JP2011521797A5 - - Google Patents
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- JP2011521797A5 JP2011521797A5 JP2011511659A JP2011511659A JP2011521797A5 JP 2011521797 A5 JP2011521797 A5 JP 2011521797A5 JP 2011511659 A JP2011511659 A JP 2011511659A JP 2011511659 A JP2011511659 A JP 2011511659A JP 2011521797 A5 JP2011521797 A5 JP 2011521797A5
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- movable element
- rotating shaft
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- 230000003068 static effect Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/129,548 US8096182B2 (en) | 2008-05-29 | 2008-05-29 | Capacitive sensor with stress relief that compensates for package stress |
| US12/129,548 | 2008-05-29 | ||
| PCT/US2009/036755 WO2009145963A1 (en) | 2008-05-29 | 2009-03-11 | Capacitive sensor with stress relief that compensates for package stress |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011521797A JP2011521797A (ja) | 2011-07-28 |
| JP2011521797A5 true JP2011521797A5 (enExample) | 2012-04-26 |
| JP5474946B2 JP5474946B2 (ja) | 2014-04-16 |
Family
ID=41377460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011511659A Expired - Fee Related JP5474946B2 (ja) | 2008-05-29 | 2009-03-11 | パッケージ応力を補償する応力逃がしを有する容量性センサ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8096182B2 (enExample) |
| JP (1) | JP5474946B2 (enExample) |
| CN (1) | CN102046514B (enExample) |
| WO (1) | WO2009145963A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009026462B4 (de) * | 2009-05-26 | 2023-03-30 | Robert Bosch Gmbh | Beschleunigungssensor |
| JP2011022137A (ja) * | 2009-06-15 | 2011-02-03 | Rohm Co Ltd | Mems装置及びその製造方法 |
| JP5287690B2 (ja) * | 2009-12-11 | 2013-09-11 | 株式会社豊田中央研究所 | 光偏向装置 |
| EP2508874B1 (en) * | 2011-04-08 | 2019-06-05 | ams international AG | Capacitive sensor, integrated circuit, electronic device and method |
| DE102011076551B4 (de) * | 2011-05-26 | 2024-02-22 | Robert Bosch Gmbh | Inertialsensor |
| US9069005B2 (en) * | 2011-06-17 | 2015-06-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Capacitance detector for accelerometer and gyroscope and accelerometer and gyroscope with capacitance detector |
| TWI437231B (zh) * | 2011-08-22 | 2014-05-11 | Richwave Technology Corp | 可補償電容偏移的微機電電路及其方法 |
| US9164117B2 (en) | 2012-10-19 | 2015-10-20 | Honeywell International Inc. | Stress reduction components for sensors |
| JP6075062B2 (ja) * | 2012-12-27 | 2017-02-08 | セイコーエプソン株式会社 | アクチュエーター、光スキャナーおよび画像形成装置 |
| US9470709B2 (en) | 2013-01-28 | 2016-10-18 | Analog Devices, Inc. | Teeter totter accelerometer with unbalanced mass |
| US9297825B2 (en) | 2013-03-05 | 2016-03-29 | Analog Devices, Inc. | Tilt mode accelerometer with improved offset and noise performance |
| FR3003030B1 (fr) * | 2013-03-11 | 2015-04-17 | Commissariat Energie Atomique | Dispositif de detection de contrainte mecanique a capteur capacitif, ensemble de dispositifs de detection et dispositif de localisation de toucher a capteurs capacitifs |
| US9383384B2 (en) * | 2013-05-31 | 2016-07-05 | Honeywell International Inc. | Extended-range closed-loop accelerometer |
