JP2011526052A5 - - Google Patents
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- Publication number
- JP2011526052A5 JP2011526052A5 JP2011512492A JP2011512492A JP2011526052A5 JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5 JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5
- Authority
- JP
- Japan
- Prior art keywords
- encapsulating composition
- adhesive encapsulating
- weight
- emitting unit
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5806708P | 2008-06-02 | 2008-06-02 | |
| US61/058,067 | 2008-06-02 | ||
| PCT/US2009/041510 WO2009148716A2 (en) | 2008-06-02 | 2009-04-23 | Adhesive encapsulating composition and electronic devices made therewith |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011526052A JP2011526052A (ja) | 2011-09-29 |
| JP2011526052A5 true JP2011526052A5 (enExample) | 2012-06-14 |
| JP5270755B2 JP5270755B2 (ja) | 2013-08-21 |
Family
ID=41398750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011512492A Active JP5270755B2 (ja) | 2008-06-02 | 2009-04-23 | 接着剤封入組成物及びそれで作られた電子デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110073901A1 (enExample) |
| EP (1) | EP2291479B1 (enExample) |
| JP (1) | JP5270755B2 (enExample) |
| KR (1) | KR20110020862A (enExample) |
| CN (1) | CN102076803B (enExample) |
| TW (1) | TW201005063A (enExample) |
| WO (1) | WO2009148716A2 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9024455B2 (en) | 2010-05-26 | 2015-05-05 | Hitachi Chemical Company, Ltd. | Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device |
| US8232350B2 (en) * | 2008-06-02 | 2012-07-31 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| WO2011057005A2 (en) * | 2009-11-04 | 2011-05-12 | Klöckner Pentaplast Of America, Inc. | Configuration of multiple thermoformable film layers for rigid packaging requiring moisture and oxygen protection |
| WO2011062851A1 (en) | 2009-11-19 | 2011-05-26 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acylic polymer |
| CN102666764B (zh) | 2009-11-19 | 2015-09-30 | 3M创新有限公司 | 包含与丙烯酸类聚合物氢键结合的官能化聚异丁烯的压敏粘合剂 |
| JP2011151388A (ja) * | 2009-12-24 | 2011-08-04 | Mitsubishi Plastics Inc | 太陽電池封止材及びそれを用いて作製された太陽電池モジュール |
| US20130102734A1 (en) * | 2010-04-22 | 2013-04-25 | Daicel Corporation | Photosemiconductor protective material and precursor thereof, and process for producing photosemiconductor protective material |
| EP2637229B1 (en) | 2010-11-02 | 2018-01-03 | LG Chem, Ltd. | Adhesive film and method for encapsulating organic electronic device using the same |
| CN103210035B (zh) | 2010-11-16 | 2015-08-12 | 3M创新有限公司 | 可紫外线固化的酸酐改性聚(异丁烯) |
| US8663407B2 (en) | 2010-11-17 | 2014-03-04 | 3M Innovative Properties Company | Isobutylene (Co)polymeric adhesive composition |
| US8629209B2 (en) | 2010-12-02 | 2014-01-14 | 3M Innovative Properties Company | Moisture curable isobutylene adhesive copolymers |
| TWI552883B (zh) * | 2011-07-25 | 2016-10-11 | Lintec Corp | Gas barrier film laminates and electronic components |
