TW201132493A - Copper or copper alloy foil, and method for manufacturing double-sided copper-clad laminate using the same - Google Patents

Copper or copper alloy foil, and method for manufacturing double-sided copper-clad laminate using the same Download PDF

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TW201132493A
TW201132493A TW099136882A TW99136882A TW201132493A TW 201132493 A TW201132493 A TW 201132493A TW 099136882 A TW099136882 A TW 099136882A TW 99136882 A TW99136882 A TW 99136882A TW 201132493 A TW201132493 A TW 201132493A
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Taiwan
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copper
foil
copper alloy
alloy foil
sided
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TW099136882A
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Chinese (zh)
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TWI426995B (en
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Toshiyuki Ono
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Jx Nippon Mining & Metals Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

To provide a copper or copper alloy foil which can reduce wrinkles or creases occurring when used for a double-sided copper-clad laminate, and to provide a method for manufacturing a double-sided copper-clad laminate using the same. The copper or copper alloy foils 4 and 6 are used for the double-sided copper-clad laminate 8, satisfy 3/4 10,000*(E<SB>A</SB>*/2) 3/4 ≤YS<SB>A</SB>when [sigma]<SB>A</SB>is (E<SB>A</SB>*[Delta]L<SB>B</SB>)/2*1,000, and have the number of bending times of 400,000 or more, wherein E<SB>A</SB>is Young's modulus (of which the unit is GPa) in a width direction after the copper or copper alloy foil has been held at 350[deg.]C for 30 min and cooled to room temperature; [Delta]L<SB>A</SB>is a dimensional change rate (of which the unit is ppm, and in which shrinkage is defined as positive value) in the width direction of the copper or copper alloy foil which has been heated to 350[deg.]C from room temperature, held at the temperature for 30 min and cooled to room temperature; YS<SB>A</SB>is 0.2% yield strength (of which the unit is MPa) of the copper or copper alloy foil in a tensile test; and the number of bending times is a value measured at an end point at which the electric resistance has increased from the initial stage by 20%, with the use of an IPC sliding bending tester.

Description

201132493 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種適用於例如用於可撓性配線板 (FPC ’ Flexible Printed Circuit)之於樹脂層之兩面積層銅 或銅合金箔而成之兩面覆銅積層板的銅或銅合金落、及使 用該銅或銅合金箱之兩面覆銅積層板之製造方法。 【先前技術】 可撓性配線板(FPC )中所使用之覆銅積層板(CCl ), 可使用於樹脂層之單面積層銅箔而成之單面覆鋼積層板、 及於樹脂層之兩面積層銅箔而成之兩面覆銅積層板(以下 稱為「兩面CCL」)。於兩面CCL上形成電路者為兩面可 撓性配線板’其容易實現電路之精細化、FPC之省空間化, 因此兩面CCL之使用有增加的傾向。 此種兩面CCL之製造方法,已知有於銅箔之單面淹鎮 樹脂組成物之清漆並進行加熱硬化後,於樹脂面熱壓接其 他銅箔之方法(專利文獻1)。又,有如下等方法:於兩面 具有熱塑性聚醯亞胺層之聚醯亞胺膜之表面與背面,同時 熱壓接銅箔;於具有熱塑性聚醢亞胺層之聚醯亞胺膜之單 面熱壓接銅箔之後’於與銅箔相反側之聚醯亞胺膜面塗佈 熱塑性聚醯亞胺層,並於該面熱壓接其他銅箔;於銅羯之 單面澆鑄聚醯亞胺之前驅物即清漆,並進行硬化後,於與 銅箔相反側之樹脂表面形成熱塑性聚醯亞胺層,並且於該 面熱壓接其他銅箔。 專利文獻1 :曰本特開平05 — 212824號公報 201132493 【發明内容】 _ t*處若除去於樹脂層(上述聚醯亞胺膜等)之兩面 同時層疊铜箔之情形,則會將最初與樹脂層積層之銅箔(第 1銅洛)於最初積層時加熱至憲c以上之溫度,並暫時冷 部μ進而,於之後在樹脂層之相反面積層其他銅箔(第2 銅泊)時’亦同樣對第i銅箱進行再加熱並予以冷卻。 然而,當積層第2銅箱並進行加熱後將其冷卻時有 夺”第1銅伯之長度方向平行地且通常於寬度方向中央位 =產生皺槽或折痕。即便調整第2銅羯之 時:加熱條件(熱壓接條件、張力等),亦難以完全消: 該皴摺或折痕。並且,認為上述敵摺或折痕係於如下情开; =生:由於施加於第⑽及第2銅羯之積層時之受熱 : = 故因積層第2銅羯並進行加熱後將其冷卻時之 ’皿又@導致夾持樹脂層而存在之兩銅箔之尺寸變化率 不同,銅箔無法承受由此所產生之應力。 供一種發明係為解決上述課題而完成者,目的在於提 二:用於兩面覆銅積層板時可抑制皺 銅合金箔、及估田#〜丄 J ^ 造方法。 銅或銅合金落之兩自覆銅積層板之製 ^ 發明人等進行各種研究之結果發現: 時,即便因施加於第⑽及第2銅落之受執 = 兩落產生尺寸變化之 “、歷私不同使 ^ ^ ^ 從而有應力產生於箔上,亦可麩 由調整兩銅箔之特性,以使銅箔不翹A h v.、 曰 皺褶或折痕。 ㈣泊不翹曲(bUcking)地抑制 201132493 即,本發明之銅或銅合金箔係用於兩面覆銅積層板, 且當 (EaxALa) /2χ1〇〇〇 時,丨1〇xcta|Sysa,弯曲 次數為40萬次以上。 其中,EA:將上述銅或銅合金箔於350。(:保持30分鐘 並冷卻至室溫後之寬度方向之楊式模數(單位為GPa) ; △ L a .自至溫升溫至3 5 0 C並保持3 0分鐘後冷卻至室溫時之 上述銅或銅合金箔之寬度方向上之尺寸變化率(單位為 ppm,將收縮设為正值);YgA:拉伸試驗中之上述銅或銅 合金箔之0.2%安全限應力(Proofstress)(單位為Μρ〇 ; 彎曲次數:使用IPC滑動彎曲試驗機’將箔切成寬度 方向為12.5mm、長度方向為200mm之帶狀並於35(rc加熱 處理0.5小時之後使用,彎曲半徑於箔厚度為18以爪之情 形時設為1.5mm、於猪厚度為12/zm之情形時設為lmm, 對試驗片負載每分鐘100次之反覆滑動,電阻自初始上升 20%之彎曲次數亦終止的次數。 度R ( %)為93.0%以上, 較佳為上述銅或銅合金结均為壓延箱,最終冷軋加工BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-layer copper or copper alloy foil suitable for use in a resin layer for a flexible printed circuit board (FPC 'Flexible Printed Circuit), for example. A copper or copper alloy of a double-sided copper clad laminate, and a method of manufacturing a two-sided copper clad laminate using the copper or copper alloy case. [Prior Art] A copper clad laminate (CCl) used in a flexible wiring board (FPC) can be used for a single-sided steel-clad laminate made of a single-layer copper foil for a resin layer, and a resin layer. Two-sided copper-clad laminate made of two-layer copper foil (hereinafter referred to as "two-sided CCL"). The circuit formed on both sides of the CCL is a two-sided flexible wiring board. It is easy to realize the refinement of the circuit and the space saving of the FPC. Therefore, the use of the two-sided CCL tends to increase. In the method for producing a double-sided CCL, there is known a method in which a varnish of a resin composition of a single side of a copper foil is cured and heat-cured, and then a copper foil is thermally bonded to the surface of the resin (Patent Document 1). Further, there are the following methods: a surface of the polyimide film having a thermoplastic polyimide layer on both sides and a back surface, and a thermocompression bonding copper foil; and a polyimide film having a thermoplastic polyimide layer After hot-pressing the copper foil, the thermoplastic polyimide layer is coated on the opposite side of the copper foil, and the other copper foil is thermocompression bonded on the surface; The imide precursor, that is, the varnish, is hardened, and a thermoplastic polyimide layer is formed on the surface of the resin opposite to the copper foil, and the other copper foil is thermocompression bonded to the surface. Patent Document 1: Japanese Unexamined Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The resin laminated copper foil (the first copper oxide) is heated to a temperature equal to or higher than the constitution c at the time of initial lamination, and is temporarily cooled to a further portion, and then after the other copper foil (second copper poise) in the opposite area of the resin layer 'The i-th copper box is also reheated and cooled. However, when the second copper box is laminated and heated, it is cooled. "The length direction of the first copper is parallel and usually in the center in the width direction = wrinkles or creases are formed. Even if the second copper is adjusted. Time: heating conditions (hot crimping conditions, tension, etc.), it is also difficult to completely eliminate: the folds or creases. Moreover, it is considered that the above-mentioned enemy folds or creases are as follows; = Health: due to the application of (10) and When the second copper matte is laminated, the heat is changed: = the copper foil is different in the thickness of the two copper foils which are present when the second copper crucible is heated and then cooled. It is impossible to withstand the stress generated by this. For the purpose of solving the above problems, an object of the invention is to mention two: when used for a double-sided copper-clad laminate, it can suppress the wrinkle copper alloy foil, and the estimation of #田丄J ^ Method of copper or copper alloy falling from two copper-clad laminates. The results of various studies by the inventors found that: even if the application is applied to the (10) and the second copper drop, the size changes. ", the difference between the private and the private ^ ^ ^ and thus the stress generated in the foil , Can adjust the characteristics of the bran two copper foil, the copper foil is not to Alice A h v., Said wrinkles or creases. (4) bundling (bUcking) suppression 201132493 That is, the copper or copper alloy foil of the present invention is used for a double-sided copper-clad laminate, and when (EaxALa) /2χ1〇〇〇, 丨1〇xcta|Sysa, bending The number of times is more than 400,000 times. Among them, EA: the above copper or copper alloy foil is 350. (: The Young's modulus in the width direction after 30 minutes of cooling and cooling to room temperature (unit: GPa); △ L a. The above temperature is raised to 305 ° C and kept for 30 minutes and then cooled to room temperature. The dimensional change rate in the width direction of the copper or copper alloy foil (in ppm, the shrinkage is set to a positive value); YgA: 0.2% safety stress (Proofstress) of the above copper or copper alloy foil in the tensile test (unit Μρ〇; Bending times: Using an IPC sliding bending tester', the foil was cut into strips with a width of 12.5 mm and a length of 200 mm and used at 35 (rc heat treatment for 0.5 hours, with a bend radius of 18 mm). In the case of the claw, it is set to 1.5 mm, and when the pig thickness is 12/zm, it is set to 1 mm, and the test piece load is repeatedly slid 100 times per minute, and the number of times the resistance is 20% from the initial rise is also terminated. Degree R (%) is 93.0% or more, preferably the above copper or copper alloy joints are calendered boxes, and finally cold rolling processing

