JP2011528406A5 - - Google Patents
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- Publication number
- JP2011528406A5 JP2011528406A5 JP2011518879A JP2011518879A JP2011528406A5 JP 2011528406 A5 JP2011528406 A5 JP 2011528406A5 JP 2011518879 A JP2011518879 A JP 2011518879A JP 2011518879 A JP2011518879 A JP 2011518879A JP 2011528406 A5 JP2011528406 A5 JP 2011528406A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- electrolyte composition
- composition according
- complexing agent
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003792 electrolyte Substances 0.000 claims 15
- 239000008139 complexing agent Substances 0.000 claims 9
- 150000003839 salts Chemical class 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims 4
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims 4
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims 4
- CIEZZGWIJBXOTE-UHFFFAOYSA-N 2-[bis(carboxymethyl)amino]propanoic acid Chemical compound OC(=O)C(C)N(CC(O)=O)CC(O)=O CIEZZGWIJBXOTE-UHFFFAOYSA-N 0.000 claims 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims 3
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 3
- 229910052684 Cerium Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 2
- 229920000388 Polyphosphate Polymers 0.000 claims 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims 2
- 229940091173 hydantoin Drugs 0.000 claims 2
- 150000001469 hydantoins Chemical class 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 150000002500 ions Chemical class 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 239000011733 molybdenum Substances 0.000 claims 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims 2
- 239000001205 polyphosphate Substances 0.000 claims 2
- 235000011176 polyphosphates Nutrition 0.000 claims 2
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims 2
- 239000011975 tartaric acid Substances 0.000 claims 2
- 235000002906 tartaric acid Nutrition 0.000 claims 2
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 claims 2
- -1 tricarboxylic acid salt Chemical class 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 1
- 241000282693 Cercopithecidae Species 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 1
- VJMAITQRABEEKP-UHFFFAOYSA-N [6-(phenylmethoxymethyl)-1,4-dioxan-2-yl]methyl acetate Chemical compound O1C(COC(=O)C)COCC1COCC1=CC=CC=C1 VJMAITQRABEEKP-UHFFFAOYSA-N 0.000 claims 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 1
- 235000003704 aspartic acid Nutrition 0.000 claims 1
- 125000002648 azanetriyl group Chemical group *N(*)* 0.000 claims 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- 235000015165 citric acid Nutrition 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 235000011180 diphosphates Nutrition 0.000 claims 1
- 235000019820 disodium diphosphate Nutrition 0.000 claims 1
- GYQBBRRVRKFJRG-UHFFFAOYSA-L disodium pyrophosphate Chemical compound [Na+].[Na+].OP([O-])(=O)OP(O)([O-])=O GYQBBRRVRKFJRG-UHFFFAOYSA-L 0.000 claims 1
- 229940038485 disodium pyrophosphate Drugs 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000001630 malic acid Substances 0.000 claims 1
- 235000011090 malic acid Nutrition 0.000 claims 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims 1
- XWIJIXWOZCRYEL-UHFFFAOYSA-M potassium;methanesulfonate Chemical compound [K+].CS([O-])(=O)=O XWIJIXWOZCRYEL-UHFFFAOYSA-M 0.000 claims 1
- 229940048084 pyrophosphate Drugs 0.000 claims 1
- 239000001476 sodium potassium tartrate Substances 0.000 claims 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims 1
- KKVTYAVXTDIPAP-UHFFFAOYSA-M sodium;methanesulfonate Chemical compound [Na+].CS([O-])(=O)=O KKVTYAVXTDIPAP-UHFFFAOYSA-M 0.000 claims 1
- 229940095064 tartrate Drugs 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200810033174 DE102008033174B3 (de) | 2008-07-15 | 2008-07-15 | Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht |
| DE102008033174.0 | 2008-07-15 | ||
| PCT/US2009/050683 WO2010009225A1 (en) | 2008-07-15 | 2009-07-15 | Cyanide free electrolyte composition for the galvanic deposition of a copper layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011528406A JP2011528406A (ja) | 2011-11-17 |
