CN101903169B - 金属包覆层积体 - Google Patents

金属包覆层积体 Download PDF

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Publication number
CN101903169B
CN101903169B CN2008801217899A CN200880121789A CN101903169B CN 101903169 B CN101903169 B CN 101903169B CN 2008801217899 A CN2008801217899 A CN 2008801217899A CN 200880121789 A CN200880121789 A CN 200880121789A CN 101903169 B CN101903169 B CN 101903169B
Authority
CN
China
Prior art keywords
polyimide
layer
polyimide layer
laminate
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801217899A
Other languages
English (en)
Chinese (zh)
Other versions
CN101903169A (zh
Inventor
刘鸿
金大年
金哲镐
赵炳旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nex Flexks Co Ltd
Original Assignee
SK Innovation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SK Innovation Co Ltd filed Critical SK Innovation Co Ltd
Publication of CN101903169A publication Critical patent/CN101903169A/zh
Application granted granted Critical
Publication of CN101903169B publication Critical patent/CN101903169B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
CN2008801217899A 2007-12-20 2008-12-08 金属包覆层积体 Expired - Fee Related CN101903169B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070133902A KR101467179B1 (ko) 2007-12-20 2007-12-20 금속박적층체
KR10-2007-0133902 2007-12-20
PCT/KR2008/007242 WO2009082101A2 (en) 2007-12-20 2008-12-08 Metal-clad laminate

Publications (2)

Publication Number Publication Date
CN101903169A CN101903169A (zh) 2010-12-01
CN101903169B true CN101903169B (zh) 2013-09-04

Family

ID=40801656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801217899A Expired - Fee Related CN101903169B (zh) 2007-12-20 2008-12-08 金属包覆层积体

Country Status (6)

Country Link
US (1) US8318315B2 (enExample)
JP (1) JP5425093B2 (enExample)
KR (1) KR101467179B1 (enExample)
CN (1) CN101903169B (enExample)
TW (1) TWI474921B (enExample)
WO (1) WO2009082101A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487730B (zh) * 2009-04-14 2015-06-11 Ube Industries 金屬化用聚醯亞胺膜及其製造方法與金屬疊層聚醯亞胺膜
KR101437612B1 (ko) * 2010-12-20 2014-09-15 에스케이이노베이션 주식회사 후막 폴리이미드 연성금속적층판의 제조방법
KR101514221B1 (ko) * 2011-12-07 2015-04-23 에스케이이노베이션 주식회사 다층 폴리이미드 구조의 연성금속적층판 제조방법
WO2013100627A1 (ko) * 2011-12-28 2013-07-04 에스케이이노베이션 주식회사 연성금속박적층체 및 이의 제조방법
CN104066574B (zh) * 2011-12-28 2016-08-24 Sk新技术株式会社 柔性金属箔层叠体及其制造方法
KR102038137B1 (ko) * 2012-12-21 2019-10-30 주식회사 넥스플렉스 다층 연성금속박 적층체 및 이의 제조방법
DE102016012554B4 (de) * 2016-10-20 2021-09-23 Martin Huber Patent UG (haftungsbeschränkt) Wärmemotor mit mehreren Doppelschichtbauteilen
JP6891564B2 (ja) * 2017-03-16 2021-06-18 コニカミノルタ株式会社 透明耐熱性積層フィルム、透明フレキシブルプリント基板、透明電極基板、照明装置及び有機エレクトロルミネッセンス表示装置
CN109517171B (zh) * 2017-09-19 2021-06-01 臻鼎科技股份有限公司 低介电聚酰亚胺用树脂组合物、聚酰亚胺、聚酰亚胺膜及覆铜板
TWI665260B (zh) * 2017-09-19 2019-07-11 臻鼎科技股份有限公司 低介電聚醯亞胺組合物、聚醯亞胺、聚醯亞胺膜及覆銅板
JP7375318B2 (ja) * 2018-05-16 2023-11-08 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス
US12060456B2 (en) 2019-02-01 2024-08-13 Lg Chem, Ltd. Polyimide precursor composition and polyimide film, substrate for display device, and optical device prepared by using same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847353A (en) * 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US5262227A (en) * 1990-05-30 1993-11-16 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
CN1929994A (zh) * 2004-03-04 2007-03-14 东丽株式会社 耐热性树脂叠层膜与含其的覆金属层的叠层膜以及半导体器件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
JP4544588B2 (ja) * 2005-03-14 2010-09-15 株式会社エー・エム・ティー・研究所 積層体
JP2007118477A (ja) * 2005-10-31 2007-05-17 Toray Ind Inc 両面金属箔積層板およびその製造方法
TWI348967B (en) * 2006-03-06 2011-09-21 Lg Chemical Ltd Metallic laminate and method for preparing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847353A (en) * 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US5262227A (en) * 1990-05-30 1993-11-16 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
CN1929994A (zh) * 2004-03-04 2007-03-14 东丽株式会社 耐热性树脂叠层膜与含其的覆金属层的叠层膜以及半导体器件

Also Published As

Publication number Publication date
WO2009082101A3 (en) 2009-08-13
JP5425093B2 (ja) 2014-02-26
WO2009082101A2 (en) 2009-07-02
US20100255324A1 (en) 2010-10-07
TW200930565A (en) 2009-07-16
JP2011508685A (ja) 2011-03-17
CN101903169A (zh) 2010-12-01
KR20090066399A (ko) 2009-06-24
TWI474921B (zh) 2015-03-01
US8318315B2 (en) 2012-11-27
KR101467179B1 (ko) 2014-12-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Seoul, Korea

Applicant after: SK INNOVATION Co.,Ltd.

Address before: Seoul, Korea

Applicant before: SK Corp.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: SK CORP. TO: SK ENERGY CO., LTD.

C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20181130

Address after: Seoul, Korea

Patentee after: Nex Flexks Co., Ltd.

Address before: Seoul, Korea

Patentee before: SK INNOVATION Co.,Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130904

Termination date: 20191208

CF01 Termination of patent right due to non-payment of annual fee