且最終退火後之平均結晶粒徑GS (#m)為 gs$3.08xR-260。 △La較佳為i45ppm以下。 於上述鋼或銅合金箔之單面形成樹脂層And the average crystal grain size GS (#m) after the final annealing was gs$3.08xR-260. ΔLa is preferably i45 ppm or less. Forming a resin layer on one side of the above steel or copper alloy foil

側積層其他上述銅或銅合金箔 覆鋼積層板。 本發明之兩面覆銅積層板之製造方法具有:第丨步驟, 而獲得單面覆銅 於上述單面覆銅積層板之上述樹脂 同合金羯並進行加熱,而獲得兩面 201132493 根據本發明,於製造兩面覆銅積層板時可抑制敏褶或 折痕。 【實施方式】 以下,對使用本發明之實施形態之銅或銅合金羯的兩 面覆銅積層板之製造方法進行說明。再者,於本發明中, 所謂% ’只要未作特別說明,則表示質量%(質量%)。圖 1係表示兩面覆金屬積層板8之製造方法。 圖1中,首先連續捲出捲筒狀之第1銅或銅合金羯4, 使用應用輥機(Application roller ) 10、11等,於所捲出之 第1銅或銅合金箔4之單面以特定厚度連續塗佈清漆狀樹 脂組成物2a。樹脂組成物2a於硬化後成為樹脂層h繼而, 將塗佈有树月曰組成物2a之第1銅或銅合金羯4導入至乾燥 裝置15中’使樹脂組成物2a硬化(或半硬化)^如此,於 第1銅或銅合金箔4之單面形成樹脂層,而獲得單面覆銅 積層板(第1步驟)。此處,亦有時於第丨步驟結束之後 將該單面覆銅積層板捲繞成捲筒狀,再進行至第2步驟。 再者,係於第1銅或銅合金箔4之單面形成樹脂層時進行 ''仁除於塗佈上述樹脂組成物之後進行加熱以外,例 如亦可將如樹脂臈般已成為樹脂層者熱壓接於第1銅或鋼 &amp;金治4之單面。又,通常第丨步驟中之加熱溫度成為第2 步驟中之加熱溫度以上之溫度。繼而,連續捲出捲筒狀之 第2銅或銅合金箔6,於加熱至例如350〜400°C之層疊輥 2〇、21之間連續通過第1銅或銅合金箔4及第2鋼或鋼合 金名6此時,於第1銅或銅合金箔4之樹脂層2側積層第 201132493 2銅或銅合金箔6並進行加熱,而獲得兩面覆鋼積層板8(第 2步驟)^將兩面覆銅積層板8適當捲繞成捲筒。 並且,如圖2所示,兩面覆銅積層板8係於第丨銅或 銅合金箔4之樹脂層2侧積層第2銅或銅合金箔6而構成。 第1銅或銅合金箔4及第2銅或銅合金箔6例如可舉 出.純銅、精銅(JIS — 11〇〇)、無氧銅(JIS — 1〇2〇)或於 該等純銅、精銅 '無氧銅中添加合計為4〇〜4〇〇質量卯爪 之Sn及/或Ag者。可將第1銅或銅合金箔4及第2銅或 銅合金箱6之厚度設為例如6〜18#m左右。第丨銅或銅合 金箔4及第2銅或銅合金箔6使用相同者。第1銅或銅合 金箔4及第2銅或銅合金箔6可為壓延箔,亦可為電解箱。 班樹脂層2可使用聚醯亞胺、PET (聚對醜酸乙二酿)、 環氧樹脂、酚樹脂等熱固性樹脂;飽和聚酯樹脂等熱塑性 樹脂,但並不限定於該等樹脂。又,亦可將溶劑中溶解有Other laminates of the above copper or copper alloy foil coated steel sheets. The manufacturing method of the double-sided copper-clad laminate according to the present invention has the following steps: obtaining the above-mentioned resin-like alloy crucible with a single-sided copper coating on the single-sided copper-clad laminate, and heating, thereby obtaining two sides 201132493 according to the present invention, Sensitive pleats or creases can be suppressed when manufacturing two-sided copper clad laminates. [Embodiment] Hereinafter, a method for producing a double-sided copper-clad laminate using copper or copper alloy crucible according to an embodiment of the present invention will be described. In the present invention, the term "%" means mass% (% by mass) unless otherwise specified. Fig. 1 shows a method of manufacturing a double-sided metal-clad laminate 8. In Fig. 1, first, the first copper or copper alloy crucible 4 in a roll shape is continuously wound up, and one side of the first copper or copper alloy foil 4 to be wound up is applied using an application roller 10, 11, or the like. The varnish-like resin composition 2a is continuously applied in a specific thickness. After the resin composition 2a is cured, it becomes a resin layer h, and the first copper or copper alloy crucible 4 coated with the sapphire composition 2a is introduced into the drying device 15 to harden (or semi-harden) the resin composition 2a. Thus, a resin layer is formed on one surface of the first copper or copper alloy foil 4 to obtain a single-sided copper-clad laminate (first step). Here, the single-sided copper clad laminate may be wound into a roll shape after the completion of the second step, and the second step may be performed. In addition, when the resin layer is formed on one surface of the first copper or copper alloy foil 4, the resin is subjected to heating after the application of the resin composition, and may be, for example, a resin layer as a resin. Thermocompression bonded to the first side of the first copper or steel &amp; Jinzhi 4. Further, usually, the heating temperature in the second step is a temperature higher than the heating temperature in the second step. Then, the second copper or copper alloy foil 6 in the form of a roll is continuously wound up, and the first copper or copper alloy foil 4 and the second steel are continuously passed between the lamination rolls 2, 21 heated to, for example, 350 to 400 °C. Or steel alloy name 6 At this time, the 201132493 2 copper or copper alloy foil 6 is laminated on the resin layer 2 side of the first copper or copper alloy foil 4 and heated to obtain a double-sided steel-clad laminate 8 (second step)^ The double-sided copper clad laminate 8 is appropriately wound into a roll. Further, as shown in Fig. 2, the double-sided copper-clad laminate 8 is formed by laminating a second copper or copper alloy foil 6 on the resin layer 2 side of the second copper or copper alloy foil 4. Examples of the first copper or copper alloy foil 4 and the second copper or copper alloy foil 6 include pure copper, refined copper (JIS-11), oxygen-free copper (JIS-1〇2〇), or such pure copper. In the refined copper 'oxygen-free copper, a total of 4 〇 to 4 〇〇 mass of the claws of Sn and/or Ag is added. The thickness of the first copper or copper alloy foil 4 and the second copper or copper alloy case 6 can be, for example, about 6 to 18 #m. The same applies to the second copper or copper alloy foil 4 and the second copper or copper alloy foil 6. The first copper or copper alloy foil 4 and the second copper or copper alloy foil 6 may be rolled foil or may be an electrolytic cell. As the resin layer 2, a thermosetting resin such as polyimide, PET or epoxy resin, or a thermoplastic resin such as a saturated polyester resin can be used, but it is not limited to these resins. Also, the solvent can be dissolved

