JP2011523784A5 - - Google Patents

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Publication number
JP2011523784A5
JP2011523784A5 JP2011511049A JP2011511049A JP2011523784A5 JP 2011523784 A5 JP2011523784 A5 JP 2011523784A5 JP 2011511049 A JP2011511049 A JP 2011511049A JP 2011511049 A JP2011511049 A JP 2011511049A JP 2011523784 A5 JP2011523784 A5 JP 2011523784A5
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JP
Japan
Prior art keywords
plate
thin
silicon oxide
less
layer
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JP2011511049A
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English (en)
Japanese (ja)
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JP5661612B2 (ja
JP2011523784A (ja
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Priority claimed from FR0802833A external-priority patent/FR2931585B1/fr
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Publication of JP2011523784A publication Critical patent/JP2011523784A/ja
Publication of JP2011523784A5 publication Critical patent/JP2011523784A5/ja
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Publication of JP5661612B2 publication Critical patent/JP5661612B2/ja
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JP2011511049A 2008-05-26 2009-04-28 直接接合方法における窒素プラズマ表面処理 Active JP5661612B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0802833 2008-05-26
FR0802833A FR2931585B1 (fr) 2008-05-26 2008-05-26 Traitement de surface par plasma d'azote dans un procede de collage direct
PCT/FR2009/000502 WO2009153422A1 (fr) 2008-05-26 2009-04-28 Traitement de surface par plasma d'azote dans un procédé de collage direct

Publications (3)

Publication Number Publication Date
JP2011523784A JP2011523784A (ja) 2011-08-18
JP2011523784A5 true JP2011523784A5 (enExample) 2012-05-10
JP5661612B2 JP5661612B2 (ja) 2015-01-28

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ID=40085439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511049A Active JP5661612B2 (ja) 2008-05-26 2009-04-28 直接接合方法における窒素プラズマ表面処理

Country Status (8)

Country Link
US (1) US8318586B2 (enExample)
EP (1) EP2304787B1 (enExample)
JP (1) JP5661612B2 (enExample)
KR (1) KR101453135B1 (enExample)
CN (1) CN102047410B (enExample)
AT (1) ATE529891T1 (enExample)
FR (1) FR2931585B1 (enExample)
WO (1) WO2009153422A1 (enExample)

