CN102046514B - 具有微型机电系统传感器的设备及其制造方法 - Google Patents

具有微型机电系统传感器的设备及其制造方法 Download PDF

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Publication number
CN102046514B
CN102046514B CN2009801198182A CN200980119818A CN102046514B CN 102046514 B CN102046514 B CN 102046514B CN 2009801198182 A CN2009801198182 A CN 2009801198182A CN 200980119818 A CN200980119818 A CN 200980119818A CN 102046514 B CN102046514 B CN 102046514B
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China
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moving element
section
rotating shaft
length
electrode member
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Expired - Fee Related
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CN2009801198182A
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Chinese (zh)
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CN102046514A (zh
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林毅桢
A·C·迈克奈尔
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NXP USA Inc
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Freescale Semiconductor Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
CN2009801198182A 2008-05-29 2009-03-11 具有微型机电系统传感器的设备及其制造方法 Expired - Fee Related CN102046514B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/129,548 US8096182B2 (en) 2008-05-29 2008-05-29 Capacitive sensor with stress relief that compensates for package stress
US12/129,548 2008-05-29
PCT/US2009/036755 WO2009145963A1 (en) 2008-05-29 2009-03-11 Capacitive sensor with stress relief that compensates for package stress

Publications (2)

Publication Number Publication Date
CN102046514A CN102046514A (zh) 2011-05-04
CN102046514B true CN102046514B (zh) 2013-03-27

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CN2009801198182A Expired - Fee Related CN102046514B (zh) 2008-05-29 2009-03-11 具有微型机电系统传感器的设备及其制造方法

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Country Link
US (1) US8096182B2 (enExample)
JP (1) JP5474946B2 (enExample)
CN (1) CN102046514B (enExample)
WO (1) WO2009145963A1 (enExample)

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JP6075062B2 (ja) * 2012-12-27 2017-02-08 セイコーエプソン株式会社 アクチュエーター、光スキャナーおよび画像形成装置
US9470709B2 (en) 2013-01-28 2016-10-18 Analog Devices, Inc. Teeter totter accelerometer with unbalanced mass
US9297825B2 (en) 2013-03-05 2016-03-29 Analog Devices, Inc. Tilt mode accelerometer with improved offset and noise performance
FR3003030B1 (fr) * 2013-03-11 2015-04-17 Commissariat Energie Atomique Dispositif de detection de contrainte mecanique a capteur capacitif, ensemble de dispositifs de detection et dispositif de localisation de toucher a capteurs capacitifs
US9383384B2 (en) * 2013-05-31 2016-07-05 Honeywell International Inc. Extended-range closed-loop accelerometer
US9235937B1 (en) 2013-06-05 2016-01-12 Analog Devices, Inc. Mounting method for satellite crash sensors
JP6655281B2 (ja) * 2014-08-19 2020-02-26 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
CN105699693B (zh) * 2014-12-11 2019-04-12 意法半导体股份有限公司 具有减少漂移功能的z轴微机电检测结构
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JP6303074B2 (ja) * 2014-12-25 2018-03-28 ゴルテック．インク 慣性計測モジュール及び３軸加速度計
US10078098B2 (en) 2015-06-23 2018-09-18 Analog Devices, Inc. Z axis accelerometer design with offset compensation
US9663348B1 (en) 2015-11-09 2017-05-30 Nxp Usa, Inc. MEMS device with isolation sub-frame structure
US10203352B2 (en) * 2016-08-04 2019-02-12 Analog Devices, Inc. Anchor tracking apparatus for in-plane accelerometers and related methods
CN110501522B (zh) * 2019-09-16 2022-10-11 上海矽睿科技股份有限公司 一种微机电系统的电容式加速度计
DE102020210135A1 (de) 2020-08-11 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung Mikroelektromechanisches System, Verfahren zur Herstellung eines mikroelektromechanischen Systems
US12055927B2 (en) * 2021-02-26 2024-08-06 Honeywell International Inc. Thermal metamaterial for low power MEMS thermal control
CN115219077B (zh) * 2022-07-13 2025-06-06 北京航空航天大学 一种柔性电容式压力传感器及其制备方法
CN119197296B (zh) * 2024-11-27 2025-04-08 中国船舶集团有限公司第七〇七研究所 一种温度冲击下的mems应变测量装置

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Also Published As

Publication number Publication date
US20090293616A1 (en) 2009-12-03
US8096182B2 (en) 2012-01-17
WO2009145963A1 (en) 2009-12-03
JP2011521797A (ja) 2011-07-28
CN102046514A (zh) 2011-05-04
JP5474946B2 (ja) 2014-04-16

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