以下’表示當於第i銅或鋼合金猪4之單面形成樹脂 6而製造兩面CCL時,由 4、6之尺寸變化之差而產 層之後,積層第2銅或銅合金羯 於失持樹脂之兩片銅或銅合金箱 生之應力。 201132493 首先,於在溫度T】(T1 a rj a—, 又為積層第2銅或銅合金箔6時 之加熱溫度)下積層為兩面CCL後冷卻$ τ * 仪7丨主12為止之情形 時,施加於第1銅或銅合金箔4之雍六^ j么 «立冶4之應力σ Α係以下述式i所 表不· σ A= EaxEb/ ( EA+ EB) X ( α ΒΧ ( Τι_ τ2) + △ ( “ axCT.-T.) +ALa) ) χίοοο (1)。再者,B尺寸變 化△係將收縮設為正,且為寬度方向(自銅或銅合金猪之 捲筒連續地製造CCL·時之捲筒寬度方向)之變化。彳 此處,用於CCL之銅或銅合金箔為近似於純銅者,因 此即便稍微含有添加成分,亦可將熱膨脹係數α (下標A、 B分別表示第1銅或銅合金箔4、第2銅或銅合金箔6)視 為相同(Ο: A与α B )。因此,式i係以下述式2所表示: aA=EAxEB/(EA+EB)x(^LA-ALB)xl〇〇〇 (2)。 其中,EA .將上述第1銅或銅合金箔於35〇。匸保持 分鐘並冷卻至室溫之後,再次於35(rc保持3〇分鐘並冷卻 至室溫之第1受熱歷程中,上述第丨銅或銅合金箔之寬度 方向上之揚式模數(單位為Gpa) ;Eb:由將上述第2銅或 銅合金羯於350。(:保持30分鐘並冷卻至室溫之第2受熱歷 程所產生之上述第2銅或鋼合金箔之寬度方向上之揚式模 數(單位為GPa) ; △ LA :以自室溫升溫至350。(:並保持 3〇分鐘後冷卻至室溫時之尺寸為基準,再次於35(rc保持 30分鐘並冷卻至室溫後之上述第1銅或銅合金箔之寬度方 向上之尺寸變化率(單位為ppm,將收縮設為正值);△ lb :自室溫升溫至3501,保持30分鐘並冷卻至室溫後之 201132493 上述第2銅或銅合金箔之寬度方向上之尺寸變化率(單位 為ppm,將收縮設為正值)。 再者,所謂室溫係為25〜35。(:(通常為25°C )。 即,若使兩片銅或銅合金箔4、6之楊式模數變小,且 使銅或銅合金箔4、6之尺寸變化率之差(ALa_ ALb)變 小,則應力σΑ會變小,不易產生製造兩面CCL時之皺褶 或折痕。 此處,即便兩片銅或銅合金箔4、6使用相同者亦產 生尺寸變化率之差,因此顯然該差並非由 熱膨脹所引起。並且,若對金屬加熱則產生再結晶或回復 等組織變化,因此若加熱金屬後進行冷卻,則會變得較原 先尺寸短(熱收縮)、或長(熱伸長)。又,即便將暫時 加熱並冷卻之金屬再次於相同溫度以下加熱並冷卻,亦不 會產生熱收縮或熱伸長。再者,該等現象於壓延箔與電解 箔中均會產生,但壓延箔之由壓延所引起之應變更大,又, 根據箔之成分之不同,由於製造CCL時所施加之熱而由壓 延組織變化為再結晶組織’故熱收縮或熱延伸變大。 圖3係表示藉由製造Ccl時所施加之熱而產生上述熱 延伸或熱收縮,導致第1銅或銅合金箔4產生皺褶(折痕) 1〇〇之狀態。 首先’若於上述第1步驟中製造單面覆銅積層板時, 將第1銅或銅合金羯4加熱後進行冷卻,則熱收縮成比原 先長度小。繼而,若於上述第2步驟中製造兩面覆銅積層 板時’將第2銅或銅合金箔6加熱後進行冷卻,則欲熱收 201132493 縮成比原先之長度小(圖3之箭頭)。另一方面, 步驟中熱收縮之第1銅或銅合金落4於第2步驟中幾乎不 進行熱收縮(圖3之箭頭)。 因此’於第2步驟中之加熱後冷卻時,藉由第2 :合金,“欲收縮之力而施加壓縮應力於帛i銅或銅合金 繼而第1銅或銅合金箔4無法承受該壓縮應力而翹 曲(產生皺褶或折痕)。 ,j而,於施加壓縮應力於第1銅或銅合金箔4側之情 形時’若該銅領之安全限應力大於壓縮應力(式2之^), 則不會引起輕曲’而難以產生皺稽或折痕。通常I法求出 銅箱之相對於壓縮之安全限應力,但是否會引起輕曲之邊 界值可由相對於拉伸之安全限應力(YS )代替。即,認為 右以YS成為σ A以上之方式選擇第t銅或銅合金箔*,則 不會產生皺褶或折痕。 並且’本發明人等藉由實驗而求出於製造兩面覆銅積 層板夺不會產生皺褶或折痕之條件,結果可知若以相對於 式2之而成為 110&gt;&lt;σ Α|^ YSA (3) 之方式選擇第1銅或銅合金箔4,則難以產生皺褶或折 痕。 另一方面’可知於施加壓縮應力於第2銅或銅合金箔6 之情形時,若以相對於式2之σ B而成為 |10χσ Β|^ YSB (4) 之方式選擇第2銅或銅合金箔6,則難以產生皺褶或折The following 'is indicated that when the two-sided CCL is formed on the one side of the i-th copper or steel alloy pig 4 to form the two-sided CCL, the second copper or copper alloy is lost after the layer is formed by the difference in the dimensional changes of 4 and 6. The stress of the two pieces of copper or copper alloy box of the resin. 201132493 First, when the temperature is T] (T1 a rj a -, the heating temperature when the second copper or copper alloy foil 6 is laminated), the two layers are CCL and then cooled by $ τ * , applied to the first copper or copper alloy foil 4, ^ ^ « « « 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 σ σ σ σ σ σ σ σ σ = = = = = = = = = = = = = = = = = = = = = = = = = = + △ (" axCT.-T.) +ALa) ) χίοοο (1). In addition, the B size change △ is set to be positive and is in the width direction (continuously from the copper or copper alloy pig roll The change in the width direction of the roll when manufacturing CCL·. Here, the copper or copper alloy foil used for CCL is similar to pure copper, so even if it contains a slight addition component, the coefficient of thermal expansion α (subscript A, subscript A, B denotes that the first copper or copper alloy foil 4 and the second copper or copper alloy foil 6) are considered to be the same (Ο: A and α B ). Therefore, the formula i is expressed by the following formula 2: aA=EAxEB/( EA+EB)x(^LA-ALB)xl〇〇〇(2), wherein EA. The above first copper or copper alloy foil is 35 〇. 匸 is kept for a few minutes and cooled to room temperature, again at 35 ( Rc keeps 3 minutes and However, in the first heating course to room temperature, the rising modulus of the above-mentioned second copper or copper alloy foil in the width direction (unit: Gpa); Eb: by smashing the second copper or copper alloy to 350. : a rising modulus (in units of GPa) in the width direction of the second copper or steel alloy foil produced by the second heat history of holding for 30 minutes and cooling to room temperature; Δ LA : heating from room temperature to 350. (: and maintaining the dimensional change rate in the width direction of the first copper or copper alloy foil after 35 seconds while maintaining the temperature after cooling to room temperature for 3 minutes (the rc is kept for 30 minutes and cooled to room temperature) The unit is ppm, the shrinkage is set to a positive value); Δ lb : the temperature change rate in the width direction of the second copper or copper alloy foil of 201132493 after the temperature is raised from room temperature to 3501, and kept for 30 minutes and cooled to room temperature (unit In the case of ppm, the shrinkage is set to a positive value. Further, the room temperature is 25 to 35. (: (usually 25 ° C). That is, if two sheets of copper or copper alloy foils 4 and 6 are formed, When the number becomes small and the difference in the dimensional change rate (ALa_ALb) of the copper or copper alloy foils 4, 6 becomes small, the stress σ Α becomes It is not easy to produce wrinkles or creases when manufacturing the two-sided CCL. Here, even if the two copper or copper alloy foils 4, 6 are the same, the difference in dimensional change rate occurs, so it is obvious that the difference is not caused by thermal expansion. If the metal is heated, a change in structure such as recrystallization or recovery occurs. Therefore, if the metal is heated and then cooled, it becomes shorter (heat shrinkage) or longer (thermal elongation) than the original size. Further, even if the temporarily heated and cooled metal is heated and cooled again at the same temperature or lower, heat shrinkage or thermal elongation does not occur. Furthermore, these phenomena are generated in both the rolled foil and the electrolytic foil, but the strain caused by the calendering of the rolled foil is larger, and, depending on the composition of the foil, the calendering due to the heat applied during the manufacture of the CCL The tissue changes to recrystallized structure' so that heat shrinkage or thermal elongation becomes large. Fig. 3 shows a state in which the above-described heat extension or heat shrinkage is caused by heat applied when CCl is produced, and wrinkles (creases) are formed in the first copper or copper alloy foil 4. First, when the single-sided copper-clad laminate is produced in the above first step, the first copper or copper alloy crucible 4 is heated and then cooled, and the heat shrinkage is smaller than the original length. Then, when the double-sided copper-clad laminate is produced in the second step, the second copper or copper alloy foil 6 is heated and then cooled, and the heat shrinkage 201132493 is reduced to be smaller than the original length (arrow of Fig. 3). On the other hand, the first copper or copper alloy 4 which is heat-shrinked in the step hardly undergoes heat shrinkage in the second step (arrow of Fig. 3). Therefore, when cooling after heating in the second step, by the second alloy, "the compressive stress is applied to the copper or copper alloy by the force to be contracted, and then the first copper or copper alloy foil 4 cannot withstand the compressive stress. And warping (creating wrinkles or creases), j, when compressive stress is applied to the side of the first copper or copper alloy foil 4, 'if the safety limit stress of the copper collar is greater than the compressive stress (^ of the formula 2) ), it will not cause light curvature 'and it is difficult to produce wrinkles or creases. Usually the I method is used to determine the safety limit stress of the copper box relative to compression, but whether it will cause the boundary value of the light curve can be safe relative to the stretching The limit stress (YS) is substituted. That is, it is considered that the t-th copper or copper alloy foil* is selected so that YS becomes σ A or more, and wrinkles or creases are not generated. The condition for producing a double-sided copper-clad laminate does not cause wrinkles or creases. As a result, it is understood that the first copper or the first copper is selected in the manner of 110 &lt; σ Α|^ YSA (3) with respect to Formula 2 On the other hand, it is difficult to generate wrinkles or creases on the copper alloy foil 4. In the case of the second copper or copper alloy foil 6, when the second copper or copper alloy foil 6 is selected so as to become |10 χ σ Β |^ YSB (4) with respect to σ B of Formula 2, wrinkles are less likely to occur or fold