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FR2964112B1 (fr) * 2010-08-31 2013-07-19 Commissariat Energie Atomique Traitement avant collage d'une surface mixte cu-oxyde, par un plasma contenant de l'azote et de l'hydrogene
CN102222637A (zh) * 2011-06-23 2011-10-19 北京大学 一种绝缘体上锗衬底的制备方法
WO2013066977A1 (en) * 2011-10-31 2013-05-10 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
KR20130141985A (ko) * 2012-06-18 2013-12-27 삼성전자주식회사 2개 표면을 결합시키는 방법 및 그에 의하여 제조된 구조물
KR102023623B1 (ko) * 2012-07-03 2019-09-23 삼성전자 주식회사 반도체 소자 형성 방법
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
US9418963B2 (en) 2012-09-25 2016-08-16 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Methods for wafer bonding, and for nucleating bonding nanophases
KR102420245B1 (ko) 2013-09-25 2022-07-13 에베 그룹 에. 탈너 게엠베하 기판 본딩 장치 및 방법
KR102287811B1 (ko) * 2014-10-31 2021-08-09 삼성전자주식회사 2개 표면을 결합시키는 방법 및 그에 의하여 제조된 구조체, 및 상기 구조체를 포함하는 미세유동 장치
TWI741988B (zh) 2015-07-31 2021-10-11 日商新力股份有限公司 堆疊式透鏡結構及其製造方法，以及電子裝置
CN106409650B (zh) * 2015-08-03 2019-01-29 沈阳硅基科技有限公司 一种硅片直接键合方法
US9496239B1 (en) * 2015-12-11 2016-11-15 International Business Machines Corporation Nitride-enriched oxide-to-oxide 3D wafer bonding
US10026716B2 (en) * 2016-04-15 2018-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. 3DIC formation with dies bonded to formed RDLs
US9941241B2 (en) * 2016-06-30 2018-04-10 International Business Machines Corporation Method for wafer-wafer bonding
US9716088B1 (en) 2016-06-30 2017-07-25 International Business Machines Corporation 3D bonded semiconductor structure with an embedded capacitor
US9620479B1 (en) 2016-06-30 2017-04-11 International Business Machines Corporation 3D bonded semiconductor structure with an embedded resistor
US9773741B1 (en) 2016-08-17 2017-09-26 Qualcomm Incorporated Bondable device including a hydrophilic layer
US10269756B2 (en) 2017-04-21 2019-04-23 Invensas Bonding Technologies, Inc. Die processing
FR3074959B1 (fr) * 2017-12-08 2019-12-20 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de collage par adhesion directe
US10727219B2 (en) 2018-02-15 2020-07-28 Invensas Bonding Technologies, Inc. Techniques for processing devices
US10859981B1 (en) 2019-10-21 2020-12-08 Quantum Valley Ideas Laboratories Vapor cells having one or more optical windows bonded to a dielectric body
US11742314B2 (en) 2020-03-31 2023-08-29 Adeia Semiconductor Bonding Technologies Inc. Reliable hybrid bonded apparatus
US20240066624A1 (en) * 2021-01-21 2024-02-29 Tadatomo Suga Bonding method, bonder, and bonding system
JP2024512696A (ja) * 2021-03-31 2024-03-19 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド 直接接合方法及び構造体
US11300599B1 (en) 2021-04-13 2022-04-12 Quantum Valley Ideas Laboratories Vapor cells having an array of cavities therein
FR3131434B1 (fr) * 2021-12-29 2023-12-15 Commissariat Energie Atomique Procédé d’activation d’une couche exposée
US12191233B2 (en) 2022-07-28 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems and methods of manufacturing embedded cooling systems
TW202431566A (zh) 2022-12-23 2024-08-01 美商艾德亞半導體接合科技有限公司 用於先進裝置封裝的嵌入式冷卻系統
CN120457540A (zh) 2022-12-29 2025-08-08 美商艾德亚半导体接合科技有限公司 用于先进设备封装体的嵌入式冷却组件及其制造方法
US12199011B2 (en) 2022-12-31 2025-01-14 Adeia Semiconductor Bonding Technologies Inc. Embedded liquid cooling
CN116022731B (zh) * 2023-02-17 2023-07-07 西南应用磁学研究所(中国电子科技集团公司第九研究所) 一种基于wlp工艺的mems磁通门传感器的制作方法
TW202516697A (zh) 2023-03-31 2025-04-16 美商艾德亞半導體接合科技有限公司 包括背側電源/接地傳輸的整合式冷卻組件及其製造方法
US12191234B2 (en) 2023-05-17 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12191235B2 (en) 2023-05-17 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies including signal redistribution and methods of manufacturing the same
US12283490B1 (en) * 2023-12-21 2025-04-22 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US20250210585A1 (en) * 2023-12-22 2025-06-26 Adeia Semiconductor Bonding Technologies Inc. Direct bonding of semiconductor elements
US12368087B2 (en) 2023-12-26 2025-07-22 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems for advanced device packaging and methods of manufacturing the same
US12322677B1 (en) 2024-02-07 2025-06-03 Adeia Semiconductor Bonding Technologies Inc. Fluid channel geometry optimizations to improve cooling efficiency
US12336141B1 (en) 2024-03-29 2025-06-17 Adeia Semiconductor Bonding Technologies Inc. Cold plate cavity designs for improved thermal performance
US12176264B1 (en) 2024-03-29 2024-12-24 Adeia Semiconductor Bonding Technologies Inc. Manifold designs for embedded liquid cooling in a package
US12266545B1 (en) 2024-05-24 2025-04-01 Adeia Semiconductor Bonding Technologies Inc. Structures and methods for integrated cold plate in XPUs and memory
US12412808B1 (en) 2024-12-20 2025-09-09 Adeia Semiconductor Bonding Technologies Inc. Cold plate and manifold integration for high reliability

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US5503704A (en) * 1993-01-06 1996-04-02 The Regents Of The University Of California Nitrogen based low temperature direct bonding
JP3294934B2 (ja) * 1994-03-11 2002-06-24 キヤノン株式会社 半導体基板の作製方法及び半導体基板
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
EP1386349A1 (en) * 2001-04-17 2004-02-04 California Institute Of Technology A method of using a germanium layer transfer to si for photovoltaic applications and heterostructure made thereby
US6780788B2 (en) * 2002-08-07 2004-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for improving within-wafer uniformity of gate oxide
JP3980539B2 (ja) * 2003-08-29 2007-09-26 唯知 須賀 基板接合方法、照射方法、および基板接合装置
EP1662549B1 (en) * 2003-09-01 2015-07-29 SUMCO Corporation Method for manufacturing bonded wafer
FR2867310B1 (fr) * 2004-03-05 2006-05-26 Soitec Silicon On Insulator Technique d'amelioration de la qualite d'une couche mince prelevee
US7361572B2 (en) * 2005-02-17 2008-04-22 Taiwan Semiconductor Manufacturing Co., Ltd. STI liner modification method
FR2888663B1 (fr) * 2005-07-13 2008-04-18 Soitec Silicon On Insulator Procede de diminution de la rugosite d'une couche epaisse d'isolant
FR2910177B1 (fr) * 2006-12-18 2009-04-03 Soitec Silicon On Insulator Couche tres fine enterree
JP2009135430A (ja) * 2007-10-10 2009-06-18 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法

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