JP2011258886A - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
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- JP2011258886A JP2011258886A JP2010134250A JP2010134250A JP2011258886A JP 2011258886 A JP2011258886 A JP 2011258886A JP 2010134250 A JP2010134250 A JP 2010134250A JP 2010134250 A JP2010134250 A JP 2010134250A JP 2011258886 A JP2011258886 A JP 2011258886A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【解決手段】 導電性仕切り33は、部品搭載面32に個片の導電性チップ34が複数個搭載されることにより、構成されている。回路基板31のサイズや第1、第2のブロック内の電子部品の配置に合わせて、導電性チップ34の搭載位置と、搭載個数を変えて、導電性仕切り33の形状を自由に変更できる。このような導電性仕切り33により、部品搭載面32は、第1のブロック35と、第2のブロック36とに分離され、ブロック間の電磁干渉が阻止されている。
【選択図】 図1
Description
さらに、導電性チップは、樹脂で成形された成形体の表面に導電性材料が形成されてなることが好ましい。
(第1の実施形態)
本発明の第1の実施形態に係る回路モジュール30の構成について図1、図2、図3、図4(A)〜(C)、図5に示す。
本発明の第2の実施形態に係る回路モジュールの断面図を図5に示す。回路モジュール60は、シールド導電層がシールドケース61で構成されている。その他の構成は、本発明の第1の実施形態と同じであるため、同一の符号を付して、詳細な説明は省略する。
(第3の実施形態)
本発明の第3の実施形態に係る回路モジュールの断面図を図6(a)に示す。回路モジュール70は本発明の第1の実施形態と比較して、回路基板内に面内グランド電極71が形成されている点で異なる。その他の構成は本発明の第1の実施形態と同じであるため、同じ符号を付して詳細な説明は省略する。
11、31 回路基板
13〜17 電子部品
18、33 導電性仕切り
19,39 絶縁樹脂層
20、21、35、36 ブロック
32 部品搭載面
34 導電性チップ
37 グランド電極
38 配線パターン
40 シールド導電層
51 基体
51a〜c 第1、第2、第3の構成部
52 支持部
53 吸着部
54 貫通部
55 開口部
56 主面
57、58 辺
61 シールドケース
71 面内グランド電極
Claims (9)
- 複数の電子部品が搭載された回路基板と、前記複数の電子部品とともに前記回路基板上に搭載され、前記複数の電子部品を所望のブロックに分離する導電性仕切りとを有する回路モジュールにおいて、
前記導電性仕切りは複数の導電性チップが配置されることにより形成されることを特徴とする回路モジュール。 - 前記回路基板は、面内配線電極が形成された複数の絶縁体層と、前記絶縁体層を貫通して形成されるビア電極とを含み、
前記導電性チップは前記面内配線電極および前記ビア電極を介して、グランド電極に接続されていることを特徴とする請求項1に記載の回路モジュール。 - 前記電子部品を覆うように、前記回路基板上に絶縁樹脂層が形成され、前記絶縁樹脂層を覆うようにシールド導電層が形成され、
前記導電性チップはその一部分が前記絶縁樹脂層から露呈し、前記シールド導電層と接続されていることを特徴とする請求項1または請求項2のうちいずれか一項に記載の回路モジュール。 - 前記電子部品を覆うように、前記回路基板上にシールドケースが形成され、前記導電性チップが前記シールドケースと接続されていることを特徴とする請求項1または請求項2のいずれか一項に記載の回路モジュール
- 前記複数の絶縁体層の内、少なくとも一層はほぼ全面に面内グランド電極が形成され、前記面内グランド電極は前記面内配線パターンおよび前記ビア電極を介して、グランド電極と接続されていることを特徴とする請求項2から請求項4のうちいずれか一項に記載の回路モジュール。
- 前記シールド導電層、前記シールドケースと前記面内グランド電極とが前記回路基板の側面で接続されていることを特徴とする請求項5に記載の回路モジュール。
- 前記複数の導電性チップが隙間を空けて配置されることにより前記導電性仕切りが形成され、前記隙間の距離が、前記回路モジュールの動作信号の4分の1の波長以下であることを特徴とする請求項1〜6のいずれか一項に記載の回路モジュール。
- 前記導電性チップは、樹脂で成形された成形体の表面に導電性材料が形成されてなることを特徴とする請求項1〜7いずれか一項に記載の回路モジュール。
- 前記複数の導電性チップは、前記回路基板の部品搭載面と垂直な方向に延びる基体と、前記基体を前記部品搭載面と平行な方向に貫通する貫通部と、
前記基体から前記部品搭載面と平行方向に延びて、少なくとも一部分で前記回路基板と接して、前記基体を前記回路基板上に固定する支持部と、
前記基体の前記回路基板とは反対側に位置する面に設けられ、前記基体が吸着されるための吸着部と、
を備えていることを特徴とする請求項1〜請求項8いずれか一項に記載の回路モジュール
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010134250A JP5229276B2 (ja) | 2010-06-11 | 2010-06-11 | 回路モジュール |
US13/156,496 US8897028B2 (en) | 2010-06-11 | 2011-06-09 | Circuit module |
CN201110168272.9A CN102281707B (zh) | 2010-06-11 | 2011-06-10 | 电路模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010134250A JP5229276B2 (ja) | 2010-06-11 | 2010-06-11 | 回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011258886A true JP2011258886A (ja) | 2011-12-22 |
JP5229276B2 JP5229276B2 (ja) | 2013-07-03 |
Family
ID=45096086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010134250A Active JP5229276B2 (ja) | 2010-06-11 | 2010-06-11 | 回路モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US8897028B2 (ja) |
JP (1) | JP5229276B2 (ja) |