10 201132493 痕。然而,一般係施加壓縮應力於第1銅或銅合金箔4。 為滿足式3(或式4) ,σΑ(σΒ)即尺寸變化率之差 (△LA— △“)越小越好,因此於第1步驟中第1銅或銅 合金羯4所受之熱與於第2步驟中第2銅或銅合金箔6所 受之熱之差越小越好。又,於第1步驟中第丨銅或銅合金 箔4所受之應變越小,尺寸變化率之差(△“)亦 變 /J、。 根據以上所述,滿足式3、4之具體方法可舉出:j ) 預先加熱第1銅或銅合金箔4及第2銅或銅合金箔6; 2) 於第1銅或銅合金箔4及第2銅或銅合金箔6為壓延箔之 情形時,以低加工度進行壓延;3)使根據箱之厚度與機械 性質所設定之壓延時張力不超過限度;4)第i銅或銅合金 箔4及第2銅或銅合金箔6使用電解箔。然而,若考慮一 般係施加壓縮應力於第i銅或銅合金相彳,則亦可僅對 第2銅或銅合金箔6實施1)至4)之方法。 關於上述1 )之方法’已知純銅為具有面心立方結構之 金屬,若藉由加熱而進行再結晶,則立方體方位錢,彎 曲性變佳。立方體方位擴展之㈣之揚式模數較低,拉伸 試驗中之0.2%安全限應力亦較低。即, J以δ兑此種立方體 方位擴展之銅箔於製造兩面CCL時(推咕 町、進订第2步驟時)最 容易產生折痕或皺褶。根據本發明人篝 &lt;貫驗明白,例如 將純銅羯於35(TC保持30分鐘後進行冷卻,社 為7〇GPa左右,0.2%安全限應力為5 :杨式模數 壮左右0如此,古刃 為即便將安全限應力較小之銅或銅合么# 树 &gt;白再次加熱至3 5 〇10 201132493 Traces. However, compressive stress is generally applied to the first copper or copper alloy foil 4. In order to satisfy the formula 3 (or the formula 4), σΑ(σΒ), that is, the difference in the dimensional change rate (ΔLA−Δ“) is preferably as small as possible, so that the first copper or copper alloy crucible 4 is subjected to heat in the first step. The smaller the difference between the heat received by the second copper or copper alloy foil 6 in the second step, the smaller the strain of the second copper or copper alloy foil 4 in the first step, the dimensional change rate. The difference (Δ") also changes to /J. As described above, specific methods for satisfying Expressions 3 and 4 include: j) preheating the first copper or copper alloy foil 4 and the second copper or copper alloy foil 6; 2) on the first copper or copper alloy foil 4 And when the second copper or copper alloy foil 6 is a rolled foil, the rolling is performed with a low degree of work; 3) the pressure delay tension set according to the thickness and mechanical properties of the box does not exceed the limit; 4) the i-th copper or copper An electrolytic foil is used for the alloy foil 4 and the second copper or copper alloy foil 6. However, if it is considered that a compressive stress is generally applied to the i-th copper or copper alloy phase, the method of 1) to 4) may be applied only to the second copper or copper alloy foil 6. Regarding the method of the above 1), it is known that pure copper is a metal having a face-centered cubic structure, and if recrystallization is performed by heating, the cube orientation and the flexibility are improved. The cube-azimuth extension (4) has a lower lift modulus and a 0.2% safety limit stress in the tensile test. In other words, J is most likely to be creased or wrinkled when the two-sided CCL is produced by the copper foil which is extended by δ to such a cube orientation (in the case of the push-step, the second step). According to the inventors of the present invention, it is understood that, for example, pure copper is smashed at 35 (TC is kept for 30 minutes and then cooled, and the body is about 7 〇 GPa, 0.2% safety limit stress is 5: Yang type modulus is strong, and so on, the ancient blade In order to heat the copper or copper even if the safety limit is small, #树&gt; white is heated again to 3 5 〇

