KR101624759B1 - 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 - Google Patents

구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 Download PDF

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KR101624759B1
KR101624759B1 KR1020117003398A KR20117003398A KR101624759B1 KR 101624759 B1 KR101624759 B1 KR 101624759B1 KR 1020117003398 A KR1020117003398 A KR 1020117003398A KR 20117003398 A KR20117003398 A KR 20117003398A KR 101624759 B1 KR101624759 B1 KR 101624759B1
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acid
electrolyte composition
metalate
copper
electrolyte
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KR20110039460A (ko
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스테판 샤퍼
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엔쏜 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020117003398A 2008-07-15 2009-07-15 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 Active KR101624759B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810033174 DE102008033174B3 (de) 2008-07-15 2008-07-15 Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
DE102008033174.0 2008-07-15

Publications (2)

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KR20110039460A KR20110039460A (ko) 2011-04-18
KR101624759B1 true KR101624759B1 (ko) 2016-06-07

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KR1020117003398A Active KR101624759B1 (ko) 2008-07-15 2009-07-15 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물

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US (1) US8808525B2 (enExample)
EP (1) EP2329062B1 (enExample)
JP (1) JP5690727B2 (enExample)
KR (1) KR101624759B1 (enExample)
CN (1) CN102159752B (enExample)
DE (1) DE102008033174B3 (enExample)
WO (1) WO2010009225A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2620529B1 (en) * 2012-01-25 2014-04-30 Atotech Deutschland GmbH Method for producing matt copper deposits
CL2012003726A1 (es) * 2012-12-28 2013-02-01 Quiborax Sa Uso de acidos debiles oxigenados o polioxigenados, minerales o compuestos que los generen en la electrodepositacion de cobre; procedimiento de electro obtencion que comprende adicionar dicho acido debil, o un compuesto o un mineral que lo genere al proceso de electrodepositacion de cobre.
CN103014789B (zh) * 2013-01-14 2015-11-04 厦门大学 一种碱性无氰镀铜阳极溶解促进剂
EP3080340B1 (en) * 2013-12-09 2018-04-18 Aveni Copper electrodeposition bath containing an electrochemically inert cation
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
CN105951138B (zh) * 2016-06-15 2018-03-30 苏州禾川化学技术服务有限公司 一种环保碱铜电镀液及其电镀方法
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN110158129B (zh) * 2019-05-27 2020-06-05 广州三孚新材料科技股份有限公司 预渗透剂组合物、预渗透剂、镀铜预处理方法和无氰镀铜方法
CN114293232B (zh) * 2021-12-02 2023-03-17 北京科技大学 一种电铸制备钨弥散强化铜复合材料的方法
JP7436071B1 (ja) 2022-11-25 2024-02-21 株式会社シミズ 非シアン真鍮めっき浴およびめっき方法

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating
US3475292A (en) 1966-02-10 1969-10-28 Technic Gold plating bath and process
JPS5672196A (en) * 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
JPS57193095A (en) * 1981-05-25 1982-11-27 Furukawa Circuit Foil Copper foil for printed circuit and method of producing same
JPH04293792A (ja) * 1991-03-22 1992-10-19 Kawasaki Steel Corp ステンレス鋼帯の脱スケール方法
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
EP0913502B1 (en) * 1997-04-07 2006-05-31 Okuno Chemical Industries Co., Ltd. Method of electroplating nonconductive plastic molded product
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
TWI238459B (en) * 2000-11-15 2005-08-21 Intel Corp Copper alloy interconnections for integrated circuits and methods of making same
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
US6511589B1 (en) 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
US20030155247A1 (en) * 2002-02-19 2003-08-21 Shipley Company, L.L.C. Process for electroplating silicon wafers
JP2007262430A (ja) * 2006-03-27 2007-10-11 C Uyemura & Co Ltd 電気めっき方法
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples

Also Published As

Publication number Publication date
US8808525B2 (en) 2014-08-19
WO2010009225A1 (en) 2010-01-21
EP2329062B1 (en) 2013-05-29
DE102008033174B3 (de) 2009-09-17
CN102159752B (zh) 2013-01-16
JP2011528406A (ja) 2011-11-17
JP5690727B2 (ja) 2015-03-25
CN102159752A (zh) 2011-08-17
US20110180415A1 (en) 2011-07-28
KR20110039460A (ko) 2011-04-18
EP2329062A1 (en) 2011-06-08

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