JP2011238928A - チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 - Google Patents

チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 Download PDF

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Publication number
JP2011238928A
JP2011238928A JP2011104442A JP2011104442A JP2011238928A JP 2011238928 A JP2011238928 A JP 2011238928A JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011238928 A JP2011238928 A JP 2011238928A
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Japan
Prior art keywords
terminal
chip package
light emitting
chip
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011104442A
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English (en)
Japanese (ja)
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JP2011238928A5 (enExample
Inventor
Yong Jin Lee
永 鎭 李
Jeong-Wook Lee
庭 旭 李
Hiromi Bun
敬 美 文
Young Hee Song
永 僖 宋
Ll Heung Choi
一 興 崔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung LED Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung LED Co Ltd filed Critical Samsung LED Co Ltd
Publication of JP2011238928A publication Critical patent/JP2011238928A/ja
Publication of JP2011238928A5 publication Critical patent/JP2011238928A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2011104442A 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 Pending JP2011238928A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0043171 2010-05-07
KR1020100043171A KR101662038B1 (ko) 2010-05-07 2010-05-07 칩 패키지

Publications (2)

Publication Number Publication Date
JP2011238928A true JP2011238928A (ja) 2011-11-24
JP2011238928A5 JP2011238928A5 (enExample) 2014-06-26

Family

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Family Applications (1)

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JP2011104442A Pending JP2011238928A (ja) 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置

Country Status (6)

Country Link
US (1) US8455889B2 (enExample)
EP (1) EP2385549B1 (enExample)
JP (1) JP2011238928A (enExample)
KR (1) KR101662038B1 (enExample)
CN (1) CN102237485B (enExample)
TW (1) TWI596727B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
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JP2014036225A (ja) * 2012-08-08 2014-02-24 Samsung Display Co Ltd バックライトアセンブリー及びこれを有する表示装置
US9343643B2 (en) 2013-04-12 2016-05-17 Nichia Corporation Light emitting device
JP2016146480A (ja) * 2015-02-04 2016-08-12 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Ｌｅｄパッケージング構造及びその製造方法
JP2017004685A (ja) * 2015-06-08 2017-01-05 ウシオ電機株式会社 光源装置
WO2018168473A1 (ja) * 2017-03-15 2018-09-20 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール

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CN102446909B (zh) * 2010-09-30 2015-03-11 赛恩倍吉科技顾问（深圳）有限公司 发光二极管组合
US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
US8853726B2 (en) * 2011-08-25 2014-10-07 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
DE102011056708A1 (de) 2011-12-20 2013-06-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil
CN104937326B (zh) 2013-01-25 2018-10-26 亮锐控股有限公司 照明组件和用于制造照明组件的方法
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架
CN104103748B (zh) * 2013-04-10 2016-12-07 重庆市路迪机械厂 发光二极管封装结构及其制造方法
CN103208717B (zh) * 2013-04-10 2015-08-05 大族激光科技产业集团股份有限公司 半导体单芯管的转接装置
CN103354266B (zh) * 2013-07-11 2015-12-23 江阴长电先进封装有限公司 一种薄型圆片级led的封装结构及其封装方法
US9166131B2 (en) * 2013-07-17 2015-10-20 Tai-Yin Huang Composite LED package and its application to light tubes
DE102014110614A1 (de) * 2014-07-28 2016-01-28 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
CN104779335B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
CN104752587B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
TWI587548B (zh) * 2015-09-07 2017-06-11 隆達電子股份有限公司 發光二極體封裝件
KR102261288B1 (ko) 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
DE102018124471B3 (de) * 2018-10-04 2019-12-05 Ledvance Gmbh Verfahren zum Herstellen eines Leadframes für eine Röhrenlampe, Leadframe und Röhrenlampe
CN111744026B (zh) * 2019-03-29 2023-08-18 东芝照明技术株式会社 紫外线放射装置以及照明装置
DE102020107409B4 (de) 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement

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JPS61195076U (enExample) * 1985-05-27 1986-12-04
JPH0715045A (ja) * 1992-05-11 1995-01-17 Susumu Kurokawa 面発光照明装置
JP2000183406A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Works Ltd 発光ダイオード
JP2007059674A (ja) * 2005-08-25 2007-03-08 Japan Aviation Electronics Industry Ltd 発光素子実装型電気コネクタ及びそれを用いた発光素子モジュール
JP2007311786A (ja) * 2006-05-18 2007-11-29 Samsung Electro Mech Co Ltd 発光素子パッケージ及び発光素子パッケージアレイ
JP2010007750A (ja) * 2008-06-26 2010-01-14 Univance Corp 油圧式動力伝達装置
US20100072507A1 (en) * 2008-09-25 2010-03-25 Huang Shih-Chung Lead frame, and light emitting diode module having the same
JP2011146611A (ja) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd 発光素子パッケージ、及びこれを用いた線状発光装置、面状発光装置

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JP3851174B2 (ja) * 2001-01-25 2006-11-29 松下電器産業株式会社 発光ユニット、発光ユニット組合せ体、および照明装置
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JPH0715045A (ja) * 1992-05-11 1995-01-17 Susumu Kurokawa 面発光照明装置
JP2000183406A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Works Ltd 発光ダイオード
JP2007059674A (ja) * 2005-08-25 2007-03-08 Japan Aviation Electronics Industry Ltd 発光素子実装型電気コネクタ及びそれを用いた発光素子モジュール
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JP2010007750A (ja) * 2008-06-26 2010-01-14 Univance Corp 油圧式動力伝達装置
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036225A (ja) * 2012-08-08 2014-02-24 Samsung Display Co Ltd バックライトアセンブリー及びこれを有する表示装置
US9343643B2 (en) 2013-04-12 2016-05-17 Nichia Corporation Light emitting device
US9484503B2 (en) 2013-04-12 2016-11-01 Nichia Corporation Light emitting device
JP2016146480A (ja) * 2015-02-04 2016-08-12 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Ｌｅｄパッケージング構造及びその製造方法
JP2017004685A (ja) * 2015-06-08 2017-01-05 ウシオ電機株式会社 光源装置
WO2018168473A1 (ja) * 2017-03-15 2018-09-20 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
JP2018152536A (ja) * 2017-03-15 2018-09-27 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
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Also Published As

Publication number Publication date
KR101662038B1 (ko) 2016-10-05
TW201208025A (en) 2012-02-16
EP2385549A2 (en) 2011-11-09
KR20110123606A (ko) 2011-11-15
TWI596727B (zh) 2017-08-21
US8455889B2 (en) 2013-06-04
CN102237485A (zh) 2011-11-09
EP2385549A3 (en) 2013-10-09
EP2385549B1 (en) 2016-08-17
US20110272716A1 (en) 2011-11-10
CN102237485B (zh) 2015-11-18

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