11 S 201132493 °c左右為止後進行冷卻,尺寸變化亦幾乎為〇。 因此,使用相同者作為第丨鋼或鋼合金络4及第2銅 或銅合金羯6 (ΕΑπΒ、丨σΑΗ丨σΒ|),以^^〇時,式2 係以下述式5表示: 〇 Α= ( ΕαχΔ Lb) / 2x1000 ( 5 )。 並且,根據式3與式5,而成為下述式6: ΙΙΟΟΟΟχ ( ΕαχΔ LB/2) YSA (6), 只要使用如滿足式6之銅或銅合金箔製造兩面CCL即 &quot;5J- 〇 又,根據上述實驗結果,若將Ea= 7〇QPa' YSa= 5〇MPa 代入式5中,則可獲得△ Lb= 143 ( ppm)。即,若至少將 第2銅或鋼合金箔6於使用前加熱,使用△LBgi43(ppm) 者,則兼具彎曲性且難以產生折痕或皺褶。只要將第2銅 或銅合金箔6之加熱條件設為於5〇°c〜200。(:加熱1秒〜10 小時左右即可,但並不限定於此。例如加熱條件可舉出於 60 C保持3小時或於130°C保持3秒。即,預先對銅或銅合 金ϋΙ施加上述之熱處理後用於製造兩面Ccl即可。 其次,關於上述2 )之方法,壓延箔之應變係根據最終 退火後之壓延加工度、一道次軋縮量、張力及加工溫度等 而變化。然而’軋縮量或張力會取決於加工對象之箔之厚 度或壓延機之性能而難以同樣地規定。又,加工溫度越高 則應變越小’但壓延中壓延油發揮冷卻劑之作用,而難以 規定瞬間之加工溫度。 因此’根據壓延加工度來規定箔所需要之條件。此處,After 11 S 201132493 °c, it is cooled and the dimensional change is almost 〇. Therefore, the same one is used as the second steel or steel alloy 4 and the second copper or copper alloy 羯6 (ΕΑπΒ, 丨σΑΗ丨σΒ|), and when ^^〇, the formula 2 is expressed by the following formula 5: = ( ΕαχΔ Lb) / 2x1000 ( 5 ). Further, according to Equations 3 and 5, ΙΙΟΟΟΟχ (ΕαχΔ LB/2) YSA (6) is used, and the two-sided CCL is manufactured by using a copper or copper alloy foil that satisfies the formula 6, that is, "5J- 〇 According to the above experimental results, if Ea = 7 〇 QPa ' YSa = 5 〇 MPa is substituted into Formula 5, Δ Lb = 143 (ppm) can be obtained. In other words, if at least the second copper or steel alloy foil 6 is heated before use, ΔLBgi 43 (ppm) is used, and both of them have flexibility and are less likely to cause creases or wrinkles. The heating conditions of the second copper or copper alloy foil 6 are set to 5 〇 ° c to 200. (The heating may be performed for about 1 second to 10 hours, but is not limited thereto. For example, the heating condition may be maintained at 60 C for 3 hours or at 130 ° C for 3 seconds. That is, the copper or copper alloy is applied in advance. The heat treatment described above may be used to produce both-sided Ccl. Next, in the method of the above 2), the strain of the rolled foil varies depending on the degree of rolling after final annealing, the amount of rolling reduction, the tension, the processing temperature, and the like. However, the amount of shrinkage or tension may vary depending on the thickness of the foil to be processed or the performance of the calender. Further, the higher the processing temperature, the smaller the strain. However, the rolling oil in the rolling functions as a coolant, and it is difficult to specify the processing temperature in an instant. Therefore, the conditions required for the foil are specified according to the degree of calendering. Here,

12 201132493 若減小壓延加工度則箱之應變變小,但再結晶時立方體方 位難以擴展而青曲性下降,故而不佳。相對於此,若減小 塵延前之結晶粒徑,則即便以相同之加工度進行壓延,立 方體方位亦擴展。根據以上之見解,本發明人等進行實驗 後明白:若最終冷札加工度R(%) $ ,且最終 退火後之平均結晶粒徑GSUm)為邮3〇8xr—鳩, 則不會損害靑曲性’且可抑制折痕或皺褶產生。然而,若r 過高則存在彎曲性下降之傾向,因此於使用前未預先加熱 銅或銅合金箱之情形(未進行上述υ之方法之情形)時, R較佳為9 8 %以下。 如上所述,於本發明之銅或銅合金箔中,彎曲性必需 優異,且鋼或銅合金箔之彎曲次數必需為4〇萬次以上。 此處,彎曲次數係使用IPC (美國印刷電路工業會)滑 動彎曲試驗機,將使箔切成寬度方向(成為與壓延方向成 直角之方向。於電解箱之情形時為與MD(咖咖如 Section,縱向)成直角之方向)為125麵、長度方向為 200mm之帶狀而得之試驗片於35〇&lt;t加熱處理〇 5小時之後 加以使用。彎曲半徑於箔厚度為18 β m之情形時設為 1.5mm、於箔厚度為12μ m之情形時設為lmm,對試驗片 負載每分鐘100次之反覆滑動,終止之次數為試驗片之電 阻自初始上升20%之彎曲次數。已知銅或銅合金箱之彎曲 次數為40萬次以上者相當於實際之兩面CCL中設為合格之 彎曲次數。 例如,於先前之銅箔中,亦存在R (%)為93.〇%以上12 201132493 If the degree of calendering is reduced, the strain of the box becomes small, but when the crystal is recrystallized, it is difficult to expand the cube and the buckling property is lowered, which is not preferable. On the other hand, if the crystal grain size before the dusting is reduced, even if the rolling is performed at the same degree of processing, the orientation of the cube is expanded. According to the above findings, the inventors of the present invention have made it clear that if the final cold processing degree R (%) $ and the average crystal grain size after final annealing (GSUm) is 3 〇 8 x r - 鸠, it will not damage 靑Flexibility' and can prevent creases or wrinkles from occurring. However, if r is too high, the bendability tends to decrease. Therefore, when the copper or copper alloy case is not previously heated before use (in the case where the above method is not performed), R is preferably 98% or less. As described above, in the copper or copper alloy foil of the present invention, the bendability is required to be excellent, and the number of times of bending of the steel or copper alloy foil must be 40,000 or more. Here, the number of bends is made by using the IPC (American Printed Circuit Industry Association) sliding bending tester to cut the foil into the width direction (the direction perpendicular to the rolling direction. In the case of the electrolysis box, it is the same as MD) The test piece obtained in the form of a strip having a length of 250 mm and a length of 200 mm in the direction of the right angle was used after 35 hours of heat treatment for 5 hours. The bending radius is set to 1.5 mm when the foil thickness is 18 β m, and is set to 1 mm when the foil thickness is 12 μm, and the sliding of the test piece load is 100 times per minute. The number of terminations is the resistance of the test piece. The number of bends from the initial rise of 20%. It is known that the number of bending of the copper or copper alloy case is 400,000 times or more, which is equivalent to the number of bending times which are determined to be acceptable in the actual two-sided CCL. For example, in the previous copper foil, there is also an R (%) of 93.3% or more.

