圧着で固着する働きがある。この絶縁層14の代わりにDCB(Direct Copper Bonding)基板を用い、表側の導電パターンに脚部1b,2bを半田付けし、裏面の銅箔に放熱板15を固着しても構わない。
また、前記したように、外部導出端子25,26と半導体ユニット100の脚部1b,2bの上面をそれぞれ内部接続導体16で接続する。半導体ユニット間は配線導体28で接続する。これらの接続はレーザー溶接19で行われる。勿論、超音波接合で行っても構わない。また、これらの接続を半田で行う場合は半導体ユニット100で使われる半田8より融点の低いものを用いる。
また、この半導体装置600は放熱板15の下に冷却体を取り付けて使用する場合が多い。
<実施例7>
図10は、この発明の第7実施例の半導体装置の要部断面図である。この半導体装置700と図9の半導体装置600との違いは、筐体20上に蓋24を被せて、筐体20内をゲル21で充満させた点である。制御端子3は蓋24から突出している。このように蓋24を設けることでドライブ基板22がしっかり固定される。
<実施例8>
図11は、この発明の第8実施例の半導体装置の要部断面図である。この半導体装置800と図10の半導体装置700との違いは、筐体20内にドライブ基板22を収納した点である。ドライブ基板22には外部接続ピン27が設けられている。半導体ユニット100の制御端子3は、筐体20の内部でドライブ基板22に接続される。そしてドライブ基板22に設けられた外部接続ピン27を蓋24から突出させ、図示しない外部配線と接続する。
また、筐体20の内部でドライブ基板22を筐体20に固定(図示せず)することにより、外部配線と接続された外部接続ピン27に応力が印加されても、半導体ユニット100の制御端子3へ伝達されるのを防ぐことができる。
<実施例9>
図12は、この発明の第9実施例の半導体装置の要部断面図である。この半導体装置900と図11の半導体装置800との違いは、前記の放熱板15の代わりに冷却体23を用いた点である。この冷却体23はここでは水冷フィンを示したが、風冷フィンなどの場合もある。こうすることで放熱効率を高めることができる。
<実施例10>
図13は、この発明の第10実施例の半導体装置の要部平面図である。この半導体装置1000は、6個の半導体ユニット100(IGBTチップ6とFWDチップ9)が組み込まれた3相のインバータ(電力変換装置)を構成した半導体モジュールである。また、図14(a)は図13の3相インバータの1相分(1アーム分)の回路図である。
なお、図13に示す例においては、配線バー31〜38を、図示しない筐体から直接外部に導出するように構成している。すなわち、配線バー31〜38を半導体ユニットの脚部に直接レーザー溶接している。このため、図9に示す例のような、内部接続導体を省略することができる。
また、図示しないドライブ基板(例えば、図11のドライブ基板22を参照のこと)を半導体ユニット100上に配置する場合もある。その場合は制御端子3と外部制御回路を電気配線で接続する。
<実施例11>
図15は、この発明の第11実施例の半導体装置の構成図であり、同図(a)は要部平面図、同図(b)は同図(a)のY−Y線で切断した要部断面図である。
<実施例12>
図16は、この発明の第12実施例の半導体装置の構成図であり、同図(a)は要部平面図、同図(b)は同図(a)をX−X線で切断した要部断面図である。
る。
ここで、図19は、半導体ユニット100における、脚部の外部への導出例を示す図であり、導電板以外の構成の図示を省略している。
1a L字型のコレクタ導電板の胴体部
1b L字型のコレクタ導電板の脚部(半導体ユニット100の脚部1bでもある)
2 L字型のエミッタ導電板
2a L字型のエミッタ導電板の胴体部
2b L字型のエミッタ導電板の脚部(半導体ユニット100の脚部2bでもある)
3 制御端子
4 ワイヤ
5 樹脂
6 IGBTチップ
7,10 スペーサ
8 半田
9 FWDチップ
11,12 治具
13 型
14 絶縁層
15 放熱板
16 内部接続導体
17,18,25,26 外部導出端子
19 レーザー溶接
20 筐体
21 ゲル
22 ドライブ基板
23 冷却体
24 蓋
31〜39 配線バー
100 半導体ユニット
200〜1200 半導体装置
D 脚部の長さ
W 脚部の端部間の距離
T L字型の導電板1,2の厚さ
Claims (14)
- 平板状の胴体部とこれに直交する脚部を有するL字型の導電板と、前記胴体部を対向して配置した2個の前記導電板の前記胴体部間それぞれが積層して固着する半導体チップおよびスペーサと、前記半導体チップの制御電極と一端が接続する制御端子と、前記導電板の胴体部、前記スペーサ、前記半導体チップおよび制御端子の前記制御電極との接続側を封止する樹脂とを具備し、前記導電板の前記脚部と前記制御端子の他端が前記樹脂から突出することを特徴とする半導体ユニット。
- 前記請求項1の半導体ユニットと、該半導体ユニットの前記脚部の下面と絶縁層を挟んで固着する放熱板と、前記半導体ユニットの前記脚部に接続する外部導出端子と、少なくとも前記半導体ユニットの前記脚部の下面を絶縁層を挟んで固着する放熱板と、前記放熱板に固着し、前記半導体ユニット、および前記外部導出端子とを収納し前記外部導出端子の先端および前記制御端子の先端が突出する筐体と、該筐体内に充填される絶縁材と、を具備することを特徴とする半導体装置。
- 前記外部導出端子は、内部接続導体を介して前記半導体ユニットの脚部に接続されることを特徴とする請求項2に記載の半導体装置。
- 複数の前記請求項1の半導体ユニットと、該複数の半導体ユニットの前記脚部間を接続する配線導体と、前記複数の半導体ユニット前記脚部に接続する外部導出端子と、前記脚部の下面,前記配線導体の下面,前記外部導出端子の下面の少なくとも1つを、絶縁層を挟んで固着する放熱板と、該放熱板に固着し、前記半導体ユニット、前記配線導体、前記外部導出端子と、を収納し前記外部導出端子の先端および前記制御端子の先端が突出する筐体と、該筐体内に充填される絶縁材と、を具備することを特徴とする半導体装置。