CN (1) | CN102281707B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247339A (ja) * | 2012-05-29 | 2013-12-09 | Tdk Corp | 電子部品モジュールの製造方法 |
JP2014099553A (ja) * | 2012-11-15 | 2014-05-29 | Honda Motor Co Ltd | 筐体を介して接地される制御装置 |
WO2017179586A1 (ja) * | 2016-04-15 | 2017-10-19 | 株式会社村田製作所 | 表面実装型シールド部材及び回路モジュール |
JP2018032656A (ja) * | 2016-08-22 | 2018-03-01 | 沖電気工業株式会社 | シールドケース |
WO2019026557A1 (ja) * | 2017-08-02 | 2019-02-07 | アルプス電気株式会社 | 回路モジュール |
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US8199518B1 (en) | 2010-02-18 | 2012-06-12 | Amkor Technology, Inc. | Top feature package and method |
US8362612B1 (en) | 2010-03-19 | 2013-01-29 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US9312817B2 (en) | 2012-07-20 | 2016-04-12 | Freescale Semiconductor, Inc. | Semiconductor package design providing reduced electromagnetic coupling between circuit components |
US9240390B2 (en) | 2013-06-27 | 2016-01-19 | Freescale Semiconductor, Inc. | Semiconductor packages having wire bond wall to reduce coupling |
US9401342B2 (en) * | 2013-06-27 | 2016-07-26 | Freescale Semiconductor, Inc. | Semiconductor package having wire bond wall to reduce coupling |
TWI527166B (zh) * | 2013-07-25 | 2016-03-21 | The package structure of the optical module | |
WO2016092695A1 (ja) * | 2014-12-12 | 2016-06-16 | 株式会社メイコー | モールド回路モジュール及びその製造方法 |
KR102350499B1 (ko) * | 2015-02-17 | 2022-01-14 | 삼성전자주식회사 | 전자장치용 전자기 쉴드 구조 |
JP2017162989A (ja) * | 2016-03-09 | 2017-09-14 | イビデン株式会社 | 電子部品内蔵基板およびその製造方法 |
US10546819B2 (en) * | 2016-09-15 | 2020-01-28 | Toshiba Memory Corporation | Semiconductor device and method of manufacturing the same |
JP6817858B2 (ja) * | 2017-03-17 | 2021-01-20 | 日本電波工業株式会社 | 表面実装型デバイス及びその製造方法 |
US10177095B2 (en) | 2017-03-24 | 2019-01-08 | Amkor Technology, Inc. | Semiconductor device and method of manufacturing thereof |
JP7028254B2 (ja) * | 2017-11-20 | 2022-03-02 | 株式会社村田製作所 | 高周波モジュール |
JP7111112B2 (ja) * | 2018-01-05 | 2022-08-02 | 株式会社村田製作所 | 高周波モジュール |
KR102659093B1 (ko) * | 2018-03-08 | 2024-04-22 | 삼성전자주식회사 | 배선을 전기적으로 연결하는 도전성 구조물을 포함하는 회로 기판 및 이를 포함하는 전자 장치 |
KR20200001102A (ko) * | 2018-06-26 | 2020-01-06 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
CN113380762B (zh) * | 2021-06-04 | 2022-08-30 | 长江存储科技有限责任公司 | 芯片封装结构及其制造方法 |
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2011
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- 2011-06-10 CN CN201110168272.9A patent/CN102281707B/zh active Active
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247339A (ja) * | 2012-05-29 | 2013-12-09 | Tdk Corp | 電子部品モジュールの製造方法 |
JP2014099553A (ja) * | 2012-11-15 | 2014-05-29 | Honda Motor Co Ltd | 筐体を介して接地される制御装置 |
WO2017179586A1 (ja) * | 2016-04-15 | 2017-10-19 | 株式会社村田製作所 | 表面実装型シールド部材及び回路モジュール |
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WO2019026557A1 (ja) * | 2017-08-02 | 2019-02-07 | アルプス電気株式会社 | 回路モジュール |
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CN102281707A (zh) | 2011-12-14 |
JP5229276B2 (ja) | 2013-07-03 |
US20110304993A1 (en) | 2011-12-15 |
CN102281707B (zh) | 2014-11-19 |
US8897028B2 (en) | 2014-11-25 |
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