13 S 201132493 260 ^ ^ GS ^ ) ^ Gs ^ 3 .〇8xR ^ Γ4〇Λ i2〇〇p-s^^) 滿〇萬二人。又,即便使用以公知之組成且為使其具有高彎 曲性而利用公知之方法所製造之銅箔(例如以加工 的篇進行最終壓延之·幻,於贼〜·。c進行4^0 小時左右之預先加熱者亦滿足上述式6,因此f曲性優異, 適於兩面覆銅積層板。 ” 實施例 使用表1中所示之組成之銅箔(銅合金箔),以圖^ 所不之方式製造兩面CCL。此處,第i銅箔4與第2銅,“ 雖為相同,但根據於製造CCL中所使用之順序,區別為第 1銅V# 4及第2銅箔6而加以說明。 再者對°卩分銅箔如表1所示般調整結晶粒徑GS與 加工度’或實施預先熱處理。再者,預先熱處理係於下述 化學處理(電鍍)後進行,亦可於將要製造CCL之前進行。 首先’對第1銅结4之單面進行化學處理(電鍍), 於該面以厚度成為25&quot;m之方式塗佈聚酿亞胺樹脂之前驅 物清漆(宇部興產製造之u—Varnish A)。然後,於設定 為1 30 C之熱風循環式高溫槽中乾燥3〇分鐘,階段性地花 費2000秒升溫至35〇t並進行硬化(醯亞胺化)而形成樹 脂層2,從而製作單面CCL。繼而,於單面CCl之樹脂側 面塗佈熱塑性聚醯亞胺(接著層)並進行乾燥後,重疊第2 銅泊6 ’利用加熱至35〇〇c之壓力機進行熱壓接1〇分鐘而 製造兩面CCL »然後,將兩面冷卻至室溫,目測判定 201132493 折痕或皺褶之產生情況。 12 5==鋼猪切成寬度方向為15〇職、長度方向為 _氏硬度計打出評點㈣為⑽― 二:預:痕之座標,藉此求出加熱前之距離L。再者, 二肖先進行熱處理之銅羯試樣 理後同樣求出w M _工 m 7部至至,孤,然後測定兩凹痕之座標,求 出距離 L。\ ' —Γ /V rt I / △ La可分別以(l — L’、/ τ、仕— &gt;丄々产 情形為正值。 L)/L進仃计舁,收縮之 八綱治之楊式模數Ea可依據JIS — Z228〇 _丨993利用 振動法而求出’ G 2%安全限應力%係使用拉伸試驗機, 依據 jis~~Z2241 — 1998 而求出。 f曲性係以如下方式進行評價。首先,將銅落切成寬 度方向為12.5mm、長度方向為2〇〇mm之帶狀而製成試驗 片,將其於35〇〇C加熱處理〇.5小時之後使用。彎曲試驗係 使用IPC (美國印刷電路工業會)滑動—曲試驗機,弯曲半 徑於銅箔厚度為18#m之情形時設為1.5mm、於銅箔厚度 為12 V m之情形時設為1 mm。銅箔厚度越薄則彎曲性越 好’因此為以相同基準進行評價,只要根據銅箔厚度而改 變f曲半徑即可。然後,對試驗片負載每分鐘1〇〇次之反 覆滑動’終止之次數為試驗片之電阻自初始上升2〇%之彎 曲次數。已知銅或銅合金箔之彎曲次數為4〇萬次以上者相 當於實際之兩面CCL中設為合格之彎曲次數。 將所獲付之結果示於表1。 15 201132493 〔一辦】 評價 弩曲次數 (千次) 672 v〇 Ό 699 539 547 517 499 605 653 1 488 475 432 227 245 232 1 σ\ 〇〇 &lt;N rO 360 595 459 Ό «/*) VO 525 318 so ΓΟ 皺褶或^ 折痕 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 X X X X 〇 〇 1 结之特性 |1〇χσΑ| (MPa) 卜 «Ν CN &lt;N CM m Ό m cs cs σ\ (Ν m 〇〇 m σ\ s〇 Ό 二 CN ο v〇 — σΑ (MPa) νώ — 卜 &lt;Ν fS oo — CN Cs v〇 c&lt;i &lt;^i σ\ μ ΡΛ 00 ΓΛ a\ CO v〇 ν〇 Ο 一· rO ν〇 r^i &lt;N 卜^ ο 卜^ 〆 IT) 卜 ο △ la (ppm) (Ν oo (N Os O &lt;N NO § m \〇 ? CN OO 艺 ΓΟ Ο 1 〇 〇\ 00 OS &lt;s w-&gt; &lt;Ν οο YSA (MPa) m m »n - VO - as Ό m IT) 00 VO Ρ OO g oo oo 00 210 〇 u-&gt; 00 S m s g Ea (GPa) - γΛ oo oo OO n OO - CS s CN σ\ 〇\ s o 120 〇 SO ON Sn JQ g &lt;s 00 ΙΛ 00 預先 熱處理 1 50t&gt;3h 1 60〇Cx3h 1 140〇Cx3s 1 60°C x7 h 1 65°〇3h I 60〇C&gt;&lt;7h 150°Cx3 s I 55°Cx3h 140°〇3 s 60°〇5h 65〇C x3 h 璀 € 壓延條件與粒徑 3.08xR -260 1 4A3 I 1 44.6 1 1 45.5 1 46.2 1 45.5 I 46.2 45.5 1 46.5 1 | 46.5 I 44.0 1 43.4 1 31.1 11.0 11.0 1 1 29.5 1 22.7 1 45.5 44.5 45.8 45.8 43.7 43.7 R (%) 98.8 98.9 99.2 99.4 ' 99.2 99.4 99.2 L?9-5 —99.5 1 98.7 I 98.5 1 94.5 95.5 188.0 I 88.0 89.0 1 1 I 94.0 1 L9K8 J | 99.2 | 1 98.9 1 1 99.3 1 99.3 98.6 98.6 GS (βτη) &lt;N »〇 CN &lt;N &lt;N &lt;N CN σ\ 00 OO &lt;N OO (N On (S Ό CN 1 ο (N CN oo 2 m 厚度 (^m) 〇〇 &lt;N &lt;N ίΝ CN &lt;N (N fS CN (N (Ν (Ν (Μ OO 00 Μ tN 00 OO cs 00 (N (N cs (Ν 組成 190 ppmAg (精銅) 190 ppmAg (精銅) 190 ppmAg (精銅) 300 ppmAg (精銅) 1 50ppmSn (無氧銅) 110 ppmSn (無氧銅) 180 ppmSn (無氧銅) 精銅 精銅 50 卯mSn-50 ppmAg (無氧銅) 50 ppmSn-50 ppmAg (無氧銅) 190 ppmAg (精銅) 110 ppmSn (無氧銅) 精銅 精銅 2000 ppmSn (無氣銅) &gt;99.9%Cu , 50卯mSn (無氧銅) ! 190 ppmAg (精銅) 190 ppmAg (精銅) 50 ppmSn (無氧銅) 精銅 90 ppmSn (無氧銅) 500 ppmSn (無氧銅) 500 ppmAg (精銅) 種類 壓延箔 1壓延箔1 1壓延箔1 壓延箔 1壓延箔1 1壓延箔1 壓延箔 壓延箔 1壓延箔1 歷延箔 1壓延箔| 壓延箔 壓延箔 壓延馆 壓延箔 壓延箔 電解銅箔 |壓延箔| I壓延箔 壓延箔 壓延箔 壓延箔 壓延箔 壓延箔 壓延箔 货施例1 實施例2 實施例3 1實施例4 1 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 實施例11 實施例12 實施例13 比較例1 比較例2 比較例3 比較例4 比較例5 比較例6 比較例7 比較例8 比較例9 比較例10 比較例11 比較例12 91 s 201132493 如由表1所明示,於對銅箔進行預先熱處理之實施例1 〜13之情形時,成為|1〇χσΑ丨$YSa,所獲得之兩面中 無皺褶或折痕,且彎曲性亦優異。 又’於調整銅箔之壓延條件而使R成為93〇%以上且 98.〇〇/°以下,並且GSS3.08XR— 260之實施例12、13之情 形時,即便未進行預先熱處理,亦成為丨1〇χσ a丨,= 獲得之兩面CCL中無皺褶或折痕,且彎曲性亦優異。 另一方面’於將R設為未滿93.0%且未進行預先熱處理 之比較例卜3之情形時…彎曲性下降。於使用電解銅羯且 未進行預先熱處理之比較例4之情形時,彎曲性亦下降。 於以獲得GS&gt;3.08XR-26〇之GS之方式進行退火後加 以壓延之比較例5之情形時、及於將尺設為未滿% 之比 較例6之情形時,彎曲性亦下降。 於在R超過98.0%之條件下進行壓延且未進行預先熱 處理之比較例7〜10 t情形時,丨1〇X(Ja|&gt;YSa,所獲得之 兩面CCL中產生皺褶或折痕。 於銅中添加之元素(Sn或Ag)之量超過4〇〇ppm之比 較例11、12,弯曲性下降。 【圖式簡單說明】 圖1,係表示本發明之實施形態之兩面覆銅積層板之製 造方法的圖。 圖2,係表示兩面覆銅積層&amp;之構成例之剖面圖。 圖3,係表示由於兩面覆銅積層板之製造時所施加之敎 而第1銅或鋼合金箔產生皺褶(折痕)之狀態之圖。13 S 201132493 260 ^ ^ GS ^ ) ^ Gs ^ 3 .〇8xR ^ Γ4〇Λ i2〇〇p-s^^) Full of people. Further, even if a copper foil produced by a known method is used in a known composition and has high bending property (for example, the final rolling is performed in a processed article, the thief is smashed to 4^0 hours. The pre-heating of the left and right also satisfies the above formula 6, and therefore is excellent in f curvature and is suitable for a double-sided copper-clad laminate." The embodiment uses a copper foil (copper alloy foil) of the composition shown in Table 1, to In this manner, the two-sided CCL is produced. Here, the i-th copper foil 4 and the second copper are the same, but are different from the first copper V# 4 and the second copper foil 6 in accordance with the order used in the manufacture of the CCL. In addition, the copper foil is adjusted to have a crystal grain size GS and a degree of processing as shown in Table 1, or a pre-heat treatment is performed. Further, the pre-heat treatment is performed after the following chemical treatment (electroplating), or It is to be carried out before the production of the CCL. First, the chemical treatment (electroplating) of the single side of the first copper junction 4 is carried out, and the varnish of the acrylonitrile resin is applied to the surface in such a manner that the thickness is 25 &quot; Manufactured u-Varnish A). Then, set to 1 30 C heat The mixture was dried in a circulating high-temperature bath for 3 minutes, and the temperature was gradually increased to 35 〇t in 2,000 sec and hardened (醯iminated) to form the resin layer 2, thereby producing a single-sided CCL. Then, the resin of the single-sided CCl was produced. After the side surface is coated with a thermoplastic polyimide (adhesive layer) and dried, the second copper bovine 6' is overlapped and thermoformed by a press heated to 35 〇〇c for 1 〇 to produce a two-sided CCL. Cool to room temperature and visually determine the occurrence of creases or wrinkles in 201132493. 12 5==The steel pig is cut into the width direction of 15 〇, the length direction is _ hardness tester (4) is (10) ― 2: Pre: trace The coordinates of the coordinates are used to determine the distance L before heating. Further, after the copper sputum sample subjected to heat treatment, the same is obtained, and then the w M _ m is finally obtained, and then the coordinates of the two dents are determined. Find the distance L. \ ' - Γ /V rt I / △ La can be positive for (l - L', / τ, 仕 - &gt; 丄々 情形 。 