JP2011508685A5 - - Google Patents

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Publication number
JP2011508685A5
JP2011508685A5 JP2010539287A JP2010539287A JP2011508685A5 JP 2011508685 A5 JP2011508685 A5 JP 2011508685A5 JP 2010539287 A JP2010539287 A JP 2010539287A JP 2010539287 A JP2010539287 A JP 2010539287A JP 2011508685 A5 JP2011508685 A5 JP 2011508685A5
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JP
Japan
Prior art keywords
metal foil
polyimide
polyimide layer
foil laminate
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010539287A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011508685A (ja
JP5425093B2 (ja
Filing date
Publication date
Priority claimed from KR1020070133902A external-priority patent/KR101467179B1/ko
Application filed filed Critical
Publication of JP2011508685A publication Critical patent/JP2011508685A/ja
Publication of JP2011508685A5 publication Critical patent/JP2011508685A5/ja
Application granted granted Critical
Publication of JP5425093B2 publication Critical patent/JP5425093B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010539287A 2007-12-20 2008-12-08 金属箔積層体 Expired - Fee Related JP5425093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070133902A KR101467179B1 (ko) 2007-12-20 2007-12-20 금속박적층체
KR10-2007-0133902 2007-12-20
PCT/KR2008/007242 WO2009082101A2 (en) 2007-12-20 2008-12-08 Metal-clad laminate

Publications (3)

Publication Number Publication Date
JP2011508685A JP2011508685A (ja) 2011-03-17
JP2011508685A5 true JP2011508685A5 (enExample) 2011-12-22
JP5425093B2 JP5425093B2 (ja) 2014-02-26

Family

ID=40801656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010539287A Expired - Fee Related JP5425093B2 (ja) 2007-12-20 2008-12-08 金属箔積層体

Country Status (6)

Country Link
US (1) US8318315B2 (enExample)
JP (1) JP5425093B2 (enExample)
KR (1) KR101467179B1 (enExample)
CN (1) CN101903169B (enExample)
TW (1) TWI474921B (enExample)
WO (1) WO2009082101A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010119908A1 (ja) * 2009-04-14 2010-10-21 宇部興産株式会社 メタライジング用のポリイミドフィルム、これらの製造方法、及び金属積層ポリイミドフィルム
KR101437612B1 (ko) * 2010-12-20 2014-09-15 에스케이이노베이션 주식회사 후막 폴리이미드 연성금속적층판의 제조방법
KR101514221B1 (ko) * 2011-12-07 2015-04-23 에스케이이노베이션 주식회사 다층 폴리이미드 구조의 연성금속적층판 제조방법
WO2013100627A1 (ko) * 2011-12-28 2013-07-04 에스케이이노베이션 주식회사 연성금속박적층체 및 이의 제조방법
CN104066574B (zh) * 2011-12-28 2016-08-24 Sk新技术株式会社 柔性金属箔层叠体及其制造方法
KR102038137B1 (ko) * 2012-12-21 2019-10-30 주식회사 넥스플렉스 다층 연성금속박 적층체 및 이의 제조방법
DE102016012554B4 (de) * 2016-10-20 2021-09-23 Martin Huber Patent UG (haftungsbeschränkt) Wärmemotor mit mehreren Doppelschichtbauteilen
JP6891564B2 (ja) * 2017-03-16 2021-06-18 コニカミノルタ株式会社 透明耐熱性積層フィルム、透明フレキシブルプリント基板、透明電極基板、照明装置及び有機エレクトロルミネッセンス表示装置
CN109517171B (zh) * 2017-09-19 2021-06-01 臻鼎科技股份有限公司 低介电聚酰亚胺用树脂组合物、聚酰亚胺、聚酰亚胺膜及覆铜板
TWI665260B (zh) * 2017-09-19 2019-07-11 臻鼎科技股份有限公司 低介電聚醯亞胺組合物、聚醯亞胺、聚醯亞胺膜及覆銅板
JP7375318B2 (ja) * 2018-05-16 2023-11-08 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス
US20210214501A1 (en) 2019-02-01 2021-07-15 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847353A (en) * 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
US20070169886A1 (en) * 2004-03-04 2007-07-26 Toray Industries, Inc. Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device
JP4544588B2 (ja) * 2005-03-14 2010-09-15 株式会社エー・エム・ティー・研究所 積層体
JP2007118477A (ja) * 2005-10-31 2007-05-17 Toray Ind Inc 両面金属箔積層板およびその製造方法
US8221842B2 (en) * 2006-03-06 2012-07-17 Lg Chem, Ltd. Metallic laminate and method for preparing the same

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