CN102159752B - 用于电沉积铜层的无氰电解液组合物 - Google Patents

用于电沉积铜层的无氰电解液组合物 Download PDF

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Publication number
CN102159752B
CN102159752B CN200980136225.7A CN200980136225A CN102159752B CN 102159752 B CN102159752 B CN 102159752B CN 200980136225 A CN200980136225 A CN 200980136225A CN 102159752 B CN102159752 B CN 102159752B
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Prior art keywords
acid
electrolyte composition
copper
composition according
concentration
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Chinese (zh)
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CN102159752A (zh
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斯蒂芬·沙菲尔
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MacDermid Enthone Inc
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Enthone OMI Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN200980136225.7A 2008-07-15 2009-07-15 用于电沉积铜层的无氰电解液组合物 Active CN102159752B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200810033174 DE102008033174B3 (de) 2008-07-15 2008-07-15 Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
DE102008033174.0 2008-07-15
PCT/US2009/050683 WO2010009225A1 (en) 2008-07-15 2009-07-15 Cyanide free electrolyte composition for the galvanic deposition of a copper layer

Publications (2)

Publication Number Publication Date
CN102159752A CN102159752A (zh) 2011-08-17
CN102159752B true CN102159752B (zh) 2013-01-16

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CN200980136225.7A Active CN102159752B (zh) 2008-07-15 2009-07-15 用于电沉积铜层的无氰电解液组合物

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Country Link
US (1) US8808525B2 (enExample)
EP (1) EP2329062B1 (enExample)
JP (1) JP5690727B2 (enExample)
KR (1) KR101624759B1 (enExample)
CN (1) CN102159752B (enExample)
DE (1) DE102008033174B3 (enExample)
WO (1) WO2010009225A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2620529B1 (en) * 2012-01-25 2014-04-30 Atotech Deutschland GmbH Method for producing matt copper deposits
CL2012003726A1 (es) * 2012-12-28 2013-02-01 Quiborax Sa Uso de acidos debiles oxigenados o polioxigenados, minerales o compuestos que los generen en la electrodepositacion de cobre; procedimiento de electro obtencion que comprende adicionar dicho acido debil, o un compuesto o un mineral que lo genere al proceso de electrodepositacion de cobre.
CN103014789B (zh) * 2013-01-14 2015-11-04 厦门大学 一种碱性无氰镀铜阳极溶解促进剂
EP3080340B1 (en) * 2013-12-09 2018-04-18 Aveni Copper electrodeposition bath containing an electrochemically inert cation
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
CN105951138B (zh) * 2016-06-15 2018-03-30 苏州禾川化学技术服务有限公司 一种环保碱铜电镀液及其电镀方法
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN110158129B (zh) * 2019-05-27 2020-06-05 广州三孚新材料科技股份有限公司 预渗透剂组合物、预渗透剂、镀铜预处理方法和无氰镀铜方法
CN114293232B (zh) * 2021-12-02 2023-03-17 北京科技大学 一种电铸制备钨弥散强化铜复合材料的方法
JP7436071B1 (ja) 2022-11-25 2024-02-21 株式会社シミズ 非シアン真鍮めっき浴およびめっき方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
CN1256722A (zh) * 1997-03-18 2000-06-14 利罗纳尔公司 一价铜无氰电镀液
CN101104927A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 无电镀铜和氧化还原对

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating
US3475292A (en) 1966-02-10 1969-10-28 Technic Gold plating bath and process
JPS5672196A (en) * 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
JPS57193095A (en) * 1981-05-25 1982-11-27 Furukawa Circuit Foil Copper foil for printed circuit and method of producing same
JPH04293792A (ja) * 1991-03-22 1992-10-19 Kawasaki Steel Corp ステンレス鋼帯の脱スケール方法
EP0913502B1 (en) * 1997-04-07 2006-05-31 Okuno Chemical Industries Co., Ltd. Method of electroplating nonconductive plastic molded product
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
TWI238459B (en) * 2000-11-15 2005-08-21 Intel Corp Copper alloy interconnections for integrated circuits and methods of making same
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
US6511589B1 (en) 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
US20030155247A1 (en) * 2002-02-19 2003-08-21 Shipley Company, L.L.C. Process for electroplating silicon wafers
JP2007262430A (ja) * 2006-03-27 2007-10-11 C Uyemura & Co Ltd 電気めっき方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
CN1256722A (zh) * 1997-03-18 2000-06-14 利罗纳尔公司 一价铜无氰电镀液
CN101104927A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 无电镀铜和氧化还原对

Also Published As

Publication number Publication date
US8808525B2 (en) 2014-08-19
WO2010009225A1 (en) 2010-01-21
EP2329062B1 (en) 2013-05-29
DE102008033174B3 (de) 2009-09-17
KR101624759B1 (ko) 2016-06-07
JP2011528406A (ja) 2011-11-17
JP5690727B2 (ja) 2015-03-25
CN102159752A (zh) 2011-08-17
US20110180415A1 (en) 2011-07-28
KR20110039460A (ko) 2011-04-18
EP2329062A1 (en) 2011-06-08

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