| US9235937B1 (en) | 2013-06-05 | 2016-01-12 | Analog Devices, Inc. | Mounting method for satellite crash sensors |
| JP6655281B2 (ja) * | 2014-08-19 | 2020-02-26 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
| CN105699693B (zh) * | 2014-12-11 | 2019-04-12 | 意法半导体股份有限公司 | 具有减少漂移功能的z轴微机电检测结构 |
| US10073113B2 (en) | 2014-12-22 | 2018-09-11 | Analog Devices, Inc. | Silicon-based MEMS devices including wells embedded with high density metal |
| US10473686B2 (en) * | 2014-12-25 | 2019-11-12 | Goertek Inc. | Inertia measurement module and triaxial accelerometer |
| US10078098B2 (en) | 2015-06-23 | 2018-09-18 | Analog Devices, Inc. | Z axis accelerometer design with offset compensation |
| US9663348B1 (en) | 2015-11-09 | 2017-05-30 | Nxp Usa, Inc. | MEMS device with isolation sub-frame structure |
| US10203352B2 (en) * | 2016-08-04 | 2019-02-12 | Analog Devices, Inc. | Anchor tracking apparatus for in-plane accelerometers and related methods |
| CN110501522B (zh) * | 2019-09-16 | 2022-10-11 | 上海矽睿科技股份有限公司 | 一种微机电系统的电容式加速度计 |
| DE102020210135A1 (de) | 2020-08-11 | 2022-02-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikroelektromechanisches System, Verfahren zur Herstellung eines mikroelektromechanischen Systems |
| US12055927B2 (en) * | 2021-02-26 | 2024-08-06 | Honeywell International Inc. | Thermal metamaterial for low power MEMS thermal control |
| CN115219077B (zh) * | 2022-07-13 | 2025-06-06 | 北京航空航天大学 | 一种柔性电容式压力传感器及其制备方法 |
| CN119197296B (zh) * | 2024-11-27 | 2025-04-08 | 中国船舶集团有限公司第七〇七研究所 | 一种温度冲击下的mems应变测量装置 |
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| US4736629A (en) * | 1985-12-20 | 1988-04-12 | Silicon Designs, Inc. | Micro-miniature accelerometer |
| EP0547742B1 (en) * | 1991-12-19 | 1995-12-13 | Motorola, Inc. | Triaxial accelerometer |
| ATE269588T1 (de) * | 1993-02-04 | 2004-07-15 | Cornell Res Foundation Inc | Mikrostrukturen und einzelmask, einkristall- herstellungsverfahren |
| US5563343A (en) * | 1993-05-26 | 1996-10-08 | Cornell Research Foundation, Inc. | Microelectromechanical lateral accelerometer |
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| JP3305516B2 (ja) * | 1994-10-31 | 2002-07-22 | 株式会社東海理化電機製作所 | 静電容量式加速度センサ及びその製造方法 |
| JPH09119943A (ja) * | 1995-10-24 | 1997-05-06 | Wako:Kk | 加速度センサ |
| US5806365A (en) * | 1996-04-30 | 1998-09-15 | Motorola, Inc. | Acceleration sensing device on a support substrate and method of operation |
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| JP4176849B2 (ja) * | 1997-05-08 | 2008-11-05 | 株式会社ワコー | センサの製造方法 |
| US6009757A (en) * | 1997-07-28 | 2000-01-04 | Texas Instruments Incorporated | Voltage regulated pressure transducer apparatus |
| DE69942486D1 (de) * | 1998-01-15 | 2010-07-22 | Cornell Res Foundation Inc | Grabenisolation für mikromechanische bauelemente |
| US6105428A (en) * | 1998-12-10 | 2000-08-22 | Motorola, Inc. | Sensor and method of use |
| DE20122373U1 (de) * | 2000-08-03 | 2005-05-19 | Reflectivity Inc., Sunnyvale | Projektionssystem zum Projizieren eines Farbbildes |
| US6792804B2 (en) * | 2001-10-19 | 2004-09-21 | Kionix, Inc. | Sensor for measuring out-of-plane acceleration |
