JP2011519041A - 圧力センサ - Google Patents

圧力センサ Download PDF

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Publication number
JP2011519041A
JP2011519041A JP2011506652A JP2011506652A JP2011519041A JP 2011519041 A JP2011519041 A JP 2011519041A JP 2011506652 A JP2011506652 A JP 2011506652A JP 2011506652 A JP2011506652 A JP 2011506652A JP 2011519041 A JP2011519041 A JP 2011519041A
Authority
JP
Japan
Prior art keywords
pressure sensor
substrate
cavity
sensor according
signal converter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011506652A
Other languages
English (en)
Japanese (ja)
Inventor
ウォルゲムス、クリスチアン
ティエレ、ペーター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of JP2011519041A publication Critical patent/JP2011519041A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0046—Fluidic connecting means using isolation membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
JP2011506652A 2008-04-28 2009-04-20 圧力センサ Pending JP2011519041A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008021091.9 2008-04-28
DE102008021091A DE102008021091A1 (de) 2008-04-28 2008-04-28 Drucksensor
PCT/EP2009/054656 WO2009132981A1 (de) 2008-04-28 2009-04-20 Drucksensor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014085224A Division JP5739039B2 (ja) 2008-04-28 2014-04-17 圧力センサ

Publications (1)

Publication Number Publication Date
JP2011519041A true JP2011519041A (ja) 2011-06-30

Family

ID=40846118

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011506652A Pending JP2011519041A (ja) 2008-04-28 2009-04-20 圧力センサ
JP2014085224A Active JP5739039B2 (ja) 2008-04-28 2014-04-17 圧力センサ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014085224A Active JP5739039B2 (ja) 2008-04-28 2014-04-17 圧力センサ

Country Status (5)