。 。 。 L L L L L 舁 舁 舁The Yang-type modulus Ea of the contracted eight-point rule can be determined by the vibration method according to JIS — Z228〇_丨993. The G 2% safety limit should be obtained. % was obtained by using a tensile tester according to jis~~Z2241 - 1998. The f-curvature was evaluated as follows. First, the copper was cut into a width direction of 12.5 mm and a length direction of 2 mm. The test piece was made into a strip shape, and it was heat-treated at 35 ° C for 5 hours. The bending test was performed using an IPC (American Printed Circuit Industry Association) sliding-bending test machine, and the bending radius was 18 mm. In the case of #m, it is set to 1.5 mm, and when the thickness of the copper foil is 12 V m, it is set to 1 mm. The thinner the thickness of the copper foil, the better the bendability. Therefore, the evaluation is performed on the same basis, and the radius of curvature f may be changed depending on the thickness of the copper foil. Then, the number of times of the reverse sliding of the test piece load per minute was repeated as the number of bends of the test piece from the initial rise of 2%. It is known that the number of bending of the copper or copper alloy foil is 40,000 or more times, which is equivalent to the number of bending times which are qualified in the actual two-sided CCL. The results obtained are shown in Table 1. 15 201132493 [一办] Evaluation of the number of distortions (thousands) 672 v〇Ό 699 539 547 517 499 605 653 1 488 475 432 227 245 232 1 σ\ 〇〇&lt;N rO 360 595 459 Ό «/*) VO 525 318 so ΓΟ wrinkles or ^ creases 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇XXXX 〇〇1 characteristics of knots |1〇χσΑ| (MPa) 卜«Ν CN &lt; N CM m Ό m cs cs σ\ (Ν m 〇〇m σ\ s〇Ό two CN ο v〇— σΑ (MPa) νώ — 卜&lt;Ν fS oo — CN Cs v〇c&lt;i &lt;^i σ\ μ ΡΛ 00 ΓΛ a\ CO v〇ν〇Ο a · rO ν〇r^i &lt;N 卜^ ο 卜^ 〆IT) οο Δ la (ppm) (Ν oo (N Os O &lt;N NO § m \〇? CN OO 艺艺ΓΟ 1 〇〇\ 00 OS &lt;s w-&gt;&lt;Ν οο YSA (MPa) mm »n - VO - as Ό m IT) 00 VO Ρ OO g oo oo 00 210 〇u-&gt; 00 S msg Ea (GPa) - γΛ oo oo OO n OO - CS s CN σ\ 〇\ so 120 〇SO ON Sn JQ g &lt;s 00 ΙΛ 00 Preheating 1 50t&gt;3h 1 60〇Cx3h 1 140〇Cx3s 1 60°C x7 h 1 65°〇3h I 60〇C&gt;&lt;7h 150°Cx3 s I 5 5°Cx3h 140°〇3 s 60°〇5h 65〇C x3 h 璀€ Calendering conditions and particle size 3.08xR -260 1 4A3 I 1 44.6 1 1 45.5 1 46.2 1 45.5 I 46.2 45.5 1 46.5 1 | 46.5 I 44.0 1 43.4 1 31.1 11.0 11.0 1 1 29.5 1 22.7 1 45.5 44.5 45.8 45.8 43.7 43.7 R (%) 98.8 98.9 99.2 99.4 ' 99.2 99.4 99.2 L?9-5 —99.5 1 98.7 I 98.5 1 94.5 95.5 188.0 I 88.0 89.0 1 1 I 94.0 1 L9K8 J | 99.2 | 1 98.9 1 1 99.3 1 99.3 98.6 98.6 GS (βτη) &lt;N »〇CN &lt;N &lt;N &lt;N CN σ\ 00 OO &lt;N OO (N On (S Ό CN 1 ο (N CN oo 2 m thickness (^m) 〇〇&lt;N &lt;N Ν CN &lt;N (N fS CN (N (Ν (Ν Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ (N cs (Ν Composition 190 ppmAg (predium copper) 190 ppmAg (fine copper) 190 ppmAg (fine copper) 300 ppmAg (fine copper) 1 50ppmSn (oxygen free copper) 110 ppmSn (oxygen free copper) 180 ppmSn (oxygen free copper) ) Copper refined copper 50 卯mSn-50 ppmAg (oxygen free copper) 50 ppmSn-50 ppmAg (oxygen free copper) 190 ppmAg (fine copper) 110 ppmSn (oxygen free copper) refined copper fine copper 2000 ppmSn (no gas copper) &gt;99.9% Cu , 50卯mSn (oxygen free copper) ! 190 ppmAg (Pearin) 190 ppmAg (polished copper) 50 ppmSn (oxygen free copper) refined copper 90 ppmSn (oxygen free copper) 500 ppmSn (oxygen free copper) 500 ppmAg (fine copper) type rolled foil 1 calendered foil 1 1 calendered foil 1 Calendered foil 1 calendered foil 1 1 calendered foil 1 calendered foil calendered foil 1 calendered foil 1 calendar foil 1 calendered foil | calendered foil calendered foil calendered foil calendered foil calendered foil electrolytic copper foil | calendered foil | I calendered foil calendered foil calendered foil calendered Foil Calender Foil Calender Foil Calender Foil Example 1 Example 2 Example 3 1 Example 4 1 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Example 12 Example 13 Comparison Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Comparative Example 11 Comparative Example 12 91 s 201132493 As shown in Table 1, the copper foil was subjected to In the case of Examples 1 to 13 which were previously heat-treated, |1 〇χ σ Α丨 $YSa was obtained, and no wrinkles or creases were formed on both surfaces obtained, and the flexibility was also excellent. Further, in the case of adjusting the rolling conditions of the copper foil so that R is 93% by number or more and 98. 〇〇/° or less, and in the case of Examples 12 and 13 of GSS3.08XR-260, even if the heat treatment is not performed,丨1〇χσ a丨,= There are no wrinkles or creases in the CCL obtained on both sides, and the bending property is also excellent. On the other hand, when R is set to be less than 93.0% and the comparative example 3 of the prior heat treatment is not performed, the bendability is lowered. In the case of Comparative Example 4 using electrolytic copper crucible and not subjected to preheat treatment, the flexibility was also lowered. In the case of Comparative Example 5 in which annealing was performed after obtaining GS of GS &gt; 3.08XR-26, and the ratio of the ruler was set to less than %, the flexibility was also lowered. In the case of Comparative Examples 7 to 10 t which were calendered under the condition that R was more than 98.0% and was not subjected to pre-heat treatment, wrinkles or creases were formed in the obtained two-sided CCL by 丨1〇X(Ja|&gt;YSa. In Comparative Examples 11 and 12 in which the amount of the element (Sn or Ag) added to the copper exceeds 4 〇〇 ppm, the bendability is lowered. [Schematic Description] Fig. 1 shows a two-sided copper-clad laminate according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing a configuration example of a double-sided copper-clad laminate. Fig. 3 is a view showing a first copper or steel alloy due to a crucible applied during the manufacture of a double-sided copper clad laminate. A diagram of the state of the wrinkles (creases) of the foil.

