JP2011526052A5 - - Google Patents

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Publication number
JP2011526052A5
JP2011526052A5 JP2011512492A JP2011512492A JP2011526052A5 JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5 JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011512492 A JP2011512492 A JP 2011512492A JP 2011526052 A5 JP2011526052 A5 JP 2011526052A5
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JP
Japan
Prior art keywords
encapsulating composition
adhesive encapsulating
weight
emitting unit
light
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JP2011512492A
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English (en)
Japanese (ja)
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JP2011526052A (ja
JP5270755B2 (ja
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Priority claimed from PCT/US2009/041510 external-priority patent/WO2009148716A2/en
Publication of JP2011526052A publication Critical patent/JP2011526052A/ja
Publication of JP2011526052A5 publication Critical patent/JP2011526052A5/ja
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Publication of JP5270755B2 publication Critical patent/JP5270755B2/ja
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JP2011512492A 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス Active JP5270755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5806708P 2008-06-02 2008-06-02
US61/058,067 2008-06-02
PCT/US2009/041510 WO2009148716A2 (en) 2008-06-02 2009-04-23 Adhesive encapsulating composition and electronic devices made therewith

Publications (3)

Publication Number Publication Date
JP2011526052A JP2011526052A (ja) 2011-09-29
JP2011526052A5 true JP2011526052A5 (enExample) 2012-06-14
JP5270755B2 JP5270755B2 (ja) 2013-08-21

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ID=41398750

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JP2011512492A Active JP5270755B2 (ja) 2008-06-02 2009-04-23 接着剤封入組成物及びそれで作られた電子デバイス

Country Status (7)

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US (1) US20110073901A1 (enExample)
EP (1) EP2291479B1 (enExample)
JP (1) JP5270755B2 (enExample)
KR (1) KR20110020862A (enExample)
CN (1) CN102076803B (enExample)
TW (1) TW201005063A (enExample)
WO (1) WO2009148716A2 (enExample)

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CN107658231B (zh) * 2016-07-26 2019-08-02 中国科学院苏州纳米技术与纳米仿生研究所 电子器件的干法封装方法及电子器件封装结构
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