CN102237485B - 引线框架、芯片封装、封装模块以及照明装置 - Google Patents

引线框架、芯片封装、封装模块以及照明装置 Download PDF

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Publication number
CN102237485B
CN102237485B CN201110117456.2A CN201110117456A CN102237485B CN 102237485 B CN102237485 B CN 102237485B CN 201110117456 A CN201110117456 A CN 201110117456A CN 102237485 B CN102237485 B CN 102237485B
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China
Prior art keywords
terminal
chip
coupling
package
emitting device
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CN201110117456.2A
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English (en)
Chinese (zh)
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CN102237485A (zh
Inventor
李永镇
李庭旭
文敬美
宋永僖
崔一兴
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of CN102237485A publication Critical patent/CN102237485A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201110117456.2A 2010-05-07 2011-05-09 引线框架、芯片封装、封装模块以及照明装置 Active CN102237485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0043171 2010-05-07
KR1020100043171A KR101662038B1 (ko) 2010-05-07 2010-05-07 칩 패키지

Publications (2)

Publication Number Publication Date
CN102237485A CN102237485A (zh) 2011-11-09
CN102237485B true CN102237485B (zh) 2015-11-18

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CN201110117456.2A Active CN102237485B (zh) 2010-05-07 2011-05-09 引线框架、芯片封装、封装模块以及照明装置

Country Status (6)

Country Link
US (1) US8455889B2 (enExample)
EP (1) EP2385549B1 (enExample)
JP (1) JP2011238928A (enExample)
KR (1) KR101662038B1 (enExample)
CN (1) CN102237485B (enExample)
TW (1) TWI596727B (enExample)

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US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
US8853726B2 (en) * 2011-08-25 2014-10-07 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
DE102011056708A1 (de) 2011-12-20 2013-06-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil
KR20140020446A (ko) * 2012-08-08 2014-02-19 삼성디스플레이 주식회사 백라이트 어셈블리 및 이를 갖는 표시 장치
CN104937326B (zh) 2013-01-25 2018-10-26 亮锐控股有限公司 照明组件和用于制造照明组件的方法
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架
CN104103748B (zh) * 2013-04-10 2016-12-07 重庆市路迪机械厂 发光二极管封装结构及其制造方法
CN103208717B (zh) * 2013-04-10 2015-08-05 大族激光科技产业集团股份有限公司 半导体单芯管的转接装置
JP6303738B2 (ja) 2013-04-12 2018-04-04 日亜化学工業株式会社 発光装置
CN103354266B (zh) * 2013-07-11 2015-12-23 江阴长电先进封装有限公司 一种薄型圆片级led的封装结构及其封装方法
US9166131B2 (en) * 2013-07-17 2015-10-20 Tai-Yin Huang Composite LED package and its application to light tubes
DE102014110614A1 (de) * 2014-07-28 2016-01-28 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
TWI649900B (zh) * 2015-02-04 2019-02-01 億光電子工業股份有限公司 Ｌｅｄ封裝結構及其製造方法
CN104779335B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
CN104752587B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
JP6592974B2 (ja) * 2015-06-08 2019-10-23 ウシオ電機株式会社 光源装置
TWI587548B (zh) * 2015-09-07 2017-06-11 隆達電子股份有限公司 發光二極體封裝件
KR102261288B1 (ko) 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
JP6823262B2 (ja) 2017-03-15 2021-02-03 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
DE102018124471B3 (de) * 2018-10-04 2019-12-05 Ledvance Gmbh Verfahren zum Herstellen eines Leadframes für eine Röhrenlampe, Leadframe und Röhrenlampe
CN111744026B (zh) * 2019-03-29 2023-08-18 东芝照明技术株式会社 紫外线放射装置以及照明装置
DE102020107409B4 (de) 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement

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Also Published As

Publication number Publication date
KR101662038B1 (ko) 2016-10-05
TW201208025A (en) 2012-02-16
EP2385549A2 (en) 2011-11-09
JP2011238928A (ja) 2011-11-24
KR20110123606A (ko) 2011-11-15
TWI596727B (zh) 2017-08-21
US8455889B2 (en) 2013-06-04
CN102237485A (zh) 2011-11-09
EP2385549A3 (en) 2013-10-09
EP2385549B1 (en) 2016-08-17
US20110272716A1 (en) 2011-11-10

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Address after: Gyeonggi Do, South Korea

Applicant after: Samsung Electronics Co., Ltd.

Address before: Gyeonggi Do, South Korea

Applicant before: Samsung LED Co., Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: SAMSUNG LED CO., LTD. TO: SAMSUNG ELECTRONICS CO., LTD.

C10 Entry into substantive examination
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GR01 Patent grant