17 S 201132493 【主要元件符號說明】 2 樹脂層 2a 樹脂組成物 4 第1銅或銅合金箔 6 第2銅或銅合金箔 8 兩面覆銅積層板 10、11 應用輥機 15 乾燥裝置 20 ' 21 層疊輥 100 皺褶(折痕)17 S 201132493 [Description of main component symbols] 2 Resin layer 2a Resin composition 4 First copper or copper alloy foil 6 Second copper or copper alloy foil 8 Double-sided copper clad laminate 10, 11 Application roller 15 Drying device 20 ' 21 Laminating roll 100 wrinkles (creases)

18 S18 S

Claims (1)

201132493 七、申請專利範圍: 1. 一種銅或鋼合金箔,其用於兩面覆銅積層板,且當σ Α= ( ΕαχΔ LA) /2x1000 時,丨l〇xcr A|$ YSA,彎曲次數為 40萬次以上, 其中’ EA :將該銅或銅合金箔於3501保持30分鐘並 冷卻至室溫後之寬度方向上之楊式模數(單位為GPa ) ; △ LA :自室溫升溫至350它並保持3〇分鐘後冷卻至室溫時該 銅或銅合金羯之寬度方向上之尺寸變化率(單位為ppm,將 收縮設為正值);YSA :拉伸試驗中該銅或銅合金箔之〇.2〇/〇 安全限應力(Proof stress)(單位為]y[Pa); 弯曲次數:使用IPC滑動彎曲試驗機,將箔切成寬度 方向為12.5mm、長度方向為2〇〇mm之帶狀並於350°C加熱 處理0.5小時後加以使用,彎曲半徑於箔厚度為丨8以爪之 情形時設為1.5111111、於猪厚度為12;(/111之情形時設為1111111, 對試驗片負載每分鐘100次之反覆滑動,電阻自初始上升 2 0 %之彎曲次數即終止的次數。 2. 如申叫專利範圍第1項之銅或銅合金箔,其中,該銅 或銅合金箱均為壓延領,最終冷軋加工度R(%)為93 〇% 以上,且最終退火後之平均結晶粒徑Gs( &quot;^^為Gs$3 〇8 xR — 260 〇 3·如申請專利範圍第i項或第2項之銅或鋼合金羯,其 中’ △ LA為I45ppm以下。 4_ 一種兩面覆銅積層板之製造方法,其具有: 第1步驟:係於申請專利笳囹笛,广, 月号不J乾圍第丨至3項中任一項之 201132493 銅或銅合金箔之單面形成樹脂層,而獲得單面覆銅積層 板;及 第2步驟:係於該單面覆銅積層板之該樹脂層側積層 其他之該銅或銅合金箔並進行加熱,而獲得兩面覆銅積層 板。 八、圖式: (如次頁)201132493 VII. Patent application scope: 1. A copper or steel alloy foil used for two-sided copper clad laminates, and when σ Α = ( Εα χ Δ LA) /2x1000, 丨l〇xcr A|$ YSA, the number of bends is More than 400,000 times, where 'EA: the copper or copper alloy foil is held at 3501 for 30 minutes and cooled to room temperature in the width direction of the Young's modulus (in GPa); △ LA: from room temperature to 350 it And maintaining the dimensional change rate in the width direction of the copper or copper alloy crucible after cooling to room temperature for 3 minutes (in ppm, the shrinkage is set to a positive value); YSA: the copper or copper alloy foil in the tensile test 〇.2〇/〇Proof stress (unit: y[Pa); Bending times: using IPC sliding bending tester, the foil is cut into a width direction of 12.5mm and a length direction of 2〇〇mm It is used in a strip shape and heat-treated at 350 ° C for 0.5 hours, and the bending radius is set to 1.5111111 when the foil thickness is 丨8 in the case of the claw, and 1111111 in the case of the pig; (1111111 in the case of /111, The test piece load is repeatedly slipped 100 times per minute, and the resistance is increased by 20% from the initial bending time. The number is the number of terminations. 2. For the copper or copper alloy foil of the first item of the patent scope, the copper or copper alloy box is a rolled collar, and the final cold rolling degree R (%) is 93% or more. And the average crystal grain size Gs after final annealing ( &quot;^^ is Gs$3 〇8 xR - 260 〇3. For example, the copper or steel alloy 羯 of the i or 2 of the patent application scope, where Δ LA is I45ppm or less. 4_ A method for manufacturing a two-sided copper-clad laminate, which has the following steps: Step 1: It is applied for the patented 笳囹 ,, Guang, the monthly number is not the same as the 201132493 copper of any of the three items a single-sided copper-clad laminate is obtained by forming a resin layer on one side of the copper alloy foil; and a second step: laminating and heating the other copper or copper alloy foil on the resin layer side of the single-sided copper-clad laminate And obtain a two-sided copper-clad laminate. Eight, schema: (such as the next page)
TW099136882A 2009-10-30 2010-10-28 Copper or copper alloy foil, and a method of manufacturing both sides of a copper-clad laminate using the copper or copper alloy foil TWI426995B (en)

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