| KR101614631B1 (ko) | 2011-09-29 | 2016-04-21 | 미쓰이 가가쿠 가부시키가이샤 | 접착성 조성물, 및 이것을 이용한 화상 표시 장치 |
| CN103998238B (zh) * | 2012-01-06 | 2016-08-24 | Lg化学株式会社 | 封装薄膜 |
| US8481626B1 (en) | 2012-01-16 | 2013-07-09 | Itron, Inc. | Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
| US8728568B2 (en) | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
| JP5938514B2 (ja) * | 2012-03-12 | 2016-06-22 | エルジー・ケム・リミテッド | 粘着剤組成物 |
| WO2013146015A1 (ja) * | 2012-03-28 | 2013-10-03 | 昭和電工株式会社 | 重合性組成物、重合物、粘着シート、画像表示装置の製造方法、及び画像表示装置 |
| JP5788124B2 (ja) | 2012-03-29 | 2015-09-30 | スリーエム イノベイティブ プロパティズ カンパニー | ペンダントフリーラジカル重合性四級アンモニウム置換基を含むポリ(イソブチレン)コポリマーを含む接着剤 |
| US9422464B2 (en) | 2012-05-11 | 2016-08-23 | 3M Innovative Properties Company | Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines |
| EP2853574A4 (en) * | 2012-05-22 | 2016-03-02 | Sekisui Chemical Co Ltd | SHEET SEALING ELEMENT AND HISTORED SHEET SEALING ELEMENT |
| TWI504507B (zh) | 2012-08-03 | 2015-10-21 | Lg Chemical Ltd | 黏合膜及使用彼之有機電子裝置之封裝方法 |
| EP2885363B1 (en) | 2012-08-14 | 2018-02-07 | 3M Innovative Properties Company | Adhesives comprising grafted isobutylene copolymer |
| US9269623B2 (en) | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
| US9007538B2 (en) | 2012-10-31 | 2015-04-14 | Industrial Technology Research Institute | Barrier functional film and manufacturing thereof, environmental sensitive electronic device, and display apparatus |
| JP6244088B2 (ja) * | 2012-11-29 | 2017-12-06 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび積層体 |
| JP5914397B2 (ja) | 2013-03-19 | 2016-05-11 | 富士フイルム株式会社 | 機能性フィルム |
| CN103436203B (zh) * | 2013-07-08 | 2015-06-03 | 北京京东方光电科技有限公司 | 封框胶及其制备方法和显示装置 |
| KR20150016879A (ko) | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
| JP6460344B2 (ja) | 2013-09-24 | 2019-01-30 | エルジー・ケム・リミテッド | 粘着性組成物 |
| US9315696B2 (en) * | 2013-10-31 | 2016-04-19 | Dow Global Technologies Llc | Ephemeral bonding |
| US20150166789A1 (en) * | 2013-12-18 | 2015-06-18 | Sabic Innovative Plastics Ip B.V. | Poly(phenylene ether) fiber, method of forming, and articles therefrom |
| KR20150097359A (ko) * | 2014-02-18 | 2015-08-26 | 주식회사 엘지화학 | 봉지 필름 및 이를 포함하는 유기전자장치 |
| WO2015199164A1 (ja) * | 2014-06-27 | 2015-12-30 | 富士フイルム株式会社 | 有機電子装置用封止部材 |
| CN104282728B (zh) * | 2014-10-10 | 2017-03-15 | 深圳市华星光电技术有限公司 | 一种白光oled显示器及其封装方法 |
| CN104479574B (zh) * | 2014-12-31 | 2017-03-08 | 广州鹿山新材料股份有限公司 | 一种增透的聚烯烃光伏组件封装胶膜及其制备方法 |
| JP6621805B2 (ja) * | 2015-03-25 | 2019-12-18 | リケンテクノス株式会社 | 熱可塑性樹脂組成物、接着性塗料、及びこれを用いた積層体 |
| JP6550275B2 (ja) * | 2015-06-15 | 2019-07-24 | 東京応化工業株式会社 | ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品 |
| EP3326201A4 (en) * | 2015-07-22 | 2019-03-20 | Intel Corporation | MULTILAYER PACKAGING |
| DE102015222027A1 (de) * | 2015-11-09 | 2017-05-11 | Tesa Se | Barriereklebemasse mit polymerem Gettermaterial |
| KR20180101599A (ko) * | 2016-02-01 | 2018-09-12 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 배리어 복합재 |