Country Link
US (1) US8234926B2 (de)
EP (1) EP2269020B1 (de)
JP (2) JP2011519041A (de)
DE (1) DE102008021091A1 (de)
WO (1) WO2009132981A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8569851B2 (en) * 2010-06-18 2013-10-29 General Electric Company Sensor and method for fabricating the same
DE102014200082A1 (de) * 2014-01-08 2015-07-09 Robert Bosch Gmbh Drucksensor zur Erfassung eines Drucks eines fluiden Mediums
US9648745B2 (en) 2014-10-22 2017-05-09 Honeywell International Inc. Systems and methods for mounting the printed wiring assembly to the header assembly of a pressure sensor
DE102016200263A1 (de) * 2016-01-13 2017-07-13 Robert Bosch Gmbh Mikromechanischer Drucksensor
US10163660B2 (en) 2017-05-08 2018-12-25 Tt Electronics Plc Sensor device with media channel between substrates
US10285275B2 (en) 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel
DE102017122607A1 (de) * 2017-09-28 2019-03-28 Tdk Electronics Ag Mediengetrennter Drucktransmitter
US11015994B2 (en) 2018-08-22 2021-05-25 Rosemount Aerospace Inc. Differential MEMS pressure sensors with a ceramic header body and methods of making differential MEMS pressure sensors
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
DE102019123701B4 (de) * 2019-09-04 2022-08-11 Technische Universität Ilmenau Vorrichtung und Verfahren zur Erfassung und Modifikation von Normal- und/oder Scherkräften, sowie deren Verwendung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08334426A (ja) * 1995-06-07 1996-12-17 Yamatake Honeywell Co Ltd 圧力センサ
JPH11173938A (ja) * 1997-12-11 1999-07-02 Tokin Corp 圧力センサ
JP2000329632A (ja) * 1999-05-17 2000-11-30 Toshiba Chem Corp 圧力センサーモジュール及び圧力センサーモジュールの製造方法
JP2005257498A (ja) * 2004-03-12 2005-09-22 Denso Corp 圧力センサ
JP2005337970A (ja) * 2004-05-28 2005-12-08 Toyoda Mach Works Ltd 半導体圧力センサ
JP2006090846A (ja) * 2004-09-24 2006-04-06 Denso Corp 圧力センサ
JP2006177919A (ja) * 2004-11-26 2006-07-06 Kyocera Corp 圧力センサ
JP2006220430A (ja) * 2005-02-08 2006-08-24 Jtekt Corp 圧力センサ及びその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559488A (en) 1969-08-20 1971-02-02 Honeywell Inc Differential pressure measuring apparatus
US4072058A (en) 1976-05-03 1978-02-07 Honeywell Inc. Differential pressure transmitter with pressure sensor protection
US4218925A (en) 1979-06-27 1980-08-26 Honeywell Inc. Differential pressure transmitter with pressure sensor protection
US4543832A (en) 1983-09-30 1985-10-01 Transducers, Inc. Overload protected pressure transducer
US5119066A (en) * 1988-06-06 1992-06-02 Jan Ballyns Pressure sensor system
JPH073311Y2 (ja) * 1988-10-27 1995-01-30 横河電機株式会社 半導体差圧測定装置
US5071661A (en) * 1990-09-12 1991-12-10 Miles J. Willard Process for dehydrating potato products
US5153710A (en) * 1991-07-26 1992-10-06 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with laminated backup cell
CH687940A5 (de) * 1993-04-20 1997-03-27 Landis & Gyr Tech Innovat Kapsel fuer einen Drucksensor und Verfahren zur Einkapselung des Drucksensors.
JP3198779B2 (ja) * 1994-03-04 2001-08-13 株式会社デンソー 半導体圧力検出器の製造方法
JPH10104101A (ja) * 1996-10-02 1998-04-24 Mitsubishi Electric Corp 半導体圧力センサ
DE19709977A1 (de) * 1997-03-11 1998-09-24 Siemens Ag Halbleiterschaltungsvorrichtung und Halbleitersensorvorrichtung
US6311561B1 (en) * 1997-12-22 2001-11-06 Rosemount Aerospace Inc. Media compatible pressure sensor
US7152478B2 (en) * 2000-07-20 2006-12-26 Entegris, Inc. Sensor usable in ultra pure and highly corrosive environments
JP2003315193A (ja) * 2002-04-24 2003-11-06 Denso Corp 圧力センサ
JP3824964B2 (ja) * 2002-05-17 2006-09-20 長野計器株式会社 絶対圧型圧力センサ
US6877380B2 (en) * 2002-10-01 2005-04-12 Honeywell International Inc. Diaphragm for bonded element sensor
JP2005037310A (ja) * 2003-07-18 2005-02-10 Fuji Koki Corp 圧力センサ
JP4315833B2 (ja) * 2004-02-18 2009-08-19 三洋電機株式会社 回路装置
JP2007033047A (ja) * 2005-07-22 2007-02-08 Mitsubishi Electric Corp 半導体圧力センサ
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005054177B4 (de) * 2005-11-14 2011-12-22 Infineon Technologies Ag Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen
EP1795496A2 (de) * 2005-12-08 2007-06-13 Yamaha Corporation Halbleitervorrichtung zur Erfassung von Druckfluktuationen
US7282786B2 (en) * 2006-01-17 2007-10-16 Advanced Semiconductor Engineering Inc. Semiconductor package and process for making the same
US7781852B1 (en) * 2006-12-05 2010-08-24 Amkor Technology, Inc. Membrane die attach circuit element package and method therefor
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
US7731433B1 (en) * 2008-12-05 2010-06-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08334426A (ja) * 1995-06-07 1996-12-17 Yamatake Honeywell Co Ltd 圧力センサ
JPH11173938A (ja) * 1997-12-11 1999-07-02 Tokin Corp 圧力センサ
JP2000329632A (ja) * 1999-05-17 2000-11-30 Toshiba Chem Corp 圧力センサーモジュール及び圧力センサーモジュールの製造方法
JP2005257498A (ja) * 2004-03-12 2005-09-22 Denso Corp 圧力センサ
JP2005337970A (ja) * 2004-05-28 2005-12-08 Toyoda Mach Works Ltd 半導体圧力センサ
JP2006090846A (ja) * 2004-09-24 2006-04-06 Denso Corp 圧力センサ
JP2006177919A (ja) * 2004-11-26 2006-07-06 Kyocera Corp 圧力センサ
JP2006220430A (ja) * 2005-02-08 2006-08-24 Jtekt Corp 圧力センサ及びその製造方法

Also Published As

Publication number Publication date
JP2014160084A (ja) 2014-09-04
JP5739039B2 (ja) 2015-06-24
WO2009132981A1 (de) 2009-11-05
US8234926B2 (en) 2012-08-07
US20110083513A1 (en) 2011-04-14
DE102008021091A1 (de) 2009-10-29
EP2269020A1 (de) 2011-01-05
EP2269020B1 (de) 2017-03-01

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