| JP2011528406A5 true JP2011528406A5 (enExample) | 2012-08-30 |
| JP5690727B2 JP5690727B2 (ja) | 2015-03-25 |
Family
ID=40953336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011518879A Active JP5690727B2 (ja) | 2008-07-15 | 2009-07-15 | 銅層のガルバニック堆積のための無シアン化物電解質組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8808525B2 (enExample) |
| EP (1) | EP2329062B1 (enExample) |
| JP (1) | JP5690727B2 (enExample) |
| KR (1) | KR101624759B1 (enExample) |
| CN (1) | CN102159752B (enExample) |
| DE (1) | DE102008033174B3 (enExample) |
| WO (1) | WO2010009225A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2620529B1 (en) * | 2012-01-25 | 2014-04-30 | Atotech Deutschland GmbH | Method for producing matt copper deposits |
| CL2012003726A1 (es) * | 2012-12-28 | 2013-02-01 | Quiborax Sa | Uso de acidos debiles oxigenados o polioxigenados, minerales o compuestos que los generen en la electrodepositacion de cobre; procedimiento de electro obtencion que comprende adicionar dicho acido debil, o un compuesto o un mineral que lo genere al proceso de electrodepositacion de cobre. |
| CN103014789B (zh) * | 2013-01-14 | 2015-11-04 | 厦门大学 | 一种碱性无氰镀铜阳极溶解促进剂 |
| EP3080340B1 (en) * | 2013-12-09 | 2018-04-18 | Aveni | Copper electrodeposition bath containing an electrochemically inert cation |
| CN104711648B (zh) * | 2013-12-17 | 2019-08-16 | Ykk株式会社 | 闪镀铜镀敷液 |
| CN105951138B (zh) * | 2016-06-15 | 2018-03-30 | 苏州禾川化学技术服务有限公司 | 一种环保碱铜电镀液及其电镀方法 |
| DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
| CN110158129B (zh) * | 2019-05-27 | 2020-06-05 | 广州三孚新材料科技股份有限公司 | 预渗透剂组合物、预渗透剂、镀铜预处理方法和无氰镀铜方法 |
| CN114293232B (zh) * | 2021-12-02 | 2023-03-17 | 北京科技大学 | 一种电铸制备钨弥散强化铜复合材料的方法 |
| JP7436071B1 (ja) | 2022-11-25 | 2024-02-21 | 株式会社シミズ | 非シアン真鍮めっき浴およびめっき方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2700019A (en) * | 1951-07-05 | 1955-01-18 | Westinghouse Electric Corp | Acid copper plating |
| US3310430A (en) * | 1965-06-30 | 1967-03-21 | Day Company | Electroless copper plating |
| US3475292A (en) | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| JPS5672196A (en) * | 1979-11-19 | 1981-06-16 | Shimizu Shoji Kk | Bright plating bath for copper-tin alloy |
| JPS57193095A (en) * | 1981-05-25 | 1982-11-27 | Furukawa Circuit Foil | Copper foil for printed circuit and method of producing same |
| JPH04293792A (ja) * | 1991-03-22 | 1992-10-19 | Kawasaki Steel Corp | ステンレス鋼帯の脱スケール方法 |
| US5750018A (en) * | 1997-03-18 | 1998-05-12 | Learonal, Inc. | Cyanide-free monovalent copper electroplating solutions |
| EP0913502B1 (en) * | 1997-04-07 | 2006-05-31 | Okuno Chemical Industries Co., Ltd. | Method of electroplating nonconductive plastic molded product |
| TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
| TWI238459B (en) * | 2000-11-15 | 2005-08-21 | Intel Corp | Copper alloy interconnections for integrated circuits and methods of making same |
| US20040253450A1 (en) * | 2001-05-24 | 2004-12-16 | Shipley Company, L.L.C. | Formaldehyde-free electroless copper plating process and solution for use in the process |
| US6511589B1 (en) | 2001-08-17 | 2003-01-28 | Electroplating Engineers Of Japan Limited | Gold plating solution and gold plating method using thereof |
| US20030155247A1 (en) * | 2002-02-19 | 2003-08-21 | Shipley Company, L.L.C. | Process for electroplating silicon wafers |
| JP2007262430A (ja) * | 2006-03-27 | 2007-10-11 | C Uyemura & Co Ltd | 電気めっき方法 |
| TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
-
2008
- 2008-07-15 DE DE200810033174 patent/DE102008033174B3/de active Active
-
2009
- 2009-07-15 EP EP09790463.5A patent/EP2329062B1/en active Active
- 2009-07-15 US US13/054,048 patent/US8808525B2/en active Active
- 2009-07-15 KR KR1020117003398A patent/KR101624759B1/ko active Active
- 2009-07-15 WO PCT/US2009/050683 patent/WO2010009225A1/en not_active Ceased
- 2009-07-15 JP JP2011518879A patent/JP5690727B2/ja active Active
- 2009-07-15 CN CN200980136225.7A patent/CN102159752B/zh active Active
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