| KR102563022B1 (ko) * | 2016-04-04 | 2023-08-07 | 덕산네오룩스 주식회사 | 유기전기발광소자용 봉지 화합물, 조성물 및 이를 포함하는 봉지화된 장치 |
| US10121990B2 (en) * | 2016-04-28 | 2018-11-06 | Electronics And Telecommunications Research Institute | Organic light emitting devices and methods of fabricating the same |
| CN109478520B (zh) * | 2016-06-28 | 2023-04-21 | 日本瑞翁株式会社 | 半导体封装体制造用支承体、半导体封装体制造用支承体的使用及半导体封装体的制造方法 |
| CN105938873A (zh) | 2016-07-01 | 2016-09-14 | 武汉华星光电技术有限公司 | 一种柔性显示装置及其制造方法 |
| CN107658231B (zh) * | 2016-07-26 | 2019-08-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | 电子器件的干法封装方法及电子器件封装结构 |
| US11211513B2 (en) * | 2016-07-29 | 2021-12-28 | Trinamix Gmbh | Optical sensor and detector for an optical detection |
| WO2018035103A1 (en) | 2016-08-15 | 2018-02-22 | Klockner Pentaplast Of Ameriva, Inc. | Hot fill laminate |
| CN110536945B (zh) | 2017-04-21 | 2022-04-29 | 3M创新有限公司 | 阻隔性粘合剂组合物和制品 |
| KR102505265B1 (ko) | 2017-06-23 | 2023-03-06 | 삼성디스플레이 주식회사 | 전자 장치 |
| WO2019111182A1 (en) | 2017-12-06 | 2019-06-13 | 3M Innovative Properties Company | Barrier adhesive compositions and articles |
| US11349103B2 (en) * | 2018-03-15 | 2022-05-31 | Dell Products L.P. | Display assembly apparatus and methods for information handling systems |
| DE102018112817A1 (de) | 2018-05-29 | 2019-12-05 | Klöckner Pentaplast Gmbh | Transparente Polymerfolie mit Verfärbungskompensation |
| JP7388228B2 (ja) * | 2020-02-14 | 2023-11-29 | 住友ベークライト株式会社 | 光硬化性接着剤組成物、フィルム、および光学部品 |
| JP2021172812A (ja) * | 2020-04-21 | 2021-11-01 | Jsr株式会社 | 熱可塑性エラストマー組成物及び成形体 |
| WO2022045204A1 (ja) * | 2020-08-28 | 2022-03-03 | Rimtec株式会社 | 酸素バリア性シクロオレフィン系樹脂硬化物 |
| US11603432B2 (en) | 2020-11-18 | 2023-03-14 | Klöckner Pentaplast Of America, Inc. | Thermoformed packaging and methods of forming the same |
| WO2022221874A1 (en) | 2021-04-15 | 2022-10-20 | H.B. Fuller Company | Hot melt composition in the form of a film for use in thin film photovoltaic modules |
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| EP2177524A4 (en) * | 2007-08-16 | 2011-12-14 | Fujifilm Corp | HETEROCYCLIC COMPOUND, ULTRAVIOLET RADIATION ABSORBER, AND COMPOSITION COMPRISING THE ULTRAVIOLET RADIATION ABSORBER |
| US8846169B2 (en) * | 2007-12-28 | 2014-09-30 | 3M Innovative Properties Company | Flexible encapsulating film systems |
| ES2436022T3 (es) * | 2008-03-14 | 2013-12-26 | Otsuka Pharmaceutical Factory, Inc. | Ampolla de plástico |
-
2009
- 2009-04-23 CN CN200980125096.1A patent/CN102076803B/zh active Active
- 2009-04-23 US US12/995,571 patent/US20110073901A1/en not_active Abandoned
- 2009-04-23 WO PCT/US2009/041510 patent/WO2009148716A2/en not_active Ceased
- 2009-04-23 EP EP20090758879 patent/EP2291479B1/en not_active Not-in-force
- 2009-04-23 KR KR1020107029227A patent/KR20110020862A/ko not_active Ceased
- 2009-04-23 JP JP2011512492A patent/JP5270755B2/ja active Active
- 2009-05-06 TW TW98115017A patent/TW201005063A/zh unknown
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