| US6701786B2 (en) * | 2002-04-29 | 2004-03-09 | L-3 Communications Corporation | Closed loop analog gyro rate sensor |
| US7005193B2 (en) | 2003-04-29 | 2006-02-28 | Motorola, Inc. | Method of adding mass to MEMS structures |
| US6845670B1 (en) * | 2003-07-08 | 2005-01-25 | Freescale Semiconductor, Inc. | Single proof mass, 3 axis MEMS transducer |
| US20050092085A1 (en) * | 2003-11-04 | 2005-05-05 | Shyu-Mou Chen | Solid-state gyroscopes and planar three-axis inertial measurement unit |
| KR100513345B1 (ko) * | 2003-12-20 | 2005-09-07 | 삼성전기주식회사 | 정전용량형 z축 가속도계 |
| JP4446038B2 (ja) * | 2004-05-11 | 2010-04-07 | 国立大学法人東北大学 | トーションバーを用いた静電駆動型マイクロミラーデバイス |
| US7057794B2 (en) * | 2004-05-19 | 2006-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micromirror for MEMS device |
| US20080276706A1 (en) * | 2004-09-27 | 2008-11-13 | Conti Temic Microelectronic Gmbh | Rotation Speed Sensor |
| CN1605871A (zh) * | 2004-10-18 | 2005-04-13 | 北京大学 | 梳齿电容式z轴加速度计及其制备方法 |
| US7337671B2 (en) * | 2005-06-03 | 2008-03-04 | Georgia Tech Research Corp. | Capacitive microaccelerometers and fabrication methods |
| JP2006340531A (ja) * | 2005-06-03 | 2006-12-14 | Matsushita Electric Works Ltd | アクチュエータ |
| US7430909B2 (en) | 2005-11-22 | 2008-10-07 | Kionix, Inc. | Tri-axis accelerometer |
| US8129801B2 (en) | 2006-01-06 | 2012-03-06 | Honeywell International Inc. | Discrete stress isolator attachment structures for MEMS sensor packages |
| JP2008003309A (ja) * | 2006-06-22 | 2008-01-10 | Fujifilm Corp | 微小電気機械素子及び微小電気機械素子アレイ並びに変調装置 |
| US7637160B2 (en) * | 2006-06-30 | 2009-12-29 | Freescale Semiconductor, Inc. | MEMS suspension and anchoring design |
| US7628072B2 (en) * | 2006-07-19 | 2009-12-08 | Freescale Semiconductor, Inc. | MEMS device and method of reducing stiction in a MEMS device |
| US7767483B1 (en) * | 2006-07-25 | 2010-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dual-suspension system for MEMS-based devices and method for fabricating same |
| US7487661B2 (en) * | 2006-10-11 | 2009-02-10 | Freescale Semiconductor, Inc. | Sensor having free fall self-test capability and method therefor |
| US7851876B2 (en) * | 2006-10-20 | 2010-12-14 | Hewlett-Packard Development Company, L.P. | Micro electro mechanical system |
| US7640805B2 (en) * | 2006-12-18 | 2010-01-05 | Akustica, Inc. | Proof-mass with supporting structure on integrated circuit-MEMS platform |
| US7784344B2 (en) * | 2007-11-29 | 2010-08-31 | Honeywell International Inc. | Integrated MEMS 3D multi-sensor |
| US7793542B2 (en) * | 2007-12-28 | 2010-09-14 | Freescale Semiconductor, Inc. | Caddie-corner single proof mass XYZ MEMS transducer |
| US7863698B2 (en) * | 2009-04-03 | 2011-01-04 | Invensense, Inc. | Performance-enhancing two-sided MEMS anchor design for vertically integrated micromachined devices |
-
2008
- 2008-05-29 US US12/129,548 patent/US8096182B2/en not_active Expired - Fee Related
-
2009
- 2009-03-11 CN CN2009801198182A patent/CN102046514B/zh not_active Expired - Fee Related
- 2009-03-11 JP JP2011511659A patent/JP5474946B2/ja not_active Expired - Fee Related
- 2009-03-11 WO PCT/US2009/036755 patent/WO2009145963A1/en not_active Ceased
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