- 前記外部導出端子は、内部接続導体を介して前記半導体ユニットの脚部または前記配線導体に接続されることを特徴とする請求項4に記載の半導体装置。
- 前記配線導体の一部を延長して、前記筐体より突出させて外部に導出することを特徴とする請求項4に記載の半導体装置。
- 前記筐体上に配置され前記半導体ユニットの制御端子と接続するドライブ基板を有することを特徴とする請求項2または4に記載の半導体装置。
- 前記筐体上部を覆う蓋と、前記筐体内に配置され前記絶縁材に浸漬し前記半導体ユニットの制御端子と接続するドライブ基板と、該ドライブ基板に固着し前記蓋から突出する制御導体とを有することを特徴とする請求項4に記載の半導体装置。
- 前記絶縁材がゲルであることを特徴とする請求項2〜8のいずれか一項に記載の半導体装置。
- 前記半導体チップがIGBTチップと該IGBTチップと逆並列に接続するFWDチップであることを特徴とする請求項1に記載の半導体ユニット。
- 前記外部導出端子が、インバータを構成するP端子、N端子もしくはM端子であることを特徴とする請求項4に記載の半導体装置。
- 前記外部導出端子は、前記筐体内において、互いに離して上下に配置されることを特徴とする請求項4に記載の半導体装置。
- 前記半導体ユニットの脚部と前記外部導出端子をレーザー溶接によって固着することを特徴とする請求項2に記載の半導体装置。
- 前記半導体ユニットの脚部と、前記外部導出端子並びに前記配線導体をレーザー溶接で固着することを特徴とする請求項4に記載の半導体装置。
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JP2013222886A (ja) * | 2012-04-18 | 2013-10-28 | Toshiba Corp | 半導体モジュール |
CN112086413A (zh) * | 2019-06-14 | 2020-12-15 | Jmj韩国株式会社 | 半导体封装 |
KR20200143301A (ko) * | 2019-06-14 | 2020-12-23 | 제엠제코(주) | 반도체 패키지 |
KR20200142951A (ko) * | 2019-06-14 | 2020-12-23 | 제엠제코(주) | 반도체 패키지 |
KR20210117525A (ko) * | 2020-03-19 | 2021-09-29 | 제엠제코(주) | 반도체 패키지 및 반도체 패키지 제조방법 |
CN112086413B (zh) * | 2019-06-14 | 2024-04-23 | Jmj韩国株式会社 | 半导体封装 |
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JP2013183023A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 電力変換装置 |
JP6058353B2 (ja) * | 2012-11-02 | 2017-01-11 | 株式会社東芝 | 半導体装置 |
WO2016028451A1 (en) * | 2014-08-20 | 2016-02-25 | Halliburton Energy Services, Inc. | Printed circuit board assemblies |
JP6689708B2 (ja) * | 2016-08-10 | 2020-04-28 | ルネサスエレクトロニクス株式会社 | 電子装置 |
JP7106981B2 (ja) * | 2018-05-18 | 2022-07-27 | 富士電機株式会社 | 逆導通型半導体装置 |
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JP2001156225A (ja) * | 1999-11-24 | 2001-06-08 | Denso Corp | 半導体装置 |
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JP2013222886A (ja) * | 2012-04-18 | 2013-10-28 | Toshiba Corp | 半導体モジュール |
CN112086413A (zh) * | 2019-06-14 | 2020-12-15 | Jmj韩国株式会社 | 半导体封装 |
KR20200143301A (ko) * | 2019-06-14 | 2020-12-23 | 제엠제코(주) | 반도체 패키지 |
KR20200142951A (ko) * | 2019-06-14 | 2020-12-23 | 제엠제코(주) | 반도체 패키지 |
KR102244279B1 (ko) * | 2019-06-14 | 2021-04-26 | 제엠제코(주) | 반도체 패키지 |
KR102264132B1 (ko) * | 2019-06-14 | 2021-06-11 | 제엠제코(주) | 반도체 패키지 |
US11482463B2 (en) | 2019-06-14 | 2022-10-25 | Jmj Korea Co., Ltd. | Vertically attaching a chip to a substrate |
CN112086413B (zh) * | 2019-06-14 | 2024-04-23 | Jmj韩国株式会社 | 半导体封装 |
KR20210117525A (ko) * | 2020-03-19 | 2021-09-29 | 제엠제코(주) | 반도체 패키지 및 반도체 패키지 제조방법 |
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US20110278643A1 (en) | 2011-11-17 |
US8710644B2 (en) | 2014-04-29 |
JP5659938B2 (ja) | 2015-01-28 |
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